Abstract: A semiconductor package including a die paddle, a first lead spaced apart from the die paddle and on one side of the die paddle, a second lead spaced apart from the die paddle and on another side of the die paddle, a spacer on the die paddle, a semiconductor die on the spacer, a first wire configured to connect an upper surface of the semiconductor die to the first lead, and a mold film configured to cover the die paddle, the first lead, the second lead, the spacer, the semiconductor die, and the first wire, wherein a first width of the spacer is greater than a second width of the die paddle so that the spacer overlaps the first lead may be provided.

Abstract: A liquid crystal display including a semiconductor layer disposed on a substrate, a transparent electrode disposed n the semiconductor layer, the transparent electrode overlapping the semiconductor layer and including a source electrode, a drain electrode facing the source electrode, and a first electrode extending from the drain electrode, and an insulating layer disposed on the transparent electrode. The semiconductor layer contacts an entire surface of the source electrode, the drain electrode, and the first electrode.

Abstract: A liquid crystal display including a semiconductor layer disposed on a substrate, a transparent electrode disposed n the semiconductor layer, the transparent electrode overlapping the semiconductor layer and including a source electrode, a drain electrode facing the source electrode, and a first electrode extending from the drain electrode, and an insulating layer disposed on the transparent electrode. The semiconductor layer contacts an entire surface of the source electrode, the drain electrode, and the first electrode.