Patents by Inventor Jae-hyun Kim

Jae-hyun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200173132
    Abstract: A circular pipe member is penetrated into the seabed by a suction pressure, and a plurality of circular pipe members are vertically stacked thereon and integrated thereto to construct a cofferdam. When dismantling the cofferdam, the circular pipe members are disassembled and dismantled in order by using a lifting wire installed at a newly constructed structure installed in the inner space of the cofferdam.
    Type: Application
    Filed: November 29, 2019
    Publication date: June 4, 2020
    Inventors: Ju-Hyung LEE, Jae-Hyun KIM, Hak-Man KIM
  • Publication number: 20200176391
    Abstract: A semiconductor package comprising: a frame having an opening and including wiring layers and one or more layer of connection vias; a semiconductor chip disposed in the opening and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant covering the frame and the semiconductor chip and filling the opening; a connection structure disposed on the frame and the active surface of the semiconductor chip, and including one or more redistribution layers electrically connected to the connection pads and the wiring layers; one or more passive components disposed on the connection structure; a molding material covering each of the passive components; and a metal layer covering outer surfaces of each of the frame, the connection structure, and the molding material. The metal layer is connected to a ground pattern included in the wiring layers of the frame.
    Type: Application
    Filed: May 21, 2019
    Publication date: June 4, 2020
    Inventors: Jae Hyun Lim, Sang Jong Lee, Chul Kyu Kim, Yoon Seok Seo
  • Publication number: 20200173015
    Abstract: Provided is a vapor deposition apparatus including a first injection unit injecting a first raw gas in a first direction and a first filter unit mounted on the first injection unit. The first filter unit includes a plurality of plates separated from one another in the first direction and disposed in parallel to one another, each of the plurality of plates having holes therein, being detachably coupled with the first filter unit, and having the holes with sizes of horizontal cross-sections gradually increasing in a direction in which the first raw gas moves. Accordingly, a process efficiency of the vapor deposition apparatus may be enhanced.
    Type: Application
    Filed: January 28, 2020
    Publication date: June 4, 2020
    Inventors: CHOEL-MIN JANG, JIN-KWANG KIM, SUNG-CHUL KIM, JAE-HYUN KIM, SEUNG-YONG SONG, SUK-WON JUNG, MYUNG-SOO HUH
  • Publication number: 20200173589
    Abstract: A quick connector assembly configured to, when a coupling case is separated from an outer case, airtightness may be maintained without fully separating the fixing member. The quick connector assembly includes an tubular outer case having a hollow portion, a coupling case inserted into the hollow portion to be connected to the outer case so as to allow fluid flow, an airtightness maintaining member provided inside the hollow portion and coupled to an outer surface of the coupling case to maintain airtightness between the coupling case and the outer case, and a fixing member detachably fitted from an outside of the outer case to fix the coupling case inserted into the hollow portion by elasticity thereof, wherein the fixing member is introduced toward the hollow portion from outside of the outer case to thereby fix an outer surface of the coupling case located inside the hollow portion by compression.
    Type: Application
    Filed: October 31, 2019
    Publication date: June 4, 2020
    Applicant: HS R & A CO., LTD
    Inventors: Jae Hyeok Choi, Guk Hyun Kim, Seung Hoon Sung, Jung Hyun Shin
  • Patent number: 10673036
    Abstract: Provided is a battery pack. The battery pack according to an embodiment of the present disclosure includes: a battery module including a plurality of battery cells; a case accommodating a plurality of the battery modules; and a handle rod embedded in the case.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: June 2, 2020
    Assignee: LG CHEM, LTD.
    Inventors: Hyeon-Kyu Kim, Jae-Jung Seol, Bum-Hyun Lee, In-Jae Gang
  • Patent number: 10672539
    Abstract: A power cable includes a conductor; an inner semi-conductive layer covering the conductor; an insulating layer covering the inner semi-conductive layer, the insulating layer being impregnated with an insulating oil; an outer semi-conductive layer covering the insulating layer; a metal sheath layer covering the outer semi-conductive layer; and a cable protection layer covering the metal sheath layer. The insulating layer is formed by cross-winding insulating paper and impregnating the insulating paper with the insulating oil. The inner semi-conductive layer and the outer semi-conductive layer are formed by cross-winding semi-conductive paper and impregnating the semi-conductive paper with the insulating oil. A thickness of the outer semi-conductive layer is 7.5 to 15% of a total thickness of the inner semi-conductive layer, the insulating layer, and the outer semi-conductive layer.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: June 2, 2020
    Assignee: LS CABLE & SYSTEM LTD.
    Inventors: Ji Sung Kim, Weon Bae Kim, Kyoung Ro Ko, Su Kil Lee, Joon Keun Lee, Soon Il Sohn, Kum Hwan Cha, Jae Cheol Gwag, Tae Hyun Kim
  • Patent number: 10673156
    Abstract: A connecting device is provided that includes a movable part contacting an external contact terminal, and an elastic part connected to the movable part and configured to provide an elastic force enabling movement of the movable part. The connecting device also includes a support connected to the elastic part, and at least one protecting wall connected to the support and configured to protect the movable part from external forces. The connecting device further includes an extension extending from the at least one protecting wall in a direction along which the movable part moves and configured to bring the movable part close to the external contact terminal, and a base part provided within the extension and configured to reinforce the support.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: June 2, 2020
    Assignees: Samsung Electronics Co., Ltd, Hyupjinconnector Co., Ltd
    Inventors: Jang-Won Hur, Jae-Woon Lee, Jung-Hyun Cho, Seon-Tae Kim, Jin-Woo Park, Chang-Su Park, Yoon-Jae Jung, Kyung-Bin Han
  • Patent number: 10672841
    Abstract: A display apparatus includes a first substrate and a second substrate opposing to the first substrate. The first substrate includes a transmission area in which a shutter unit is disposed and an emission area in which an organic light emitting diode is disposed. The shutter unit includes a first shutter electrode, a second shutter electrode, and a shutter layer interposed between the first and second shutter electrodes. The organic light emitting diode includes a pixel electrode, a common electrode, and a light-emitting layer interposed between the pixel and common electrodes. At least one of the first and second shutter electrodes is connected to the common electrode of the organic light emitting diode.
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: June 2, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jae-Hyun Kim, Jin-Oh Kwag, Yong-Kyu Jang
  • Patent number: 10672209
    Abstract: Provided are door lock control apparatus and method having enhanced security and being capable of providing improved convenience to a user, the door lock control method including: requesting a server for security information set in a door lock; receiving first security information from the server; unlocking the door lock by using the first security information; and setting second security information different from the first security information, in the door lock.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: June 2, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kang-min Lee, Seung-eok Choi, Jae-eun Kang, Chang-han Kim, Jong-youb Ryu, Chang-hyun Lee
  • Patent number: 10672699
    Abstract: A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include providing a carrier with a non-photosensitive protection layer, forming a pattern in the non-photosensitive protection layer, providing a semiconductor die with a contact pad on a first surface, and bonding the semiconductor die to the non-photosensitive protection layer such that the contact pad aligns with the pattern formed in the non-photosensitive protection layer. A second surface opposite to the first surface of the semiconductor die, side surfaces between the first and second surfaces of the semiconductor die, and a portion of a first surface of the non-photosensitive protection layer may be encapsulated with an encapsulant. The carrier may be removed leaving the non-photosensitive protection layer bonded to the semiconductor die. A redistribution layer may be formed on the contact pad and a second surface of the non-photosensitive protection layer opposite to the first surface.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: June 2, 2020
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, SeungJae Lee, Se Woong Cha, SungKyu Kim, Jae Hun Bae, Dong Jin Kim, Doo Hyun Park
  • Patent number: 10669450
    Abstract: A flexible display device of the present invention comprises a photoelectric element part; a first adhesive film formed on the photoelectric element part; a touch function part formed on the first adhesive film; a second adhesive film formed on the touch function part; and a window film formed on the second adhesive film; wherein the first adhesive film or the second adhesive film has an average slope of about ?9.9 to about 0 at ?20° C. to 80° C. based on x-axis for the distribution of storage modulus versus temperature in the function of x-axis of temperature (° C.) and y-axis of storage modulus (KPa) and wherein the first adhesive film or the second adhesive film has a storage modulus of about 10 KPa or more at 80° C.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: June 2, 2020
    Assignees: Samsung SDI Co., Ltd., Samsung Electronics Co., Ltd.
    Inventors: Hyung Rang Moon, Ji Ho Kim, Il Jin Kim, Byeong Do Kwak, Jee Hee Kim, Sung Hyun Mun, Seon Hee Shin, Gwang Hwan Lee, Woo Jin Lee, Eun Hwa Lee, Ik Hwan Cho, Jae Hyun Han
  • Patent number: 10669527
    Abstract: An artificial skin culture container according to the present invention can solve the problems of the contraction of the dermal layer of artificial skin and the detachment thereof from the culture container, which result from an interaction between collagen and fibroblasts existing in the dermal layer of artificial skin during the production of the artificial skin, by using agar and hydrophobically modifying a portion of the agar. Therefore, the use of the culture container enables to stably culture artificial skin and produce artificial skin similar to the human skin. In addition, the artificial skin culture container of the present invention comprises agar, and thus a culture solution can be supplied through a side portion as well as a lower portion of the culture container, which allows to effectively culture artificial skin.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: June 2, 2020
    Assignees: AMOREPACIFIC CORPORATION, SOONGSIL UNIVERSITY RESEARCH CONSORTIUM TECHNO-PARK
    Inventors: Dae Jin Min, Sung Hoon Lee, Hae Kwang Lee, Jae Hyun Jeong, Hee Wook Ryu, Hee Jin Kim
  • Patent number: 10672923
    Abstract: A front electrode for solar cells and a solar cell, the front electrode including a stepped structure at an outermost surface thereof, wherein the stepped structure is composed of n stages, in which n is an integer of 3 or greater, and an nth stage has a smaller cross-sectional area than an (n?1)th stage such that the (n?1)th stage is partially exposed, and the stepped structure occupies about 5% to about 100% of a total surface area of the outermost surface.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: June 2, 2020
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Dong Suk Kim, Hee In Nam, Sang Hee Park, Seok Hyun Jung, Jae Hwi Cho
  • Publication number: 20200168542
    Abstract: Provided is an integrated circuit which includes: a plurality of conductive lines extending in a first horizontal direction on a plane separate from a gate line, and including first and second conductive lines; a source/drain contact having a bottom surface connected to a source/drain region, and including a lower source/drain contact and an upper source/drain contact which are connected to each other in a vertical direction; and a gate contact having a bottom surface connected to the gate line, and extending in the vertical direction, in which the upper source/drain contact is placed below the first conductive line, and the gate contact is placed below the second conductive line. A top surface of the lower source/drain contact may be larger than a bottom surface of the upper source/drain contact.
    Type: Application
    Filed: January 28, 2020
    Publication date: May 28, 2020
    Inventors: Tae-hyung Kim, Jung-ho Do, Dae-young Moon, Sang-yeop Baeck, Jae-hyun Lim, Jae-seung Choi, Sang-shin Han
  • Publication number: 20200166563
    Abstract: In a method of testing an interconnection substrate, a blocking condition of a reference light reflected from a probe having an intrinsic optical characteristic may be set. An electric field emitted from a test interconnection substrate having a plurality of circuits may change the intrinsic optical characteristics of the probe into test optical characteristics. Light may be irradiated to the probe having the test optical characteristics. The reference light reflected from the probe having the test optical characteristic may be blocked in accordance with the blocking condition. The remaining reflected light that may be due to an abnormal circuit may be detected.
    Type: Application
    Filed: June 11, 2019
    Publication date: May 28, 2020
    Inventors: Mee-Hyun LIM, Sung-Yeol KIM, Seong-Keun CHO, Won-Don JOO, Jae-Hong KIM, Taek-Jin KIM, Kyung-Min LEE, Sang-Min LEE
  • Publication number: 20200168558
    Abstract: A semiconductor package includes: a frame having a first surface and a second surface opposing each other, and including a through-hole and a wiring structure connected to the first surface and the second surface; a connection structure disposed on the first surface of the frame and including a redistribution layer; a semiconductor chip disposed in the through-hole and including connection pads connected to the redistribution layer; an encapsulant encapsulating the semiconductor chip and covering the second surface of the frame; and a plurality of electrical connection metal members disposed on the second surface of the frame and connected to the wiring structure. The wiring structure includes a shielding wiring structure surrounding the through-hole, and the plurality of electrical connection metal members include a plurality of grounding electrical connection metal members connected to the shielding wiring structure.
    Type: Application
    Filed: June 6, 2019
    Publication date: May 28, 2020
    Inventors: Yoon Seok SEO, Dae Hyun PARK, Sang Jong LEE, Chul Kyu KIM, Jae Hyun LIM
  • Publication number: 20200168591
    Abstract: A semiconductor package includes a frame having a through-hole, and a first semiconductor chip disposed in the through-hole of the frame and having an active surface on which a connection pad is disposed, an inactive surface opposing the active surface, and a side surface connecting the active and inactive surfaces. A first encapsulant covers at least a portion of each of the inactive surface and the side surface of the first semiconductor chip. A connection structure has a first surface having disposed thereon the active surface of the first semiconductor chip, and includes a redistribution layer electrically connected to the connection pad of the first semiconductor chip. A first passive component is disposed on a second surface of the connection structure opposing the first surface, the first passive component being electrically connected to the redistribution layer and having a thickness greater than a thickness of the first semiconductor chip.
    Type: Application
    Filed: June 27, 2019
    Publication date: May 28, 2020
    Inventors: Chul Kyu KIM, Dae Hyun PARK, Jung Ho SHIM, Jae Hyun LIM, Mi Ja HAN, Sang Jong LEE, Han KIM
  • Patent number: 10660336
    Abstract: A method for controlling plant viruses comprising treating plant or soil with a composition for controlling plant viruses comprising Trichodermin wherein the composition has antiviral activity against plant viruses when applied to a plant or to soil. In some embodiments, the Trichodermin is isolated from a Trichoderma albolutescens strain.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: May 26, 2020
    Assignees: SEOUL WOMEN'S UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Dong Ho Lee, Jae Jin Kim, Ki Hyun Ryu, Beom Seok Kim, Seung Mok Ryu
  • Publication number: 20200161577
    Abstract: A quantum dot light emitting diode comprises first and second electrodes facing each other; a hole injection layer disposed between the first electrode and the second electrode and having a first HOMO level; a first hole transporting layer disposed between the hole injection layer and the second electrode and having a second HOMO level that is lower than the first HOMO level; a second hole transporting layer disposed between the first hole transporting layer and the second electrode and having a third HOMO level that is lower than the second HOMO level; and a quantum dot light emitting layer disposed between the second hole transporting layer and the second electrode and having a fourth HOMO level that is lower than the third HOMO level, wherein a difference between the first HOMO level and the second HOMO level is greater than a difference between the second HOMO level and the third HOMO level and less than a difference between the third HOMO level and the fourth HOMO level.
    Type: Application
    Filed: November 20, 2019
    Publication date: May 21, 2020
    Applicant: LG Display Co., Ltd.
    Inventors: Ji-Yeon KANG, Min-Jee KIM, Jae-Hyun PARK
  • Publication number: 20200160899
    Abstract: A semiconductor device includes a first command pulse generation circuit configured to generate a first command pulse from an internal command address based on a first blocking signal; and a second command pulse generation circuit configured to generate a second command pulse from the internal command address based on a second blocking signal.
    Type: Application
    Filed: May 28, 2019
    Publication date: May 21, 2020
    Applicant: SK hynix Inc.
    Inventors: Chang Hyun KIM, Jae Il KIM