Patents by Inventor Jae Jun BANG

Jae Jun BANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating light emitting diode module
    Patent number: 10332865
    Abstract: A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sun Kim, Jae Jun Bang, Chang Ho Shin, Dong Soo Lee, Seog Ho Lim, Myoung Sun Ha
  • METHOD OF FABRICATING LIGHT EMITTING DIODE MODULE
    Publication number: 20180053750
    Abstract: A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.
    Type: Application
    Filed: April 4, 2017
    Publication date: February 22, 2018
    Inventors: Sun KIM, Jae Jun BANG, Chang Ho SHIN, Dong Soo LEE, Seog Ho LIM, Myoung Sun HA
  • Semiconductor light emitting device package and light source module using same
    Patent number: 9876149
    Abstract: A semiconductor light emitting device package may include: a light emitting diode (LED) chip having a first surface on which a first electrode and a second electrode are provided, a second surface opposite the first surface, and a plurality of side surfaces, a lateral wavelength conversion layer disposed on a side surface of the plurality of side surfaces of the LED chip, the lateral wavelength conversion layer comprising a wavelength conversion material, and a reflective layer covering the second surface of the LED chip, the reflective layer being configured to reflect light emitted by the LED chip back towards the LED chip.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: January 23, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Jun Bang, Young Kyung Kim
  • SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE AND LIGHT SOURCE MODULE USING SAME
    Publication number: 20170062666
    Abstract: A semiconductor light emitting device package may include: a light emitting diode (LED) chip having a first surface on which a first electrode and a second electrode are provided, a second surface opposite the first surface, and a plurality of side surfaces, a lateral wavelength conversion layer disposed on a side surface of the plurality of side surfaces of the LED chip, the lateral wavelength conversion layer comprising a wavelength conversion material, and a reflective layer covering the second surface of the LED chip, the reflective layer being configured to reflect light emitted by the LED chip back towards the LED chip.
    Type: Application
    Filed: April 20, 2016
    Publication date: March 2, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Jun BANG, Young Kyung KIM