Abstract: Provided is a control method for a system for determining a lesion obtained via real-time image. The control method comprises: an endoscope device obtaining a stomach endoscopy image; the endoscope device transmitting the obtained stomach endoscopy image to a server; the server determining a lesion included in the stomach endoscopy image, by inputting the stomach endoscopy image into a first artificial intelligence model; when it is determined that a lesion is detected in the stomach endoscopy image, the server obtaining an image including the lesion and transmitting the image to a database of the server; the server determining the type of the lesion included in the image, by inputting the image into a second artificial intelligence model; and when it is determined that a lesion is detected in the stomach endoscopy image, a display device displaying a UI for guiding the location of the lesion in the stomach endoscopy image.

Abstract: Provided are a light source module and a backlight unit (BLU) including the same. The light source module includes a substrate including a base plate extending in a first direction and a pair of dam structures stacked on opposing sides of the base plate along a second direction, orthogonal to the first direction, and extending along the base plate in the first direction, wherein the pair of dam structures are spaced apart from each other along a third direction, orthogonal to the first and second directions. A plurality of light-emitting devices are mounted on the substrate between the pair of dam structures and spaced apart from one another in the first direction. An encapsulation layer covers at least one side surface and a top surface of each of the plurality of light-emitting devices. A height of the pair of dam structures is greater than a height of the encapsulation layer.

Abstract: A light source module according to some example embodiments includes a first substrate and a plurality of second substrates. The first substrate includes a plurality of connectors configured to at least receive a supply of electrical power and a plurality of first connection pads that are configured to be electrically connected to the plurality of connectors. The second substrates each include a plurality of mounting elements on an upper surface and a plurality of second connection pads on a lower surface of the second substrate and configured to be electrically connected to the plurality of mounting elements. Each mounting element may be connected to a separate light-emitting device. A plurality of connection members may electrically connect the first connection pads of the first substrate to the plurality of second connection pads of the plurality of second substrates.

Abstract: A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.

Abstract: A light source module according to some example embodiments includes a first substrate and a plurality of second substrates. The first substrate includes a plurality of connectors configured to at least receive a supply of electrical power and a plurality of first connection pads that are configured to be electrically connected to the plurality of connectors. The second substrates each include a plurality of mounting elements on an upper surface and a plurality of second connection pads on a lower surface of the second substrate and configured to be electrically connected to the plurality of mounting elements. Each mounting element may be connected to a separate light-emitting device. A plurality of connection members may electrically connect the first connection pads of the first substrate to the plurality of second connection pads of the plurality of second substrates.

Abstract: A method of fabricating a LED module includes preparing a circuit board, such that the circuit board includes a reflective laminate around a chip mounting region and an electrode pad in the chip mounting region, preparing a mask, such that the mask includes a protruding portion with a discharge hole, and the protruding portion is inserted into a space surrounded by the reflective laminate, dispensing solder paste onto the electrode pad using the mask, and bonding an electrode of a LED chip to the electrode pad of the circuit board using the solder paste.

Abstract: Provided are a light source module and a backlight unit (BLU) including the same. The light source module includes a substrate including a base plate extending in a first direction and a pair of dam structures stacked on opposing sides of the base plate along a second direction, orthogonal to the first direction, and extending along the base plate in the first direction, wherein the pair of dam structures are spaced apart from each other along a third direction, orthogonal to the first and second directions. A plurality of light-emitting devices are mounted on the substrate between the pair of dam structures and spaced apart from one another in the first direction. An encapsulation layer covers at least one side surface and a top surface of each of the plurality of light-emitting devices. A height of the pair of dam structures is greater than a height of the encapsulation layer.

Abstract: A semiconductor light emitting device package may include: a light emitting diode (LED) chip having a first surface on which a first electrode and a second electrode are provided, a second surface opposite the first surface, and a plurality of side surfaces, a lateral wavelength conversion layer disposed on a side surface of the plurality of side surfaces of the LED chip, the lateral wavelength conversion layer comprising a wavelength conversion material, and a reflective layer covering the second surface of the LED chip, the reflective layer being configured to reflect light emitted by the LED chip back towards the LED chip.

Abstract: A semiconductor light emitting device package may include: a light emitting diode (LED) chip having a first surface on which a first electrode and a second electrode are provided, a second surface opposite the first surface, and a plurality of side surfaces, a lateral wavelength conversion layer disposed on a side surface of the plurality of side surfaces of the LED chip, the lateral wavelength conversion layer comprising a wavelength conversion material, and a reflective layer covering the second surface of the LED chip, the reflective layer being configured to reflect light emitted by the LED chip back towards the LED chip.