Patents by Inventor Jae-Hyun Jung

Jae-Hyun Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136664
    Abstract: A battery includes an electrode assembly including a first electrode, a second electrode and a separator between the first electrode and the second electrode, the first electrode, the second electrode and the separator being wound around a winding axis to define a core and an outer peripheral surface. The first electrode and the second electrode include a first uncoated region and a second uncoated region along a winding direction, respectively, and an active material layer coating is absent in the first uncoated region and the second uncoated region. The battery further includes a housing receiving the electrode assembly through an opening formed at a bottom, a first current collector coupled to the first uncoated region and disposed within the housing, a cap covering the opening, a spacer interposed between the cap and the electrode assembly to fix the electrode assembly and seal the housing, and a terminal electrically connected to the second uncoated region.
    Type: Application
    Filed: February 18, 2022
    Publication date: April 25, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Min-Ki JO, Bo-Hyun KANG, Do-Gyun KIM, Su-Ji CHOI, Kwang-Su HWANGBO, Hae-Jin LIM, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG, Geon-Woo MIN, Jae-Woong KIM
  • Publication number: 20240136175
    Abstract: The present invention relates to an auxiliary precursor, a thin film precursor composition, a method of forming a thin film using the thin film precursor composition, and a semiconductor substrate fabricated using the method. The present invention provides the thin film precursor composition including a thin film precursor compound and a compound having a predetermined structure that exhibits reaction stability as the auxiliary precursor. By using the thin film precursor composition in a thin film deposition process, side reactions may be suppressed, and thin film growth rate may be appropriately controlled. In addition, since process by-products are removed from a thin film, even when a thin film is formed on a substrate having a complicated structure, step coverage and the thickness uniformity and resistivity characteristics of the thin film may be greatly improved.
    Type: Application
    Filed: February 22, 2022
    Publication date: April 25, 2024
    Inventors: Jae Sun JUNG, Chang Bong YEON, Seung Hyun LEE, Ji Hyun NAM, Sung Woo CHO
  • Publication number: 20240136674
    Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.
    Type: Application
    Filed: January 19, 2022
    Publication date: April 25, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Jong-Sik PARK, Jae-Won LIM, Yu-Sung CHOE, Hak-Kyun KIM, Je-Jun LEE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Pil-Kyu PARK, Kwang-Su HWANGBO, Do-Gyun KIM, Geon-Woo MIN, Hae-Jin LIM, Min-Ki JO, Su-Ji CHOI, Bo-Hyun KANG, Jae-Woong KIM, Ji-Min JUNG, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI
  • Publication number: 20240128608
    Abstract: A battery includes an electrode assembly including a first uncoated region and a second uncoated region; a battery housing accommodating the electrode assembly and electrically connected to the second uncoated region; a cap to cover an open portion on bottom of the battery housing; a first electrode terminal passing through a partially closed portion of the battery housing and being electrically isolated from the battery housing; and a first current collector coupled to the first uncoated region and connected to the first electrode terminal.
    Type: Application
    Filed: February 18, 2022
    Publication date: April 18, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Bo-Hyun KANG, Do-Gyun KIM, Geon-Woo MIN, Min-Ki JO, Su-Ji CHOI, Kwang-Su HWANGBO, Jae-Woong KIM, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG
  • Publication number: 20240128136
    Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.
    Type: Application
    Filed: February 16, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK
  • Publication number: 20240128590
    Abstract: A battery includes an electrode assembly including a first electrode, a second electrode and a separator between the first electrode and the second electrode wound around a winding axis to define a core and an outer circumferential surface, the first electrode including a first uncoated region in which an active material layer is not coated along a winding direction; a housing accommodating the electrode assembly through an open portion at a lower end thereof; a first current collector coupled to the first uncoated region and disposed in the housing; a cap to cover the open portion; and a spacer between the first current collector and the cap and having a height corresponding to a distance between the first current collector and the cap.
    Type: Application
    Filed: February 18, 2022
    Publication date: April 18, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Geon-Woo MIN, Hae-Jin LIM, Do-Gyun KIM, Kwang-Su HWANGBO, Min-Ki JO, Bo-Hyun KANG, Su-Ji CHOI, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG
  • Publication number: 20240128517
    Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.
    Type: Application
    Filed: January 19, 2022
    Publication date: April 18, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Hae-Jin LIM, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI, Do-Gyun KIM, Su-Ji CHOI, Kwang-Su HWANGBO, Geon-Woo MIN, Min-Ki JO, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG, Jae-Woong KIM, Jong-Sik PARK, Yu-Sung CHOE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Bo-Hyun KANG, Pil-Kyu PARK
  • Publication number: 20240123548
    Abstract: Embodiments relate to laser welding methods, monitoring methods, and monitoring systems for a secondary battery. A laser welding method for a secondary battery includes performing laser welding on a positive electrode base having a thin-film shape in which a plurality of positive electrode base tabs are formed at a side, a negative electrode base having a thin-film shape in which a plurality of negative electrode base tabs are formed at a side, and a thin-film multi-tab to be joined to each of the positive electrode base and the negative electrode base, a welded portion in which the multi-tab is welded with the positive electrode base and the negative electrode base being melting-joined by using a laser such that a plurality of welding spots is formed on the welded portion.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 18, 2024
    Inventors: Jae Hoon ROH, Sang Hyun RYU, Myung Jun PARK, Seong Bae AN, Yong Gyu AN, Hee Dong JUNG, Jin Gyu HEO
  • Patent number: 11958427
    Abstract: An airbag system includes a seat belt; at least one airbag disposed in at least a portion of the seat belt; and an inflator connected to the at least one airbag and supplying gas to the airbag so that the airbag is inflatable.
    Type: Grant
    Filed: November 14, 2022
    Date of Patent: April 16, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Jae Wung Jung, Dong Hyun Ha, Jung Hun Choi
  • Patent number: 11961571
    Abstract: Provided herein are a semiconductor memory device and a method of operating the same. The semiconductor memory device may include a memory cell array, a peripheral circuit, and a control logic. The memory cell array may include a plurality of memory cells. The peripheral circuit may perform a program operation on selected memory cells coupled to a selected word line among the plurality of memory cells. The control logic may control the program operation of the peripheral circuit. The program operation may include a plurality of program loops. Each of the program loops may include a program phase and a verify phase. The verify phase may include one or more verify operations. The control logic may be further configured to count a number of the verify operations performed by the peripheral circuit in the verify phase included in one of the plurality of program loops during the program operation.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: April 16, 2024
    Assignee: SK hynix Inc.
    Inventors: Jae Yeop Jung, Sung Hyun Hwang
  • Patent number: 11959762
    Abstract: A vehicle includes a user interface; and a controller configured to determine a predicted place where an image is predicted to have been captured according to an output of a place prediction neural network for the image selected by a user, and control the user interface to perform a route guide to the predicted place, wherein the place prediction neural network is learned from an image tagged with place information.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: April 16, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Jae Wung Jung, Dong Hyun Ha, Jung Hun Choi
  • Patent number: 11947089
    Abstract: An optical imaging system includes a first lens having an image-side surface that is concave; a second lens having a refractive power; a third lens having an object-side surface that is convex; a fourth lens having an image-side surface that is concave; a fifth lens having a refractive power; and a sixth lens having a refractive power and an image-side surface having an inflection point, wherein the first lens through the sixth lens are sequentially disposed in numerical order from an object side of the optical imaging system toward an imaging plane of the optical imaging system, and the optical imaging system satisfies TL/(2Y)?1.01 and 1.2?tan ?, where TL is a distance from an object-side surface of the first lens to the imaging plane, 2Y is a diagonal length of the imaging plane, and ? is half a field of view of the optical imaging system.
    Type: Grant
    Filed: March 6, 2023
    Date of Patent: April 2, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Youn Lee, Jae Hyun Baik, Yong Joo Jo, Phil Ho Jung
  • Publication number: 20240096904
    Abstract: A chip-on-film package includes: a lower base film including a first surface and a second surface, which are opposite to each other; an upper base film including a third surface and a fourth surface, which are opposite to each other, and is disposed on the lower base film; a first semiconductor chip mounted on the second surface of the lower base film; a second semiconductor chip mounted on the third surface of the upper base film; and an interposer film interposed between the lower and upper base films, wherein the second and third surfaces face each other.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 21, 2024
    Inventors: Jae-Min JUNG, Seung Hyun CHO
  • Publication number: 20240088326
    Abstract: A light device including a substrate, and first and second light emitters spaced apart from each other, and a power source to control the first light emitter and the second light emitter, in which the first and second light emitters include a light emitting region, a wavelength conversion layer disposed on the light emitting region, and a lateral reflection layer covering a region of a side of the light emitting region and the wavelength conversion layer, the first light emitter and the second light emitter are configured to output the same or different magnitudes of power by receiving the same or different magnitudes of current, the first and second light emitters are respectively configured to emit first light and second light, the first light emitter is electrically connected to the second light emitter through a common electrode.
    Type: Application
    Filed: October 30, 2023
    Publication date: March 14, 2024
    Inventors: Bang Hyun KIM, Young-Hye Seo, Jae Ho Lee, Jong Min Lee, Seoung Ho Jung, Eui Sung Jeong
  • Patent number: 11929126
    Abstract: A memory device, and a method of operating the memory device, includes a memory block in which a plurality of cell pages are coupled to each of word lines. The memory device also includes a peripheral circuit configured to adjust a time point at which a verify voltage is applied to a selected word line among the word lines according to an order of performing a program operation during a verify operation of a selected cell page. The memory device further includes a control logic circuit configured to transmit, to the peripheral circuit, an operation code for adjusting a time point at which the verify voltage is output.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: March 12, 2024
    Assignee: SK hynix Inc.
    Inventors: Sung Hyun Hwang, Jae Yeop Jung, Se Chun Park
  • Patent number: 11930640
    Abstract: The semiconductor device includes a substrate having a cell area and a via area; a transistor and a logic interconnection disposed over the substrate; a lower insulating layer covering the transistor and the logic interconnection; a lower conductive layer on the lower insulating layer in the cell area; a support pattern disposed on the lower insulating layer in the via area; a lower via plug having a side surface in contact with the support pattern and a bottom surface in contact with the logic interconnection; a word line stack disposed on the lower conductive layer in the cell area; an dielectric layer stack disposed on the support pattern in the via area; a vertical channel pillar penetrating the word line stack to be connected to the lower conductive layer; and an upper via plug penetrating the dielectric layer stack to be vertically aligned with the lower via plug.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: March 12, 2024
    Assignee: SK hynix Inc.
    Inventors: Go Hyun Lee, Jae Taek Kim, Hye Yeong Jung
  • Publication number: 20240079311
    Abstract: A semiconductor package includes a film substrate; a wiring layer provided on the film substrate; and a semiconductor chip provided on the wiring layer and electrically connected to the wiring layer. The film substrate includes a first layer, wherein the first layer is an insulating layer having the wiring layer thereon. The film substrate further includes a second layer, wherein the second layer is attached to a bottom of the first layer and comprises a gas. The second layer is configured to be peeled off of the first layer.
    Type: Application
    Filed: August 1, 2023
    Publication date: March 7, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Hyun CHO, Jeong-Kyu Ha, Jae-Min Jung
  • Patent number: 11924773
    Abstract: The present invention relates to an apparatus and method for controlling uplink transmission power in a multiple element carrier wave system. The method for controlling uplink transmission power by a terminal in a multiple element carrier wave system includes the steps of: generating an uplink signal to be transmitted in a first serving cell; receiving, from a base station, random access start information for commanding the start of a random access procedure for a second serving cell; calculating the estimated surplus power from first transmission power scheduled for an uplink signal transmission, and second transmission power scheduled for a transmission of a PRACH to which a random access preamble is mapped; and when the estimated surplus power is smaller than a threshold power, adjusting the first transmission power or the second transmission power on the basis of power allocation priority.
    Type: Grant
    Filed: March 10, 2023
    Date of Patent: March 5, 2024
    Assignee: PANTECH CORPORATION
    Inventors: Ki Bum Kwon, Myung Cheul Jung, Jae Hyun Ahn
  • Publication number: 20230179170
    Abstract: An acoustic wave resonator package includes an acoustic resonator comprising an acoustic wave generator on a surface of a substrate, a cover member disposed over the acoustic wave generator, a bonding member, disposed between the substrate and the cover member, to bond the substrate and the cover member to each other, and a wiring layer, disposed along surfaces of the cover member, connected to the acoustic resonator. Among the surfaces of the cover member, bonding surfaces to which the bonding member and the wiring layer are bonded at least partially have a roughness Rz in a range of 70 nm to 3.5 µm.
    Type: Application
    Filed: July 7, 2022
    Publication date: June 8, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Sung HAN, Jang Ho PARK
  • Publication number: 20230073403
    Abstract: Disclosed are a light emitting device configured to control the light output of a light emitting unit and a curing apparatus employing the same. The disclosed light emitting device may comprise: a main body having a window; a light source installed in the main body, for generating light of a predetermined wavelength and irradiating the generated light to the outside of the main body through the window; a photodetector installed in the main body, for receiving part of the light irradiated from the light source and monitoring the intensity of the light source; a light path converting unit installed between the light source and the photodetector, for transferring the part of the light irradiated from the light source to the photodetector; and an intensity adjusting unit for adjusting the intensity of the light source based on the signal detected from the photodetector.
    Type: Application
    Filed: November 11, 2022
    Publication date: March 9, 2023
    Inventor: Jae-hyun JUNG