Patents by Inventor Jae Ku

Jae Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12269124
    Abstract: A laser apparatus and a method for manufacturing a display device are provided. A laser apparatus includes: a stage; a laser providing unit above the stage and configured to provide a laser beam; a scanner configured to adjust an optical path of the laser beam such that the laser beam is irradiated to an irradiation line formed above the stage; and a control unit to control an operation of the scanner, and the scanner includes a shutter located on an optical path of the laser beam emitted from the laser providing unit and configured to perform an opening/closing operation.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: April 8, 2025
    Assignees: Samsung Display Co., Ltd., Philoptics Co., Ltd.
    Inventors: Sung Ho Noh, Jae Yoon Jeong, Jun Ho Sim, Jae Ku Han
  • Patent number: 12138832
    Abstract: Provided is a stack molding machine including an upper mold having formed therein a first runner and a first gate serving as a path of a resin material, a first intermediate plate provided under and combined with the upper mold, and having formed therein a first molding connected to the first gate to mold at least a portion on a first substrate placed under the first intermediate plate, a dummy plate provided under and spaced a certain distance apart from the first intermediate plate, a second intermediate plate provided under the dummy plate, and having formed therein a second molding connected to a second gate to mold at least a portion under a second substrate placed under the dummy plate, and a lower mold having formed therein a second runner and the second gate serving as a path of the resin material, and combined with the second intermediate plate.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: November 12, 2024
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Sang Hoon Ahn, Jae Ku Park, Eun Bin Lee, Sang Dae Kim, Dong Jin Jang
  • Publication number: 20230249188
    Abstract: A pouch for in-vitro diagnostic items having a pocket portion of a diagnosis item with a storage space of the diagnosis item therein, including a buffer supporter formation portion, wherein the buffer supporter formation portion is formed by extending in a plate shape from one side of the pocket portion of the diagnosis item, a buffer support hole is formed penetratingly in a thickness direction in one area of the buffer supporter formation portion, and a buffer supporter is formed by bending motion in the buffer supporter formation portion separated from the pocket portion of the diagnosis item, wherein the buffer supporter includes a buffer-mounted shelf for mounting the buffer, a left leg portion for supporting shelf to support the left end of the buffer-mounted shelf against the bottom, and a right leg portion for supporting shelf to support the right end of the buffer-mounted shelf against the bottom.
    Type: Application
    Filed: December 6, 2022
    Publication date: August 10, 2023
    Inventor: Jae Ku PARK
  • Publication number: 20220396016
    Abstract: Provided is a stack molding machine including an upper mold having formed therein a first runner and a first gate serving as a path of a resin material, a first intermediate plate provided under and combined with the upper mold, and having formed therein a first molding connected to the first gate to mold at least a portion on a first substrate placed under the first intermediate plate, a dummy plate provided under and spaced a certain distance apart from the first intermediate plate, a second intermediate plate provided under the dummy plate, and having formed therein a second molding connected to a second gate to mold at least a portion under a second substrate placed under the dummy plate, and a lower mold having formed therein a second runner and the second gate serving as a path of the resin material, and combined with the second intermediate plate.
    Type: Application
    Filed: April 26, 2022
    Publication date: December 15, 2022
    Inventors: Hyuk Hwi NA, Ho Seok HWANG, Sang Hoon AHN, Jae Ku PARK, Eun Bin LEE, Sang Dae KIM, Dong Jin JANG
  • Publication number: 20220263050
    Abstract: A display device including a substrate and a stacked structure on the substrate. The substrate has a first hole, and the stacked structure has a second hole. The second hole partially overlaps the first hole and has an edge outside the first hole in a plan view. The substrate has a substrate exposed portion exposed to the second hole, and the substrate exposed portion is partially depressed in an edge direction of the second hole.
    Type: Application
    Filed: February 15, 2022
    Publication date: August 18, 2022
    Inventors: Jong Duk ROH, Kwang Min LEE, Sang Ik LEE, Jae Ku HAN
  • Patent number: 11375623
    Abstract: A method of fabricating a battery protection circuit package according to one aspect of the present invention includes forming a first mounting structure by mounting battery protection circuit elements on a printed circuit board (PCB), forming a second mounting structure by mounting the first mounting structure on a lead frame which comprises an input/output terminal portion for external connection and at least one metal tab for battery cell connection, forming an encapsulation structure by encapsulating the second mounting structure with a molding material to encapsulate at least a part of the battery protection circuit elements while exposing the input/output terminal portion and the at least one metal tab of the lead frame, and bonding at least one flexible printed circuit board (FPCB) to the input/output terminal portion of the encapsulation structure.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: June 28, 2022
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Young Seok Kim, Sang Hoon Ahn, Jae Ku Park, Sung Hee Wang, Eun Bin Lee
  • Publication number: 20220143757
    Abstract: An apparatus for manufacturing a display device and a method for manufacturing a display device are provided. An embodiment of an apparatus for manufacturing a display device includes a laser module configured to emit a laser beam and a first optical system disposed on one side of the laser module such that the laser beam is provided to the first optical system, wherein the first optical system controls an energy profile of the laser beam, wherein, on a first irradiation surface positioned at one side in a traveling direction of the laser beam from a focal point of the laser beam, the energy profile of the laser beam includes a first increase and then a first decrease in energy along a line parallel to the first irradiation surface from an outer perimeter of the laser beam toward a center of the laser beam, and wherein the energy profile of the laser beam includes a first peak corresponding to where the energy begins to decrease.
    Type: Application
    Filed: August 19, 2021
    Publication date: May 12, 2022
    Inventors: Jong Duk ROH, Kwang Min LEE, Jae Ku HAN
  • Publication number: 20220023976
    Abstract: A laser apparatus and a method for manufacturing a display device are provided. A laser apparatus includes: a stage; a laser providing unit above the stage and configured to provide a laser beam; a scanner configured to adjust an optical path of the laser beam such that the laser beam is irradiated to an irradiation line formed above the stage; and a control unit to control an operation of the scanner, and the scanner includes a shutter located on an optical path of the laser beam emitted from the laser providing unit and configured to perform an opening/closing operation.
    Type: Application
    Filed: July 21, 2021
    Publication date: January 27, 2022
    Inventors: Sung Ho NOH, Jae Yoon JEONG, Jun Ho SIM, Jae Ku HAN
  • Patent number: 10966320
    Abstract: The present invention relates to a gap supporter for a printed circuit board, and a package including a gap supporter for a printed circuit board and an insulation sheet coupled thereto. A gap supporter for a printed circuit board includes a fixed body part which has a metal thin-film formed on the surface of the lower end thereof, and is fixed to one surface of the printed circuit board by soldering of the metal thin-film; a clamping groove formed in a groove shape on the fixed body part, and having an insulation sheet inserted and clamped thereto to protect an element on one surface of the printed circuit board; and an anti-separation part formed on the other end of the fixed body part so as to be defined by the clamping groove, so as to fix the insulation sheet and prevent the insulation sheet from being separated.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: March 30, 2021
    Assignees: GNE TECH CO., LTD.
    Inventor: Jae Ku Kim
  • Patent number: 10950845
    Abstract: Provided is a battery protection circuit module package capable of easily achieving high integration and size reduction. The battery protection circuit module package includes a terminal lead frame including a first internal connection terminal lead and a second internal connection terminal lead provided at two edges of the terminal lead frame and electrically connected to electrode terminals of a battery bare cell, and a plurality of external connection terminal leads provided between the first and second internal connection terminal leads and serving as a plurality of external connection terminals, and a device package including a substrate mounted on the terminal lead frame to be electrically connected to the terminal lead frame, and providing a battery protection circuit device thereon.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: March 16, 2021
    Assignee: ITM SEMICONDUCTOR CO., LTD
    Inventors: Ho-seok Hwang, Young-Seok Kim, Seong-beom Park, Sang-hoon Ahn, Tae Hwan Jung, Seung-uk Park, Jae-ku Park, Myoung-Ki Moon, Hyun-suck Lee, Da-Woon Jung
  • Publication number: 20210059051
    Abstract: The present invention relates to a gap supporter for a printed circuit board, and a package including a gap supporter for a printed circuit board and an insulation sheet coupled thereto. A gap supporter for a printed circuit board includes a fixed body part which has a metal thin-film formed on the surface of the lower end thereof, and is fixed to one surface of the printed circuit board by soldering of the metal thin-film; a clamping groove formed in a groove shape on the fixed body part, and having an insulation sheet inserted and clamped thereto to protect an element on one surface of the printed circuit board; and an anti-separation part formed on the other end of the fixed body part so as to be defined by the clamping groove, so as to fix the insulation sheet and prevent the insulation sheet from being separated.
    Type: Application
    Filed: September 20, 2018
    Publication date: February 25, 2021
    Inventor: Jae Ku KIM
  • Publication number: 20210014976
    Abstract: A method of fabricating a battery protection circuit package according to one aspect of the present invention includes forming a first mounting structure by mounting battery protection circuit elements on a printed circuit board (PCB), forming a second mounting structure by mounting the first mounting structure on a lead frame which comprises an input/output terminal portion for external connection and at least one metal tab for battery cell connection, forming an encapsulation structure by encapsulating the second mounting structure with a molding material to encapsulate at least a part of the battery protection circuit elements while exposing the input/output terminal portion and the at least one metal tab of the lead frame, and bonding at least one flexible printed circuit board (FPCB) to the input/output terminal portion of the encapsulation structure.
    Type: Application
    Filed: June 22, 2020
    Publication date: January 14, 2021
    Inventors: Hyuk Hwi NA, Ho Seok HWANG, Young Seok KIM, Sang Hoon AHN, Jae Ku PARK, Sung Hee WANG, Eun Bin LEE
  • Publication number: 20190157653
    Abstract: Provided is a battery protection circuit module package capable of easily achieving high integration and size reduction. The battery protection circuit module package includes a terminal lead frame including a first internal connection terminal lead and a second internal connection terminal lead provided at two edges of the terminal lead frame and electrically connected to electrode terminals of a battery bare cell, and a plurality of external connection terminal leads provided between the first and second internal connection terminal leads and serving as a plurality of external connection terminals, and a device package including a substrate mounted on the terminal lead frame to be electrically connected to the terminal lead frame, and providing a battery protection circuit device thereon.
    Type: Application
    Filed: January 22, 2019
    Publication date: May 23, 2019
    Inventors: Ho-seok HWANG, Young-Seok KIM, Seong-beom PARK, Sang-hoon AHN, Tae Hwan JUNG, Seung-uk PARK, Jae-ku PARK, Myoung-Ki MOON, Hyun-suck LEE, Da-Woon JUNG
  • Patent number: 10166543
    Abstract: Provided is a cell capturing cartridge. According to an embodiment of the inventive concept, the cell capturing cartridge may include a substrate and structures provided on an upper surface of the substrate and constituting a plurality of rows that are parallel to a row direction. The structures in one row may be offset from the structures in the neighboring rows in the row direction. Each of the substrates may have a first side surface facing one side of the substrate and a second side surface disposed opposite to the first side surface and having a width greater than that of the first side surface.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: January 1, 2019
    Assignees: Electronics and Telecommunications Research Institute, GenoBio Corp.
    Inventors: Dae-Sik Lee, Jeong Won Park, Moon Youn Jung, Do Hyung Kim, Jae Ku Lee, Hun Seok Lee
  • Publication number: 20180178221
    Abstract: The present invention relates to a magnetic iron particle (MIP) separating system for separating the magnetic beads existing in the mixed solution.
    Type: Application
    Filed: April 1, 2016
    Publication date: June 28, 2018
    Inventors: JAE KU LEE, SUNG HOON PARK, JU HYUN HWANG, GWANG YEOL PARK
  • Patent number: 9787111
    Abstract: Disclosed is a battery protection module package (PMP). The battery PMP according to an embodiment of the present invention includes a lead frame provided with a plurality of external terminals thereon, a printed circuit board stacked on the lead frame, and a plurality of internal terminals, a protection integrated chip (IC), a field effect transistor (FET), resistors, and capacitors disposed on the printed circuit board and electrically connected to each other, wherein the resistors and the capacitors are mounted on a pattern of the printed circuit board using surface mount technology (SMT), and wherein the plurality of internal terminals are electrically connected to the plurality of external terminals.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: October 10, 2017
    Assignee: ITM SEMICONDUCTOR CO., LTD
    Inventors: Hyeok Hwi Na, Ho Suk Hwang, Young Seok Kim, Sung Beum Park, Sang Hoon Ahn, Tae Hwan Jung, Seung Uk Park, Jae Ku Park, Hyun Mok Cho, Min Ho Park, Young Geun Yoon, Seong Ho Ju, Young Nam Ji, Myoung Ki Moon, Hyun Suck Lee, Ji Young Park
  • Patent number: D930588
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: September 14, 2021
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Young Seok Kim, Sang Hoon Ahn, Jae Ku Park, Sung Hee Wang, Eun Bin Lee
  • Patent number: D932436
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: October 5, 2021
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Young Seok Kim, Sang Hoon Ahn, Jae Ku Park, Sung Hee Wang, Eun Bin Lee
  • Patent number: D932437
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: October 5, 2021
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Young Seok Kim, Sang Hoon Ahn, Jae Ku Park, Sung Hee Wang, Eun Bin Lee
  • Patent number: D932438
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: October 5, 2021
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Young Seok Kim, Sang Hoon Ahn, Jae Ku Park, Sung Hee Wang, Eun Bin Lee