Patents by Inventor Jae Kon SUH

Jae Kon SUH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BINDER COMPOSITION FOR ALL SOLID STATE SECONDARY BATTERY AND METHOD FOR PRODUCING THE SAME, SLURRY COMPOSITION AND ALL SOLID STATE SECONDARY BATTERY COMPRISING THE SAME
    Publication number: 20240154123
    Abstract: Disclosed are a binder composition for an all-solid-state secondary battery, including a copolymer including a conjugated diene-based monomer, an aromatic vinyl-based monomer, and an ethylenically unsaturated acid monomer, a trithiocarbonate-based compound, a mercaptan-based compound, and a solvent, wherein a weight average molecular weight (Mw) of the copolymer is 50,000 to 200,000, and a molecular weight distribution (Mw/Mn) is 1 to 5, a method of preparing the same, a slurry composition for a cathode or a solid electrolyte including the same, and a secondary battery manufactured therefrom.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 9, 2024
    Applicant: KOREA KUMHO PETROCHEMICAL CO., LTD.
    Inventors: Jeong Geun KIM, Jae Kon SUH, In Oh SONG, Young Gil CHOI
  • Composition for emulsion polymerization and rubber compound prepared using the same
    Patent number: 11884766
    Abstract: Provided is a composition for emulsion polymerization which includes: an asymmetric compound represented by the following Chemical Formula 1; an aromatic vinyl monomer; and a conjugated diene-based monomer, and a rubber compound prepared from the same. (in Chemical Formula 1, X is a C1-C10 alkoxy group.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: January 30, 2024
    Assignees: Korea Kumba Petrochemical Co., Ltd., Pusan National University Industry-University Cooperation Foundation, Kwangwoon University Industry-Academic Collaboration
    Inventors: Jae-Kon Suh, Gwanghoon Kwag, Duseong Ahn, Wonho Kim, Kiwon Hwang, Sanghoon Song, Heung Bae Jeon, Jinyoung Jung, Yuyeong Kang
  • Composition for seeded polymerization, a seed copolymer and a method for preparing the same
    Patent number: 11802172
    Abstract: A composition for seeded polymerization includes: a compound having dithioate; a mercaptan compound; an aromatic vinyl monomer; and a conjugated diene monomer.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: October 31, 2023
    Assignee: Korea Kumho Petrochemical Co., Ltd.
    Inventors: Du Seong Ahn, Gwanghoon Kwag, Jae Kon Suh
  • Composition for seeded polymerization, a conjugated diene copolymer, an molded body, and a method for preparing the same
    Patent number: 11692054
    Abstract: A composition for seeded polymerization includes: a seed copolymer which has a compound having dithioate, a mercaptan compound, a first aromatic vinyl monomer, and a first conjugated diene monomer, and has an average particle diameter of 10-30 nm; a second aromatic vinyl monomer; and a second conjugated diene monomer.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: July 4, 2023
    Assignee: Korea Kumho Petrochemical Co., Ltd.
    Inventors: Du Seong Ahn, Gwanghoon Kwag, Jae Kon Suh
  • COMPOSITION FOR EMULSION POLYMERIZATION AND RUBBER COMPOUND PREPARED USING THE SAME
    Publication number: 20220127404
    Abstract: Provided is a composition for emulsion polymerization which includes: an asymmetric compound represented by the following Chemical Formula 1; an aromatic vinyl monomer; and a conjugated diene-based monomer, and a rubber compound prepared from the same. (in Chemical Formula 1, X is a C1-C10 alkoxy group.
    Type: Application
    Filed: October 25, 2021
    Publication date: April 28, 2022
    Inventors: Jae-Kon SUH, Gwanghoon KWAG, Duseong AHN, Wonho KIM, Kiwon HWANG, Sanghoon SONG, Heung Bae JEON, Jinyoung JUNG, Yuyeong KANG
  • COMPOSITION FOR SEEDED POLYMERIZATION, A CONJUGATED DIENE COPOLYMER, AN MOLDED BODY, AND A METHOD FOR PREPARING THE SAME
    Publication number: 20200199278
    Abstract: A composition for seeded polymerization includes: a seed copolymer which has a compound having dithioate, a mercaptan compound, a first aromatic vinyl monomer, and a first conjugated diene monomer, and has an average particle diameter of 10-30 nm; a second aromatic vinyl monomer; and a second conjugated diene monomer.
    Type: Application
    Filed: October 23, 2019
    Publication date: June 25, 2020
    Inventors: Du Seong AHN, Gwanghoon KWAG, Jae Kon SUH
  • COMPOSITION FOR SEEDED POLYMERIZATION, A SEED COPOLYMER AND A METHOD FOR PREPARING THE SAME
    Publication number: 20200172648
    Abstract: A composition for seeded polymerization includes: a compound having dithioate; a mercaptan compound; an aromatic vinyl monomer; and a conjugated diene monomer.
    Type: Application
    Filed: October 23, 2019
    Publication date: June 4, 2020
    Inventors: Du Seong AHN, Gwanghoon KWAG, Jae Kon SUH