Abstract: A protein complex comprising an in vitro stabilization protein, a membrane translocation sequence domain, a biologically active molecule, and an in vivo stabilization protein, as well as methods for the use and production thereof.

Abstract: The invention provides a fusion protein comprising (a) a first protein comprising a polypeptide which specifically binds to Annexin A1 and (b) a second protein comprising a polypeptide which induces a cytotoxic activity of a cytotoxic lymphocyte, pharmaceutical compositions comprising the fusion protein, and methods of treating or preventing cancer by administering the pharmaceutical compositions.

Abstract: An apparatus for cooling a spent fuel pool having a heat exchanger includes a cooling water pool positioned above the spent fuel pool; a floating device configured to be elevated according to a water level of a cooling water in the spent fuel pool; and an emergency cooling water supply pipe configured to form a path through which the cooling water of the cooling water pool is moved to the spent fuel pool and configured to include a floating valve that opens or closes a flow passage of the cooling water in connection with the elevation of the floating device.

Abstract: An image display apparatus and a method for operating the same are disclosed. The method for operating an image display apparatus includes entering a blackboard mode, receiving an image, inverting a gray level of the received image, and displaying the image with the inverted gray level. Accordingly, it is possible to improve visibility in a blackboard mode.

Abstract: A fusion protein that includes a polypeptide binding specifically to a constant region of an antibody and a stabilization protein linked to a terminus of the polypeptide, a polynucleotide encoding the fusion protein, a cell including the polynucleotide, a method of preparing the fusion protein, and a method of isolating an antibody by using the fusion protein.

Abstract: A field mounting-type test apparatus and method for enhancing competitiveness of a product by simulating various test conditions including a mounting environment for improving quality reliability of a memory device and by minimizing overall loss due to change in a mounting environment thus reducing testing time and cost. The field mounting-type test apparatus includes a mass storage device configured to store logic data simulating a mounting environment of a device under test (DUT) and a tester main frame configured to test the DUT using the logic data.

Abstract: Provided are a nonvolatile memory device and a read method of the same. The read method applying one of a plurality of unselected read voltages to unselected wordlines adjacent to a selected word line. The voltage applied to the unselected word lines being based on which of a plurality of selected read voltages is applied to the selected wordline.

Abstract: A transmembrane fusion protein including ubiquitin or a ubiquitin-like protein, a membrane translocation sequence linked to the C-terminus of the ubiquitin or ubiquitin-like protein, and a biologically active molecule linked to the C-terminus of the membrane translocation sequence is disclosed herein. A polynucleotide encoding the transmembrane fusion protein, a recombinant expression vector including the polynucleotide sequence, a cell transformed by the recombinant expression vector, and a method of delivering the biologically active molecule into a cell using the transmembrane fusion protein are also disclosed.

Abstract: A signal capture system for capturing a signal and storing the captured signal in a storage apparatus in real time, and a test apparatus including the signal capture system. The signal capture system includes a printed circuit board; a socket that is connected to the printed circuit board and on which a reference memory component is mounted; and an interposer that is mounted on the printed circuit board, is connected to the socket, an external apparatus, and a storage apparatus, receives first signals from the reference memory component and transmits the received first signals to the external apparatus and the storage apparatus, and receives second signals from the external apparatus and transmits the received second signals to the reference memory component and the storage apparatus, wherein a shape of the socket is defined according to a type of the reference memory component.

Abstract: A multifunctional handler system for electrical testing of semiconductor devices is provided. The multifunctional handler system comprises: (1) a semiconductor device processing section comprising a loading unit including a buffer, a sorting unit including a separate marking machine, and a unloading unit; (2) a semiconductor device testing section, separate from the semiconductor device processing section, comprises a test chamber, the test chamber is separated into two or more test spaces, and the test spaces of the test chamber include a second chamber positioned at a lower position, a first chamber positioned above the second chamber, and pipelines for connecting the first and second chambers to each other; and (3) a host computer which is independently connected to the semiconductor device processing section and the semiconductor device testing section and controls tray information, test results, marking information, and test program information.

Abstract: Automatic test equipment is capable of performing a high-speed test of semiconductor devices, with a low cost and high efficiency. The automatic test equipment (ATE) comprises: an ATE body configured to electrically test semiconductor devices; a field programmable gate array (FPGA) controlling drivers and comparators on the ATE; an accelerator connected to an output terminal of the FPGA and that doubles an operating frequency of the FPGA; and a decelerator connected to an output terminal of the FPGA and that converts an operating frequency of data transferred from the semiconductor device to the operating frequency of the FPGA.

Abstract: A connecting unit to test a semiconductor chip and an apparatus to test the semiconductor chip having the same include a plurality of connectors, on which a semiconductor chip having a certain pattern of electrical connection terminals, having a plurality of holes, cables configured to electrically connect the electrical connection terminals to the exterior, and coupling units configured to selectively electrically connect the cables to the electrical connection terminals through the holes. Therefore, it is possible to perform electrical tests of semiconductor chips having various patterns of electrical connection terminals and receive the semiconductor chips in a tray at a time.

Abstract: Provided are a field mounting-type test apparatus and method, which can enhance competitiveness of a product by simulating various test conditions including a mounting environment so as to improve quality reliability of a memory device and by minimizing overall loss due to change in a mounting environment so as to reduce testing time and cost. In accordance with example embodiments, the field mounting-type test apparatus may include a mass storage device configured to store logic data simulating a mounting environment of a device under test (DUT) and a tester main frame configured to test the DUT by using the logic data.

Abstract: A semiconductor device test handler for maintaining stable temperature in a test environment may include a loading unit that loads a plurality of semiconductor devices mounted on a test tray; a soak chamber configured to receive the test tray from the loading unit and to age the semiconductor devices at an aging temperature; and a test chamber configured to receive and test the aged semiconductor devices. The test chamber may include: a test board; a first chamber; a second chamber; one or more pipelines connected to the first and second chambers that allow a temperature-control medium to flow between the first and second chambers; a de-soak chamber that further ages the tested semiconductor devices so that the tested semiconductor devices substantially return to ambient temperature; and a sorting and unloading unit that sorts the tested semiconductor devices according to results of the test and that unloads the sorted semiconductor devices.

Abstract: In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.

Abstract: Automatic test equipment is capable of performing a high-speed test of semiconductor devices, with a low cost and high efficiency. The automatic test equipment (ATE) comprises: an ATE body configured to electrically test semiconductor devices; a field programmable gate array (FPGA) controlling drivers and comparators on the ATE; an accelerator connected to an output terminal of the FPGA and that doubles an operating frequency of the FPGA; and a decelerator connected to an output terminal of the FPGA and that converts an operating frequency of data transferred from the semiconductor device to the operating frequency of the FPGA.

Abstract: A multifunctional handler system for electrical testing of semiconductor devices is provided. The multifunctional handler system comprises: (1) a semiconductor device processing section comprising a loading unit including a buffer, a sorting unit including a separate marking machine, and a unloading unit; (2) a semiconductor device testing section, separate from the semiconductor device processing section, comprises a test chamber, the test chamber is separated into two or more test spaces, and the test spaces of the test chamber include a second chamber positioned at a lower position, a first chamber positioned above the second chamber, and pipelines for connecting the first and second chambers to each other; and (3) a host computer which is independently connected to the semiconductor device processing section and the semiconductor device testing section and controls tray information, test results, marking information, and test program information.

Abstract: A semiconductor device test handler for maintaining stable temperature in a test environment may include a loading unit that loads a plurality of semiconductor devices mounted on a test tray; a soak chamber configured to receive the test tray from the loading unit and to age the semiconductor devices at an aging temperature; and a test chamber configured to receive and test the aged semiconductor devices. The test chamber may include: a test board; a first chamber; a second chamber; one or more pipelines connected to the first and second chambers that allow a temperature-control medium to flow between the first and second chambers; a de-soak chamber that further ages the tested semiconductor devices so that the tested semiconductor devices substantially return to ambient temperature; and a sorting and unloading unit that sorts the tested semiconductor devices according to results of the test and that unloads the sorted semiconductor devices.

Abstract: A calibration method and a semiconductor testing apparatus, including N drivers, N being a natural number no less than two, at least one transmission path coupled to at least one of the N drivers, at least one calibration board coupled to the at least one transmission path, N comparators, and N delay paths, such that each delay path of the N delay paths has a skew value and is coupled between the calibration board and one of the N comparators.

Abstract: A test kit for a semiconductor package and a method of testing a semiconductor package using the same are provided. The test kit may include a pick-and-place tool for loading/unloading a semiconductor package, a head assembly for guiding a semiconductor package released from the pick-and-place tool, and a socket for receiving the semiconductor package from the pick-and-place tool. The method may include performing pre-alignment by inserting one or more slide posts of an alignment tool into a socket, releasing a semiconductor package through a package guider, and attaching the semiconductor package onto a socket.