Patents by Inventor Jae Jun BANG

Jae Jun BANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10529699
    Abstract: Provided are a light source module and a backlight unit (BLU) including the same. The light source module includes a substrate including a base plate extending in a first direction and a pair of dam structures stacked on opposing sides of the base plate along a second direction, orthogonal to the first direction, and extending along the base plate in the first direction, wherein the pair of dam structures are spaced apart from each other along a third direction, orthogonal to the first and second directions. A plurality of light-emitting devices are mounted on the substrate between the pair of dam structures and spaced apart from one another in the first direction. An encapsulation layer covers at least one side surface and a top surface of each of the plurality of light-emitting devices. A height of the pair of dam structures is greater than a height of the encapsulation layer.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: January 7, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-jun Bang, Seog-ho Lim, Chang-ho Shin, Dong-soo Lee, Sun Kim
  • Patent number: 10509159
    Abstract: A light source module according to some example embodiments includes a first substrate and a plurality of second substrates. The first substrate includes a plurality of connectors configured to at least receive a supply of electrical power and a plurality of first connection pads that are configured to be electrically connected to the plurality of connectors. The second substrates each include a plurality of mounting elements on an upper surface and a plurality of second connection pads on a lower surface of the second substrate and configured to be electrically connected to the plurality of mounting elements. Each mounting element may be connected to a separate light-emitting device. A plurality of connection members may electrically connect the first connection pads of the first substrate to the plurality of second connection pads of the plurality of second substrates.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: December 17, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-soo Lee, Seog-ho Lim, Chang-ho Shin, Sun Kim, Myoung-sun Ha, Jae-jun Bang
  • Patent number: 10332865
    Abstract: A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sun Kim, Jae Jun Bang, Chang Ho Shin, Dong Soo Lee, Seog Ho Lim, Myoung Sun Ha
  • Publication number: 20180052275
    Abstract: A light source module according to some example embodiments includes a first substrate and a plurality of second substrates. The first substrate includes a plurality of connectors configured to at least receive a supply of electrical power and a plurality of first connection pads that are configured to be electrically connected to the plurality of connectors. The second substrates each include a plurality of mounting elements on an upper surface and a plurality of second connection pads on a lower surface of the second substrate and configured to be electrically connected to the plurality of mounting elements. Each mounting element may be connected to a separate light-emitting device. A plurality of connection members may electrically connect the first connection pads of the first substrate to the plurality of second connection pads of the plurality of second substrates.
    Type: Application
    Filed: January 17, 2017
    Publication date: February 22, 2018
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dong-soo LEE, Seog-ho LIM, Chang-ho SHIN, Sun KIM, Myoung-sun HA, Jae-jun BANG
  • Publication number: 20180053750
    Abstract: A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.
    Type: Application
    Filed: April 4, 2017
    Publication date: February 22, 2018
    Inventors: Sun KIM, Jae Jun BANG, Chang Ho SHIN, Dong Soo LEE, Seog Ho LIM, Myoung Sun HA
  • Publication number: 20180047712
    Abstract: Provided are a light source module and a backlight unit (BLU) including the same. The light source module includes a substrate including a base plate extending in a first direction and a pair of dam structures stacked on opposing sides of the base plate along a second direction, orthogonal to the first direction, and extending along the base plate in the first direction, wherein the pair of dam structures are spaced apart from each other along a third direction, orthogonal to the first and second directions. A plurality of light-emitting devices are mounted on the substrate between the pair of dam structures and spaced apart from one another in the first direction. An encapsulation layer covers at least one side surface and a top surface of each of the plurality of light-emitting devices. A height of the pair of dam structures is greater than a height of the encapsulation layer.
    Type: Application
    Filed: April 28, 2017
    Publication date: February 15, 2018
    Inventors: Jae-jun BANG, Seog-ho LIM, Chang-ho SHIN, Dong-soo LEE, Sun KIM
  • Patent number: 9876149
    Abstract: A semiconductor light emitting device package may include: a light emitting diode (LED) chip having a first surface on which a first electrode and a second electrode are provided, a second surface opposite the first surface, and a plurality of side surfaces, a lateral wavelength conversion layer disposed on a side surface of the plurality of side surfaces of the LED chip, the lateral wavelength conversion layer comprising a wavelength conversion material, and a reflective layer covering the second surface of the LED chip, the reflective layer being configured to reflect light emitted by the LED chip back towards the LED chip.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: January 23, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Jun Bang, Young Kyung Kim
  • Publication number: 20170062666
    Abstract: A semiconductor light emitting device package may include: a light emitting diode (LED) chip having a first surface on which a first electrode and a second electrode are provided, a second surface opposite the first surface, and a plurality of side surfaces, a lateral wavelength conversion layer disposed on a side surface of the plurality of side surfaces of the LED chip, the lateral wavelength conversion layer comprising a wavelength conversion material, and a reflective layer covering the second surface of the LED chip, the reflective layer being configured to reflect light emitted by the LED chip back towards the LED chip.
    Type: Application
    Filed: April 20, 2016
    Publication date: March 2, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Jun BANG, Young Kyung KIM