Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: The present invention discloses a frame assembly for a canopy tent. The frame assembly includes a housing unit with a through hole formed therein, a sliding unit joined to the through hole, a fixing unit immovably joined to this sliding unit, a cover unit joined to the top of the housing unit, a support unit fitted into the outer circumference of said cover unit, an upper connecting pole in which a connecting socket pivotly connected to a engage slot is formed in the upper portion, and a connecting unit one end of which is pivotly connected to the connecting socket and the other end of which is pivotly connected to the sliding unit. Such a present invention provides effects that it is easy to install the canopy tent and it is possible to prevent a finger from being caught during operation thereof and safety accidents due to collision when the fixing unit comes off.