Patents by Inventor Jae-jin Cha

Jae-jin Cha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147579
    Abstract: A cooking system is disclosed. The cooking system includes a microwave and a display device. The microwave is configured to in response to a received user command, generate a first image by photographing a cooktop located below the microwave through a first camera or generate a second image by photographing an inside of the microwave through a second camera. The microwave is also configured to transmit at least one of the first image and the second image to the display device. The display device is configured to receive the at least one of a first image and the second image from the microwave and display the received at least one image.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Inventors: Jae-hoon CHA, Hyeong-jin JANG, Dong-hyun SOHN
  • Patent number: 11946650
    Abstract: A range hood and a method for controlling the range hood are provided. The apparatus includes a range hood which is capable of photographing a cooking process that is being performed on an upper plate of a cook top by using a camera disposed in the main body of the range hood, and a method for controlling the range hood are provided. In some of the example embodiments, a range hood is capable of photographing a cooking process that is being performed on an upper plate of a cook top that is positioned below a bottom surface of the main body.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: April 2, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-hoon Cha, Hyeong-jin Jang, Dong-hyun Sohn
  • Publication number: 20240106336
    Abstract: A power module for a vehicle, includes: a lower substrate and an upper substrate spaced from the lower substrate; a semiconductor chip disposed between the lower substrate and the upper substrate; a first power lead disposed being spaced from the semiconductor chip and connected to one of the lower substrate and the upper substrate; and a second power lead disposed being spaced from the semiconductor chip and connected to both the lower substrate and the upper substrate.
    Type: Application
    Filed: May 8, 2023
    Publication date: March 28, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Han Jin DO, Jin Myeong YANG, Jae Eun CHA
  • Publication number: 20020056196
    Abstract: Indoor air conditioner units are manufactured by pre-assembling evaporators and supplying the evaporators to a plurality of unit assembling stations, whereby at each unit assembling station, the evaporators are assembled with other air conditioner elements to form finished indoor air conditioner units. The evaporators can be assembled at an evaporator assembling station which supplies all of the unit assembling stations with evaporators. Alternatively, the evaporators can be assembled at each of the unit assembling stations.
    Type: Application
    Filed: January 7, 2002
    Publication date: May 16, 2002
    Inventors: Jae-Jin Cha, Doo-Nam Myung
  • Patent number: 6339873
    Abstract: Indoor air conditioner units are manufactured by pre-assembling evaporators and supplying the evaporators to a plurality of unit assembling stations, whereby at each unit assembling station, the evaporators are assembled with other air conditioner elements to form finished indoor air conditioner units. The evaporators can be assembled at an evaporator assembling station which supplies all of the unit assembling stations with evaporators. Alternatively, the evaporators can be assembled at each of the unit assembling stations.
    Type: Grant
    Filed: January 19, 1999
    Date of Patent: January 22, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-jin Cha, Doo-nam Myung
  • Publication number: 20010001344
    Abstract: Indoor air conditioner units are manufactured by pre-assembling evaporators and supplying the evaporators to a plurality of unit assembling stations, whereby at each unit assembling station, the evaporators are assembled with other air conditioner elements to form finished indoor air conditioner units. The evaporators can be assembled at an evaporator assembling station which supplies all of the unit assembling stations with evaporators. Alternatively, the evaporators can be assembled at each of the unit assembling stations.
    Type: Application
    Filed: January 19, 1999
    Publication date: May 24, 2001
    Inventors: JAE-JIN CHA, DOO-NAM MYUNG
  • Patent number: 6105444
    Abstract: A noise tester for testing an operating noise level of an indoor air conditioner includes a casing which is installed between an assembly line for assembling the air conditioner unit, and a packing line for packing the assembled unit. The casing includes a bottom section and a cover removably mounted on the bottom section for opening the casing and permitting a unit to be introduced therein. A receiving part is disposed in the bottom section for receiving a unit from the assembly line when the cover is open, and for transferring the unit to the packing line after the testing has been performed. A test mechanism is provided for testing and operating noise level of a unit disposed in the casing with the cover closed. The test mechanism includes a microphone disposed within the casing.
    Type: Grant
    Filed: September 11, 1998
    Date of Patent: August 22, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-jin Cha, Doo-nam Myung