Abstract: A stator for a drive motor includes: a segmented stator core including a plurality of mounting portions; a bobbin equipped on each mounting portion of the plurality of the mounting portions and having a coil wound thereon; a first casing and a second casing coupled to the bobbin, respectively, at opposite sides of the bobbin with respect to the segmented stator core, and configured to enclose the coil; a passage formed in one of the first casing or the second casing, and configured to allow fluid communication with the inside of the first casing and the second casing; and a terminal portion integrally formed in a remaining one of the first casing or the second casing and configured to allow connection of the coil.

Abstract: The present embodiment relates to a DC-DC converter including: a housing; a plurality of electronic components disposed inside the housing; and a flow path disposed on a lower plate of the housing. The flow path includes an expanding portion. The horizontal width of the expanding portion is greater than the horizontal width of a flow path on the front end of the expanding portion, and the vertical width of the expanding portion is less than the vertical width of the flow path on the front end of the expanding portion. The differential between the part wherein the surface area of the vertical cross section of the flow path is the biggest and the part wherein the surface area of the vertical cross section of the flow path is the smallest is 10% or less.

Abstract: The present invention relates to a method and apparatus for unsupervised domain adaptation, including the steps of generating a first augmented domain associated with a source domain, generating a second augmented domain associated with a target domain, and performing unsupervised domain adaptation by using the first augmented domain and the second augmented domain as a bridge for connecting the source domain and the target domain, and it is possible to apply to other exemplary embodiments.

Abstract: A method of wirelessly connecting a first device to a target device is provided. The method includes searching for at least one device located in an orientation region of the first device, when a first input signal is received, determining the target device based on a direction that the first device is oriented, performing a wireless connection with the target device, and determining whether to maintain the wireless connection with the target device, when a second input signal is received.

Abstract: The present embodiment relates to a DC-DC converter including: a housing; a plurality of electronic components disposed inside the housing; and a flow path disposed on a lower plate of the housing. The flow path includes an expanding portion. The horizontal width of the expanding portion is greater than the horizontal width of a flow path on the front end of the expanding portion, and the vertical width of the expanding portion is less than the vertical width of the flow path on the front end of the expanding portion. The differential between the part wherein the surface area of the vertical cross section of the flow path is the biggest and the part wherein the surface area of the vertical cross section of the flow path is the smallest is 10% or less.

Abstract: A semiconductor device having an EMI shield layer and/or EMI shielding wires, and a manufacturing method thereof, are provided. In an example embodiment, the semiconductor device includes a semiconductor die, an EMI shield layer shielding the semiconductor die, and an encapsulating portion encapsulating the EMI shield layer. In another example embodiment, the semiconductor device further includes EMI shielding wires extending from the EMI shield layer and shielding the semiconductor die.

Abstract: A semiconductor device having an EMI shield layer and/or EMI shielding wires, and a manufacturing method thereof, are provided. In an example embodiment, the semiconductor device includes a semiconductor die, an EMI shield layer shielding the semiconductor die, and an encapsulating portion encapsulating the EMI shield layer. In another example embodiment, the semiconductor device further includes EMI shielding wires extending from the EMI shield layer and shielding the semiconductor die.