Abstract: The present invention relates to a process of recovering 3-hydroxypropionic acid, comprising: forming a 3-hydroxypropionate crystal in a concentrate containing 3-hydroxypropionic acid in the presence of an alkali metal salt, preparing a solution containing 3-hydroxypropionate crystal separated from the concentrate, stirring an acid and the solution containing 3-hydroxypropionate crystal to form a precipitate, and subjecting the precipitate to a first washing, and a slurry composition comprising a precipitate prepared in the process of recovering 3-hydroxypropionic acid and 3-hydroxypropionic acid.

Abstract: One exemplary embodiment of the present invention relates to a thermal management fluid module for a vehicle using a circulating fluid such as a refrigerant or a coolant, the thermal management fluid module including a manifold plate in which a plurality of fluid flow channels are formed, and a thermal interference avoidance unit which is coupled to the manifold plate and in which fluid flow channels having a relatively high temperature or low temperature are formed to be separated and spaced apart from other fluid flow channels among the fluid flow channels.

Abstract: The present invention relates to a method of roll-to-roll manufacturing of a 3D-patterned microstructure. Further, the present invention relates to a 3D-patterned microstructure obtained by the method. In addition, the present invention relates to a use of a 3D-patterned microstructure manufactured according to the method. Furthermore, the present invention relates to an apparatus for manufacturing a 3D-patterned microstructure, the apparatus being configured to carry out the method.

Abstract: A semiconductor design optimization system that includes: a data base configured to store design data, a training data preprocessing unit configured to preprocess the design data and generate training data, a data learning unit configured to generate a physical property prediction model by training using the training data, a physical property prediction unit configured to generate predicted physical property data including information associated with predicted physical property values for each region of a semiconductor device to be fabricated, wherein the physical property prediction unit is configured to input, into the physical property prediction model, input data including information associated with design drawings of the semiconductor device to be fabricated, and a layout generator configured generate a design layout optimized to distribute the predicted physical property values for each region of the semiconductor device to be fabricated by modifying the design drawings based on the predicted physical

Abstract: A sensing block includes a block body having a plurality of slots through which electrode leads of battery cells pass, a plurality of sensing terminals installed between the plurality of slots on a front surface of the block body, a circuit board installed on the front surface of the block body, and a connector installed on the circuit board.

Abstract: A battery cell cartridge in which a battery cell is accommodated, includes first, second, third and fourth frames formed in a quadrangular shape, wherein the first frame and the second frame extend along a horizontal direction and are spaced from each other at a predetermined interval therebetween, the first frame is positioned on an upper side and the second frame is positioned on a lower side, the third frame and the fourth frame extend along a vertical direction and are spaced from each other at a predetermined interval therebetween, and the third frame is positioned on a first side and the third frame is positioned on a second side opposite to the second frame.

Abstract: An electronic device is provided that includes a first display and a second display. The electronic device also includes a processor configured to allocate a first set of resources to the first display and a second set of resources to the second display. The first set of resources is different from the second set of resources. Each of the first set of resources and the second set of resources includes one or more of at least one available hardware resource and at least one available software resource.

Abstract: A semiconductor package may include a lower structure, a first semiconductor chip on the lower structure, the first semiconductor chip including a hot spot, a second semiconductor chip horizontally spaced apart from the first semiconductor chip on the lower structure, and a connection chip in the lower structure and connecting the first and second semiconductor chips to each other. The hot spot may vertically overlap the connection chip.

Abstract: A structure (140) for adhering to a surface so as to support a desired weight includes a substrate (110) and a polymer layer (120). The polymer layer (120) is mounted on the substrate (110). A plurality of flaps (142) are drawn from the polymer layer (120). Each of the plurality of flaps (142) have dimensions and a density so that when the plurality of flaps (142) are placed against the surface (400) and when a coherent shear force is applied thereto, the plurality of flaps (142) will adhere to the surface (400) with a strength sufficient to support the desired weight. Each of the plurality of flaps (142) includes a first side (210) and an opposite second side (212). At least one of the first side or the second side is meniscus shaped.