Patents by Inventor Jae Kun Woo

Jae Kun Woo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Camera module and method of manufacturing the same
    Patent number: 8714843
    Abstract: Camera module embodiments and methods of manufacturing camera modules are provided. A camera module can include a housing and a printed circuit board having an image sensor. The housing can be mounted to the printed circuit board using a surface mount technology. In a method of manufacturing the camera module, the image sensor and the housing can be mounted to the printed circuit board, and a lens and a filter can be coupled to an upper portion of the housing.
    Type: Grant
    Filed: July 20, 2010
    Date of Patent: May 6, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventor: Jae Kun Woo
  • CAMERA MODULE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20100278524
    Abstract: Camera module embodiments and methods of manufacturing camera modules are provided. A camera module can include a housing and a printed circuit board having an image sensor. The housing can be mounted to the printed circuit board using a surface mount technology. In a method of manufacturing the camera module, the image sensor and the housing can be mounted to the printed circuit board, and a lens and a filter can be coupled to an upper portion of the housing.
    Type: Application
    Filed: July 20, 2010
    Publication date: November 4, 2010
    Inventor: Jae Kun Woo
  • Camera module and method of manufacturing the same
    Patent number: 7780365
    Abstract: Camera module embodiments and methods of manufacturing camera modules are provided. A camera module can include a housing and a printed circuit board having an image sensor. The housing can be mounted to the printed circuit board using a surface mount technology. In a method of manufacturing the camera module, the image sensor and the housing can be mounted to the printed circuit board, and a lens and a filter can be coupled to an upper portion of the housing.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: August 24, 2010
    Assignee: LG Innotek Co., Ltd.
    Inventor: Jae Kun Woo
  • Camera Module and Method of Manufacturing The same
    Publication number: 20070212061
    Abstract: Camera module embodiments and methods of manufacturing camera modules are provided. A camera module can include a housing and a printed circuit board having an image sensor. The housing can be mounted to the printed circuit board using a surface mount technology. In a method of manufacturing the camera module, the image sensor and the housing can be mounted to the printed circuit board, and a lens and a filter can be coupled to an upper portion of the housing.
    Type: Application
    Filed: March 12, 2007
    Publication date: September 13, 2007
    Inventor: Jae Kun Woo