Patents by Inventor Jae Ko
Jae Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240149595Abstract: Disclosed herein are a printing apparatus that is mounted with roll-shaped drawable printing paper made of thermal paper whose color changes by heat, performs printing on the printing paper and cuts the printing paper via a cutter, and a printing method that is performed by the printing apparatus.Type: ApplicationFiled: November 7, 2023Publication date: May 9, 2024Inventors: Chan Wook KANG, Nam Young KIM, Hyung Jae KO, Jae Hoon JEONG
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Publication number: 20240137511Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.Type: ApplicationFiled: January 4, 2024Publication date: April 25, 2024Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITY, HANBAT NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATIONInventors: Jin-Ho LEE, Jung-Won KANG, Hyunsuk KO, Sung-Chang LIM, Dong-San JUN, Ha-Hyun LEE, Seung-Hyun CHO, Hui-Yong KIM, Hae-Chul CHOI, Dae-Hyeok GWON, Jae-Gon KIM, A-Ram BACK
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Patent number: 11955468Abstract: Provided is a light emitting element according to embodiments which includes a body including a semiconductor layer and an active layer, and a ligand including a head portion bonded to a surface of the body, an end portion spaced apart from the body, and having a positive or a negative charge, and a chain portion connecting the head portion and the end portion.Type: GrantFiled: July 17, 2020Date of Patent: April 9, 2024Assignee: Samsung Display Co., Ltd.Inventors: Yunku Jung, Sungwoon Kim, Changhee Lee, Jaekook Ha, Yunhyuk Ko, Jaehoon Kim, Minki Nam, Hyunmi Doh, Myoungjin Park, Jae Hong Park, Junwoo Park
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Patent number: 11943447Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus that perform inter-prediction using a motion vector predictor. For a candidate block in a col picture, a scaled motion vector is generated based on a motion vector of the candidate block. When the scaled motion vector indicates a target block, a motion vector predictor of the target block is generated based on the motion vector of the candidate block. The motion vector predictor is used to derive the motion vector of the target block in a specific inter-prediction mode such as a merge mode and an AMVP mode.Type: GrantFiled: July 13, 2022Date of Patent: March 26, 2024Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, INDUSTRY-ACADEMIA COOPERATION GROUP OF SEJONG UNIVERSITY, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITYInventors: Sung-Chang Lim, Jung-Won Kang, Hyunsuk Ko, Jin-Ho Lee, Ha-Hyun Lee, Dong-San Jun, Hui-Yong Kim, Yung-Lyul Lee, Nam-Uk Kim, Jae-Gon Kim
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Publication number: 20240097580Abstract: An inverter driving apparatus includes an inverter having a plurality of legs respectively corresponding to each of a plurality of phases and the control unit generating space vector modulation signals based on a phase voltage command, each of the space vector modulation signals corresponding to each of the plurality of phases, respectively, determining whether an output voltage of the inverter corresponding to at least one space vector modulation signal of the space vector modulation is in a non-linear region by determining whether each voltage of the space vector modulation signals is included in a predetermined range, generating a terminal voltage command by determining whether or not to apply an offset voltage to each of the space vector modulation signals based on the determination of the non-linear region, and controlling a turn-on state of at least one switch included in each of the plurality of legs by modulating the terminal voltage command based on pulse width modulation.Type: ApplicationFiled: November 11, 2022Publication date: March 21, 2024Applicants: Hyundai Motor Company, Kia CorporationInventors: Hyun Jae LIM, Yong Jae LEE, Young Ho CHAE, Young Kwan KO, Young Gi LEE
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Patent number: 11923343Abstract: Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on a top surface of the first semiconductor chip, and a first under-fill layer that fills a space between the package substrate and the first semiconductor chip. The package substrate includes a cavity in the package substrate, and a first vent hole that extends from a top surface of the package substrate and is in fluid communication with the cavity. The first under-fill layer extends along the first vent hole to fill the cavity.Type: GrantFiled: November 29, 2022Date of Patent: March 5, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Jaekyung Yoo, Jayeon Lee, Jae-eun Lee, Yeongkwon Ko, Jin-woo Park, Teak Hoon Lee
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Patent number: 11915515Abstract: A facial verification method and apparatus is disclosed. The facial verification method includes detecting a face region in an input image, determining whether the detected face region represents a partial face, in response to a determination that the detected face region represents the partial face, generating a synthesized image by combining image information of the detected face region and reference image information, performing a verification operation with respect to the synthesized image and predetermined first registration information, and indicating whether facial verification of the input image is successful based on a result of the performed verification operation.Type: GrantFiled: May 17, 2021Date of Patent: February 27, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Seungju Han, Minsu Ko, Deoksang Kim, Jae-Joon Han
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Patent number: 11917148Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.Type: GrantFiled: February 8, 2022Date of Patent: February 27, 2024Assignees: Electronics And Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace University, Hanbat National University Industry-Academic Cooperation FoundationInventors: Jin-Ho Lee, Jung-Won Kang, Hyunsuk Ko, Sung-Chang Lim, Dong-San Jun, Ha-Hyun Lee, Seung-Hyun Cho, Hui-Yong Kim, Hae-Chul Choi, Dae-Hyeok Gwon, Jae-Gon Kim, A-Ram Back
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Patent number: 11854991Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: October 26, 2021Date of Patent: December 26, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
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Publication number: 20220409706Abstract: A composition may increase a rate of endometrial blood flow and a composition for increasing implantation potential, including botulinum toxin or a salt thereof, and a pharmaceutical composition may preventing or treating subfertility or infertility, including botulinum toxin or a pharmaceutically acceptable salt thereof. Such compositions can increase a rate of endometrial blood flow and improve embryonic implantation potential just by being applied to the endometrium, and thus may be helpful to patients with subfertility or infertility, especially those who have repetitive failures in embryonic implantation. Since the compositions include botulinum toxin which is a substance that has been widely applied to the human body for cosmetic purposes, studies on human toxicity may have a shortened period, and thus the disclosure is very useful in economical and industrial aspects.Type: ApplicationFiled: April 28, 2020Publication date: December 29, 2022Applicant: CHA UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATIONInventors: Youn Jung KANG, Hwa Seon KOO, Jung Jae KO
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Publication number: 20220181265Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: October 26, 2021Publication date: June 9, 2022Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
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Patent number: 11158582Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.Type: GrantFiled: December 4, 2019Date of Patent: October 26, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
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Patent number: 11149185Abstract: The present invention is related to the obtaining and using of multifunctional foaming compositions with wettability modifying, corrosion inhibitory and inhibitory/dispersants mineral scale properties with high stability in environments of high temperature, high pressure and tolerance to high concentrations of divalent ions such as calcium, magnesium, strontium and barium. The multifunctional foaming compositions are obtained from the combination of supramolecular complexes resulting from interactions of alkyl amido propyl hydroxysultaines and/or alkyl amido propyl betaines and/or alkyl hydroxysultaines and/or alkyl betaines and anionic surfactant of type alkyl hydroxyl sodium sulfonate and alkenyl sulphonates of sodium, with cationic surfactants as tetra-alkyl ammonium halides and copolymers derivatives of itaconic acid/sodium vinyl sulfonate and/or terpolymers derived from itaconic acid/sodium vinyl sulphonate/aconitic acid.Type: GrantFiled: February 5, 2020Date of Patent: October 19, 2021Assignee: INSTITUTO MEXICANO DEL PETRÓLEOInventors: Raúl Hernández Altamirano, Luis Silvestre Zamudio Rivera, Violeta Yázmin Mena Cervantes, Erick Emanuel Luna Rojero, David Aarón Nieto Álvarez, Rodolfo Cisneros Devora, Mirna Pons Jiménez, Alejandro Ramírez Estrada, América Elizabeth Mendoza Aguilar, Sung Jae Ko Kim
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Patent number: 11043458Abstract: A method of manufacturing an electronic device. For example and without limitation, various aspects of the present disclosure provide a method of manufacturing an electronic device that comprises a die comprising a circuit side and a second die side opposite the circuit side, a through hole in the die that extends between the second side of the die and the circuit side of the die, an insulating layer coupled to the inner wall of the through hole, a through electrode inside of the insulating layer, a dielectric layer coupled to the second side of the die, and a conductive pad coupled to the through electrode. The through electrode and the insulating layer may, for example, extend substantially the same distance from the second side of the die.Type: GrantFiled: September 9, 2019Date of Patent: June 22, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Won Chul Do, Yong Jae Ko
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Publication number: 20210175177Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: December 4, 2019Publication date: June 10, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
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Publication number: 20200172791Abstract: The present invention is related to the obtaining and using of multifunctional foaming compositions with wettability modifying, corrosion inhibitory and inhibitory/dispersants mineral scale properties with high stability in environments of high temperature, high pressure and tolerance to high concentrations of divalent ions such as calcium, magnesium, strontium and barium. The multifunctional foaming compositions are obtained from the combination of supramolecular complexes resulting from interactions of alkyl amido propyl hydroxysultaines and/or alkyl amido propyl betaines and/or alkyl hydroxysultaines and/or alkyl betaines and anionic surfactant of type alkyl hydroxyl sodium sulfonate and alkenyl sulphonates of sodium, with cationic surfactants as tetra-alkyl ammonium halides and copolymers derivatives of itaconic acid/sodium vinyl sulfonate and/or terpolymers derived from itaconic acid/sodium vinyl sulphonate/aconitic acid.Type: ApplicationFiled: February 5, 2020Publication date: June 4, 2020Inventors: Raúl HERNÁNDEZ ALTAMIRANO, Luis Silvestre ZAMUDIO RIVERA, Violeta Yázmin MENA CERVANTES, Erick Emanuel LUNA ROJERO, David Aarón NIETO ÁLVAREZ, Rodolfo CISNEROS DEVORA, Mirna PONS JIMÉNEZ, Alejandro RAMÍREZ ESTRADA, América Elizabeth MENDOZA AGUILAR, Sung Jae Ko KIM
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Publication number: 20200126918Abstract: A method of manufacturing an electronic device. For example and without limitation, various aspects of the present disclosure provide a method of manufacturing an electronic device that comprises a die comprising a circuit side and a second die side opposite the circuit side, a through hole in the die that extends between the second side of the die and the circuit side of the die, an insulating layer coupled to the inner wall of the through hole, a through electrode inside of the insulating layer, a dielectric layer coupled to the second side of the die, and a conductive pad coupled to the through electrode. The through electrode and the insulating layer may, for example, extend substantially the same distance from the second side of the die.Type: ApplicationFiled: September 9, 2019Publication date: April 23, 2020Inventors: Won Chul Do, Yong Jae Ko
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Patent number: 10597578Abstract: The present invention is related to the obtaining and using of multifunctional foaming compositions with wettability modifying, corrosion inhibitory and inhibitory/dispersants mineral scale properties with high stability in environments of high temperature, high pressure and tolerance to high concentrations of divalent ions such as calcium, magnesium, strontium and barium. The multifunctional foaming compositions are obtained from the combination of supramolecular complexes resulting from interactions of alkyl amido propyl hydroxysultaines and/or alkyl amido propyl betaines and/or alkyl hydroxysultaines and/or alkyl betaines and anionic surfactant of type alkyl hydroxyl sodium sulfonate and alkenyl sulphonates of sodium, with cationic surfactants as tetra-alkyl ammonium halides and copolymers derivatives of itaconic acid/sodium vinyl sulfonate and/or terpolymers derived from itaconic acid/sodium vinyl sulphonate/aconitic acid.Type: GrantFiled: March 20, 2018Date of Patent: March 24, 2020Assignee: INSTITUTO MEXICANO DEL PETRÓLEOInventors: Raúl Hernández Altamirano, Luis Silvestre Zamudio Rivera, Violeta Yázmin Mena Cervantes, Erick Emanuel Luna Rojero, David Aarón Nieto Álvarez, Rodolfo Cisneros Devora, Mirna Pons Jiménez, Alejandro Ramírez Estrada, América Elizabeth Mendoza Aguilar, Sung Jae Ko Kim
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Patent number: 10579458Abstract: A device includes a connector configured to be coupled to a storage device. The device also includes a controller coupled to the connector and powered via the connector. The controller is configured to receive log data from the storage device while powered via the connector. The controller is also configured to transmit the log data via a wireless interface to a remote device.Type: GrantFiled: June 3, 2016Date of Patent: March 3, 2020Assignee: SANDISK TECHNOLOGIES LLCInventors: Jae-In Ko, Insoo Yoon, Jung Oh Kweon, Sun Mi Hwang
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Patent number: D1016837Type: GrantFiled: July 10, 2023Date of Patent: March 5, 2024Assignee: Apple Inc.Inventors: Jae Woo Chang, Patrick Lee Coffman, Nathan de Vries, Christopher P. Foss, Robert Garcia, III, Heena Ko, Stephen O. Lemay, Marcel van Os