Patents by Inventor Jae Ko

Jae Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240149595
    Abstract: Disclosed herein are a printing apparatus that is mounted with roll-shaped drawable printing paper made of thermal paper whose color changes by heat, performs printing on the printing paper and cuts the printing paper via a cutter, and a printing method that is performed by the printing apparatus.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 9, 2024
    Inventors: Chan Wook KANG, Nam Young KIM, Hyung Jae KO, Jae Hoon JEONG
  • Publication number: 20240137511
    Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.
    Type: Application
    Filed: January 4, 2024
    Publication date: April 25, 2024
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITY, HANBAT NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Jin-Ho LEE, Jung-Won KANG, Hyunsuk KO, Sung-Chang LIM, Dong-San JUN, Ha-Hyun LEE, Seung-Hyun CHO, Hui-Yong KIM, Hae-Chul CHOI, Dae-Hyeok GWON, Jae-Gon KIM, A-Ram BACK
  • Patent number: 11955468
    Abstract: Provided is a light emitting element according to embodiments which includes a body including a semiconductor layer and an active layer, and a ligand including a head portion bonded to a surface of the body, an end portion spaced apart from the body, and having a positive or a negative charge, and a chain portion connecting the head portion and the end portion.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: April 9, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Yunku Jung, Sungwoon Kim, Changhee Lee, Jaekook Ha, Yunhyuk Ko, Jaehoon Kim, Minki Nam, Hyunmi Doh, Myoungjin Park, Jae Hong Park, Junwoo Park
  • Patent number: 11943447
    Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus that perform inter-prediction using a motion vector predictor. For a candidate block in a col picture, a scaled motion vector is generated based on a motion vector of the candidate block. When the scaled motion vector indicates a target block, a motion vector predictor of the target block is generated based on the motion vector of the candidate block. The motion vector predictor is used to derive the motion vector of the target block in a specific inter-prediction mode such as a merge mode and an AMVP mode.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: March 26, 2024
    Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, INDUSTRY-ACADEMIA COOPERATION GROUP OF SEJONG UNIVERSITY, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITY
    Inventors: Sung-Chang Lim, Jung-Won Kang, Hyunsuk Ko, Jin-Ho Lee, Ha-Hyun Lee, Dong-San Jun, Hui-Yong Kim, Yung-Lyul Lee, Nam-Uk Kim, Jae-Gon Kim
  • Publication number: 20240097580
    Abstract: An inverter driving apparatus includes an inverter having a plurality of legs respectively corresponding to each of a plurality of phases and the control unit generating space vector modulation signals based on a phase voltage command, each of the space vector modulation signals corresponding to each of the plurality of phases, respectively, determining whether an output voltage of the inverter corresponding to at least one space vector modulation signal of the space vector modulation is in a non-linear region by determining whether each voltage of the space vector modulation signals is included in a predetermined range, generating a terminal voltage command by determining whether or not to apply an offset voltage to each of the space vector modulation signals based on the determination of the non-linear region, and controlling a turn-on state of at least one switch included in each of the plurality of legs by modulating the terminal voltage command based on pulse width modulation.
    Type: Application
    Filed: November 11, 2022
    Publication date: March 21, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Hyun Jae LIM, Yong Jae LEE, Young Ho CHAE, Young Kwan KO, Young Gi LEE
  • Patent number: 11923343
    Abstract: Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on a top surface of the first semiconductor chip, and a first under-fill layer that fills a space between the package substrate and the first semiconductor chip. The package substrate includes a cavity in the package substrate, and a first vent hole that extends from a top surface of the package substrate and is in fluid communication with the cavity. The first under-fill layer extends along the first vent hole to fill the cavity.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: March 5, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jaekyung Yoo, Jayeon Lee, Jae-eun Lee, Yeongkwon Ko, Jin-woo Park, Teak Hoon Lee
  • Patent number: 11915515
    Abstract: A facial verification method and apparatus is disclosed. The facial verification method includes detecting a face region in an input image, determining whether the detected face region represents a partial face, in response to a determination that the detected face region represents the partial face, generating a synthesized image by combining image information of the detected face region and reference image information, performing a verification operation with respect to the synthesized image and predetermined first registration information, and indicating whether facial verification of the input image is successful based on a result of the performed verification operation.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: February 27, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seungju Han, Minsu Ko, Deoksang Kim, Jae-Joon Han
  • Patent number: 11917148
    Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: February 27, 2024
    Assignees: Electronics And Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace University, Hanbat National University Industry-Academic Cooperation Foundation
    Inventors: Jin-Ho Lee, Jung-Won Kang, Hyunsuk Ko, Sung-Chang Lim, Dong-San Jun, Ha-Hyun Lee, Seung-Hyun Cho, Hui-Yong Kim, Hae-Chul Choi, Dae-Hyeok Gwon, Jae-Gon Kim, A-Ram Back
  • Patent number: 11854991
    Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: December 26, 2023
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
  • Publication number: 20220409706
    Abstract: A composition may increase a rate of endometrial blood flow and a composition for increasing implantation potential, including botulinum toxin or a salt thereof, and a pharmaceutical composition may preventing or treating subfertility or infertility, including botulinum toxin or a pharmaceutically acceptable salt thereof. Such compositions can increase a rate of endometrial blood flow and improve embryonic implantation potential just by being applied to the endometrium, and thus may be helpful to patients with subfertility or infertility, especially those who have repetitive failures in embryonic implantation. Since the compositions include botulinum toxin which is a substance that has been widely applied to the human body for cosmetic purposes, studies on human toxicity may have a shortened period, and thus the disclosure is very useful in economical and industrial aspects.
    Type: Application
    Filed: April 28, 2020
    Publication date: December 29, 2022
    Applicant: CHA UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Youn Jung KANG, Hwa Seon KOO, Jung Jae KO
  • Publication number: 20220181265
    Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: October 26, 2021
    Publication date: June 9, 2022
    Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
  • Patent number: 11158582
    Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: October 26, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
  • Patent number: 11149185
    Abstract: The present invention is related to the obtaining and using of multifunctional foaming compositions with wettability modifying, corrosion inhibitory and inhibitory/dispersants mineral scale properties with high stability in environments of high temperature, high pressure and tolerance to high concentrations of divalent ions such as calcium, magnesium, strontium and barium. The multifunctional foaming compositions are obtained from the combination of supramolecular complexes resulting from interactions of alkyl amido propyl hydroxysultaines and/or alkyl amido propyl betaines and/or alkyl hydroxysultaines and/or alkyl betaines and anionic surfactant of type alkyl hydroxyl sodium sulfonate and alkenyl sulphonates of sodium, with cationic surfactants as tetra-alkyl ammonium halides and copolymers derivatives of itaconic acid/sodium vinyl sulfonate and/or terpolymers derived from itaconic acid/sodium vinyl sulphonate/aconitic acid.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: October 19, 2021
    Assignee: INSTITUTO MEXICANO DEL PETRÓLEO
    Inventors: Raúl Hernández Altamirano, Luis Silvestre Zamudio Rivera, Violeta Yázmin Mena Cervantes, Erick Emanuel Luna Rojero, David Aarón Nieto Álvarez, Rodolfo Cisneros Devora, Mirna Pons Jiménez, Alejandro Ramírez Estrada, América Elizabeth Mendoza Aguilar, Sung Jae Ko Kim
  • Patent number: 11043458
    Abstract: A method of manufacturing an electronic device. For example and without limitation, various aspects of the present disclosure provide a method of manufacturing an electronic device that comprises a die comprising a circuit side and a second die side opposite the circuit side, a through hole in the die that extends between the second side of the die and the circuit side of the die, an insulating layer coupled to the inner wall of the through hole, a through electrode inside of the insulating layer, a dielectric layer coupled to the second side of the die, and a conductive pad coupled to the through electrode. The through electrode and the insulating layer may, for example, extend substantially the same distance from the second side of the die.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: June 22, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Won Chul Do, Yong Jae Ko
  • Publication number: 20210175177
    Abstract: In one example, a semiconductor device comprises a main substrate having a top side and a bottom side, a first electronic component on the top side of the main substrate, a second electronic component on the bottom side of the main substrate, a substrate structure on the bottom side of the main substrate adjacent to the second electronic component, and an encapsulant structure comprising an encapsulant top portion on the top side of the main substrate and contacting a side of the first electronic component, and an encapsulant bottom portion on the bottom side of the main substrate and contacting a side of the second electronic component and a side of the substrate structure. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: December 4, 2019
    Publication date: June 10, 2021
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Seong Kim, Yeong Beom Ko, Kwang Seok Oh, Jo Hyun Bae, Sung Woo Lim, Yun Ah Kim, Yong Jae Ko, Ji Chang Lee
  • Publication number: 20200172791
    Abstract: The present invention is related to the obtaining and using of multifunctional foaming compositions with wettability modifying, corrosion inhibitory and inhibitory/dispersants mineral scale properties with high stability in environments of high temperature, high pressure and tolerance to high concentrations of divalent ions such as calcium, magnesium, strontium and barium. The multifunctional foaming compositions are obtained from the combination of supramolecular complexes resulting from interactions of alkyl amido propyl hydroxysultaines and/or alkyl amido propyl betaines and/or alkyl hydroxysultaines and/or alkyl betaines and anionic surfactant of type alkyl hydroxyl sodium sulfonate and alkenyl sulphonates of sodium, with cationic surfactants as tetra-alkyl ammonium halides and copolymers derivatives of itaconic acid/sodium vinyl sulfonate and/or terpolymers derived from itaconic acid/sodium vinyl sulphonate/aconitic acid.
    Type: Application
    Filed: February 5, 2020
    Publication date: June 4, 2020
    Inventors: Raúl HERNÁNDEZ ALTAMIRANO, Luis Silvestre ZAMUDIO RIVERA, Violeta Yázmin MENA CERVANTES, Erick Emanuel LUNA ROJERO, David Aarón NIETO ÁLVAREZ, Rodolfo CISNEROS DEVORA, Mirna PONS JIMÉNEZ, Alejandro RAMÍREZ ESTRADA, América Elizabeth MENDOZA AGUILAR, Sung Jae Ko KIM
  • Publication number: 20200126918
    Abstract: A method of manufacturing an electronic device. For example and without limitation, various aspects of the present disclosure provide a method of manufacturing an electronic device that comprises a die comprising a circuit side and a second die side opposite the circuit side, a through hole in the die that extends between the second side of the die and the circuit side of the die, an insulating layer coupled to the inner wall of the through hole, a through electrode inside of the insulating layer, a dielectric layer coupled to the second side of the die, and a conductive pad coupled to the through electrode. The through electrode and the insulating layer may, for example, extend substantially the same distance from the second side of the die.
    Type: Application
    Filed: September 9, 2019
    Publication date: April 23, 2020
    Inventors: Won Chul Do, Yong Jae Ko
  • Patent number: 10597578
    Abstract: The present invention is related to the obtaining and using of multifunctional foaming compositions with wettability modifying, corrosion inhibitory and inhibitory/dispersants mineral scale properties with high stability in environments of high temperature, high pressure and tolerance to high concentrations of divalent ions such as calcium, magnesium, strontium and barium. The multifunctional foaming compositions are obtained from the combination of supramolecular complexes resulting from interactions of alkyl amido propyl hydroxysultaines and/or alkyl amido propyl betaines and/or alkyl hydroxysultaines and/or alkyl betaines and anionic surfactant of type alkyl hydroxyl sodium sulfonate and alkenyl sulphonates of sodium, with cationic surfactants as tetra-alkyl ammonium halides and copolymers derivatives of itaconic acid/sodium vinyl sulfonate and/or terpolymers derived from itaconic acid/sodium vinyl sulphonate/aconitic acid.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: March 24, 2020
    Assignee: INSTITUTO MEXICANO DEL PETRÓLEO
    Inventors: Raúl Hernández Altamirano, Luis Silvestre Zamudio Rivera, Violeta Yázmin Mena Cervantes, Erick Emanuel Luna Rojero, David Aarón Nieto Álvarez, Rodolfo Cisneros Devora, Mirna Pons Jiménez, Alejandro Ramírez Estrada, América Elizabeth Mendoza Aguilar, Sung Jae Ko Kim
  • Patent number: 10579458
    Abstract: A device includes a connector configured to be coupled to a storage device. The device also includes a controller coupled to the connector and powered via the connector. The controller is configured to receive log data from the storage device while powered via the connector. The controller is also configured to transmit the log data via a wireless interface to a remote device.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: March 3, 2020
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventors: Jae-In Ko, Insoo Yoon, Jung Oh Kweon, Sun Mi Hwang
  • Patent number: D1016837
    Type: Grant
    Filed: July 10, 2023
    Date of Patent: March 5, 2024
    Assignee: Apple Inc.
    Inventors: Jae Woo Chang, Patrick Lee Coffman, Nathan de Vries, Christopher P. Foss, Robert Garcia, III, Heena Ko, Stephen O. Lemay, Marcel van Os