Abstract: A printed circuit board including: a first insulation layer; a second insulation layer stacked over the first insulation layer; a circuit pattern and a via land buried in the second insulation layer; and a via penetrating the first insulation layer and integrated with the via land, the via made of a conductive material.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include a first insulation layer, a second insulation layer stacked over the first insulation layer, a circuit pattern and a via land buried in the second insulation layer, and a via made of a conductive material penetrating the first insulation layer and integrated with the via land. The circuit pattern and via land can be buried in the insulation material, and the circuit pattern, via land, and via can be formed simultaneously as an integrated structure. Thus, the electrical reliability between the wiring pattern and the via can be increased, the heat-releasing effect of the via can be improved, and the procedure for forming the circuit patterns, via lands, and vias can be simplified, allowing greater productivity in manufacturing the substrate.

Abstract: In wireless devices for transmitting/receiving at least one of broadcasting, communication and controlling, a wireless network protocol transmits repeatedly data structure with a certain period in a unit of the same cycle, and maintains synchronization of the devices in a unit of the same cycle. As a result, a frequency hopping is performed in a unit of a cycle. Here, length of the cycle is set to below 20 msec so that a buffer used for transmitting/receiving a broadcasting signal and a voice/data communication has length of below 20 msec. Cycles form a network cycle. Control frames included in the cycles in the network cycle are differently assigned in accordance with their use, and so the control frames may be used for various controls. A payload frame in the cycle used by a user may be set freely in the range of length of the cycle.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include a first insulation layer, a second insulation layer stacked over the first insulation layer, a circuit pattern and a via land buried in the second insulation layer, and a via made of a conductive material penetrating the first insulation layer and integrated with the via land. The circuit pattern and via land can be buried in the insulation material, and the circuit pattern, via land, and via can be formed simultaneously as an integrated structure. Thus, the electrical reliability between the wiring pattern and the via can be increased, the heat-releasing effect of the via can be improved, and the procedure for forming the circuit patterns, via lands, and vias can be simplified, allowing greater productivity in manufacturing the substrate.