Abstract: Disclosed is a surface processing method for a dental implant, the surface processing method including: (a) laser-processing a surface of an implant; (b) etching the laser-processed surface of the implant; and (c) washing the etched implant, wherein a macro surface including one or more first grooves is formed at the surface of the implant by step (a), a micro surface including one or more second grooves is formed at the surface of the implant by step (b), an outer circumferential surface of the implant includes a top portion and a bottom portion, and at least one of an average width and an average depth of the first grooves is formed to be greater at the top portion of the outer circumferential surface of the implant than at the bottom portion of the outer circumferential surface of the implant.

Abstract: A tantalum capacitor includes a capacitor body comprising a tantalum body having a tantalum wire and a molded portion; an anodic terminal connected to the tantalum wire and disposed on the first surface of the capacitor body; an anodic connection portion connected to the anodic terminal and disposed on the fifth surface of the capacitor body; a cathodic terminal connected to the tantalum body and disposed on the second surface of the capacitor body; a cathodic connection portion connected to the cathodic terminal and spaced apart from the anodic connection portion on the fifth surface of the capacitor body; and a substrate disposed on the sixth surface of the body and on which the tantalum body is mounted, wherein the anodic terminal and the cathodic terminal are electrically isolated on the substrate.

Abstract: A tantalum capacitor includes a capacitor body comprising a tantalum body having a tantalum wire and a molded portion; an anodic terminal connected to the tantalum wire and disposed on the first surface of the capacitor body; an anodic connection portion connected to the anodic terminal and disposed on the fifth surface of the capacitor body; a cathodic terminal connected to the tantalum body and disposed on the second surface of the capacitor body; a cathodic connection portion connected to the cathodic terminal and spaced apart from the anodic connection portion on the fifth surface of the capacitor body; and a substrate disposed on the sixth surface of the body and on which the tantalum body is mounted, wherein the anodic terminal and the cathodic terminal are electrically isolated on the substrate.

Abstract: Disclosed is a bike simulator including: a base frame; a slope frame rotatably connected to the base frame so as to apply a tilting back and forth to a seated bike; a roll frame fixing a frame of the bike seated on the slope frame and rotatably connected to the slope frame so as to apply a horizontal slope to the bike; and a rear wheel support provided in the slope frame, supporting a rear wheel of the seated bike, and including a load generating unit configured to control rotary force transferred to the rear wheel. In the bike simulator according to the present invention, a bike which an actual user possesses can be fixed and applied, and as a result, the user can feel an extreme realistic traveling sense.

Abstract: Disclosed is a variable-diameter wheel including a wheel having a folding pattern in which a unit cell is repeated and configured to be expanded or contracted so that a wheel diameter is varied; a spoke fixedly coupled to both longitudinal ends of the wheel and configured to be expanded or contracted according to a change in a distance between both sides, such that the wheel diameter is varied; and a variable induction shaft rotatably coupled with one of the both spokes to move the spoke in at least one lengthwise direction and configured to vary a distance between one spoke and the other spoke.

Abstract: Disclosed is a variable-diameter wheel including a wheel having a folding pattern in which a unit cell is repeated and configured to be expanded or contracted so that a wheel diameter is varied; a spoke fixedly coupled to both longitudinal ends of the wheel and configured to be expanded or contracted according to a change in a distance between both sides, such that the wheel diameter is varied; and a variable induction shaft rotatably coupled with one of the both spokes to move the spoke in at least one lengthwise direction and configured to vary a distance between one spoke and the other spoke.

Abstract: A connector cable stowage system for an accessory device for a handheld computing device is disclosed. The accessory device has a housing. The stowage system includes a connector cable that has a head with a connector and a cable. The connector is adapted for electrical connection to a handheld computing device. The cable is electrically connected to an accessory device. A head receptacle is molded in the housing of the accessory device. The head receptacle is configured to receive the head of the connector cable therein.

Abstract: A solid electrolytic condenser includes a condenser element, an anode wire including one end inserted into the condenser element, a cathode drawing layer formed on outer side of the condenser element, terminal reinforcements arranged respectively under opposite side portions of a bottom surface of the condenser element, a liquid epoxy resin filled in spaces between the terminal reinforcements and between the bottom surface of the condenser element and top surfaces of the terminal reinforcements, a molding part surrounding the condenser element while exposing the other end of the anode wire, an end portion of the cathode drawing layer, and bottom surfaces of the terminal reinforcements, and anode and cathode terminals formed by a plating layer provided on the bottom surfaces of the terminal reinforcements and on opposite side surfaces of the molding part. The liquid epoxy resin includes fillers of a smaller size than those in the molding part.

Abstract: The present invention provides a solid electrolytic condenser including a condenser element with anode polarity; an anode wire with one side inserted inside the condenser element and the other side projected outside the condenser element; and an insulating layer formed by coating one surface of the condenser element and an exposed region of the anode wire adjacent to the one surface of the condenser element with a liquid insulating material through a non-contact scattering method and an apparatus and a method for forming the insulating layer of the solid electrolytic condenser.

Abstract: The present invention provides a solid electrolytic condenser including a condenser element with anode polarity; an anode wire with one side inserted inside the condenser element and the other side projected outside the condenser element; and an insulating layer formed by coating one surface of the condenser element and an exposed region of the anode wire adjacent to the one surface of the condenser element with a liquid insulating material through a non-contact scattering method and an apparatus and a method for forming the insulating layer of the solid electrolytic condenser.

Abstract: Disclosed is a solid electrolytic condenser and method for manufacturing the same.

Abstract: The present invention provides a solid electrolytic condenser including a condenser element with anode polarity; an anode wire with one side inserted inside the condenser element and the other side projected outside the condenser element; and an insulating layer formed by coating one surface of the condenser element and an exposed region of the anode wire adjacent to the one surface of the condenser element with a liquid insulating material through a non-contact scattering method and an apparatus and a method for forming the insulating layer of the solid electrolytic condenser.

Abstract: A chip capacitor which can be miniaturized with structural stability. In the chip capacitor, a capacitor device has a cathode layer formed on an outer surface thereof and an anode wire is protruded from a portion thereof. A cathode lead is electrically connected to the cathode layer. An anode lead is electrically connected to the anode wire through a weld reinforcement. A molding is configured to cover the capacitor device in such a way that the cathode and anode leads are only partially exposed. Protrusions are protruded from outer surfaces of the cathode and anode leads, respectively, thereby forming steps on the outer surfaces thereof. In the chip capacitor, the leads and molding are bonded with much greater strength, thus more structurally robust. Also, this prevents external moisture from penetrating inside the chip capacitor, thereby significantly enhancing moisture resistance.