Abstract: Disclosed herein is an apparatus for adjusting a reference voltage. The apparatus may include a gate signal generation unit for generating an RDQS gate signal, a reference voltage generation unit for setting a reference voltage based on the RDQS gate signal, and a reset counter for holding a voltage at the time at which the RDQS gate signal becomes low when the RDQS gate signal is not applied to the reference voltage generation unit for a specific time period.

Abstract: Disclosed herein are a duty cycle monitoring method and apparatus for a memory interface, including receiving a clock signal as input and generating a first delay time offset and a second delay time offset, receiving the clock signal and the first delay time offset and then outputting a first delayed signal, receiving the first delayed signal and the second delay time offset and then outputting a second delayed signal, receiving the clock signal and the second delayed signal and then outputting a delay value corresponding to a half-period of the clock signal, and monitoring, based on the first delayed signal, whether a duty cycle of the clock signal conforms to a duty cycle specification.

Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.

Abstract: Provided is a pressure vessel intended for storing up a fluid having high pressure, and more specifically, to a pressure vessel capable of enabling a sealing pad made of an elastic material to effectively prevent the fluid from flowing out from a bonding portion of a nozzle and a liner. The pressure vessel includes: a liner formed to be hollow so as to enable its inside to be filled with the fluid; a nozzle combined with one side of the liner, or each end portion of both sides so as to enable a coupling part having a cylindrical shape to be located in the inside of the liner; a sealing pad having a ring-like shape configured to enable the coupling part to pass through its center, and formed of an elastic material; and a sealing nut coupled to the coupling part from a lower portion of the sealing pad.

Abstract: Disclosed herein is an apparatus for receiving data from memory. The apparatus receives a data signal and a clock signal output from memory and includes a Decision Feedback Equalizer (DFE) including two or more differential signal path units configured to determine and output an output value corresponding to the data signal. Each of the two or more differential signal path units may determine a current output value by reflecting a previous output value fed back from a different one of the two or more differential signal path units in such a way that they operate at different clocks, and may include an offset control unit configured to adjust an offset at an input stage and a feedback control unit configured to change a load of an output stage using the previous output value fed back from the different one of the two or more differential signal path units.

Abstract: A manufacturing method of a semiconductor device may include: forming a stack comprising first material layers and second material layers that are alternately stacked; forming an opening in the stack; forming a first seed layer in the opening; forming a first buffer layer by surface-treating the first seed layer; and forming a blocking layer by oxidizing the first seed layer through the first buffer layer.

Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.

Abstract: The present disclosure relates to a composition for preparing a vinyl chloride-based polymer and a method of preparing a vinyl chloride-based polymer using the same, and provides the composition giving excellent productivity for preparing a vinyl chloride-based polymer includes while maintaining excellent foaming and viscosity properties of a plastisol including the prepared vinyl chloride-based polymer, by including a pH regulator composed of a carbonate-based metal salt, and a transition metal catalyst in the composition, and controlling an amount of the transition metal catalyst, and controlling an amount of a reducing agent such that a trace amount or none of the reducing agent is included, and the method of preparing a vinyl chloride-based polymer using the same.

Abstract: Provided are a hollow fiber composite membrane for water vapor separation, comprising a hollow fiber membrane including two or more pores and a coating layer in which an interfacial polymer obtained from interfacial polymerization of water-soluble monomer and an organic monomer is coated on a surface of the hollow fiber membrane, and a chemical resistant substance is introduced in the interfacial polymer, and a method for manufacturing the same.

Abstract: An apparatus and method for generating a binaural beat for brainwave induction is provided. Upon receipt of a stereo audio signal, a decorrelator extracts a common component existing in common in both channels of the stereo audio signal, and outputs the remaining stereo components except for the extracted common component. A frequency shifter generates a common component in which the binaural beat is included, by shifting a frequency of the extracted common component. First and second mixers mix the common component in which the binaural beat is included, with the remaining stereo components.

Abstract: An apparatus and method for generating a binaural beat for brainwave induction is provided. Upon receipt of a stereo audio signal, a decorrelator extracts a common component existing in common in both channels of the stereo audio signal, and outputs the remaining stereo components except for the extracted common component. A frequency shifter generates a common component in which the binaural beat is included, by shifting a frequency of the extracted common component. First and second mixers mix the common component in which the binaural beat is included, with the remaining stereo components.