Patents by Inventor Jae Min Na

Jae Min Na has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11605999
    Abstract: A stator for a drive motor includes: a segmented stator core including a plurality of mounting portions; a bobbin equipped on each mounting portion of the plurality of the mounting portions and having a coil wound thereon; a first casing and a second casing coupled to the bobbin, respectively, at opposite sides of the bobbin with respect to the segmented stator core, and configured to enclose the coil; a passage formed in one of the first casing or the second casing, and configured to allow fluid communication with the inside of the first casing and the second casing; and a terminal portion integrally formed in a remaining one of the first casing or the second casing and configured to allow connection of the coil.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: March 14, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Jae Min Yu, Hyoung Jun Cho, Jae Won Ha, Myung Kyu Jeong, Yong Sung Jang, Deok Hwan Na, Young Jin Seo, Dong Yeon Han
  • Patent number: 11575313
    Abstract: The present embodiment relates to a DC-DC converter including: a housing; a plurality of electronic components disposed inside the housing; and a flow path disposed on a lower plate of the housing. The flow path includes an expanding portion. The horizontal width of the expanding portion is greater than the horizontal width of a flow path on the front end of the expanding portion, and the vertical width of the expanding portion is less than the vertical width of the flow path on the front end of the expanding portion. The differential between the part wherein the surface area of the vertical cross section of the flow path is the biggest and the part wherein the surface area of the vertical cross section of the flow path is the smallest is 10% or less.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: February 7, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ji Hoon Kim, Geun Ho Kim, Hyun Min Na, Jae Hoo Jung, Seok Bae, Jai Hoon Yeom
  • Publication number: 20220383047
    Abstract: The present invention relates to a method and apparatus for unsupervised domain adaptation, including the steps of generating a first augmented domain associated with a source domain, generating a second augmented domain associated with a target domain, and performing unsupervised domain adaptation by using the first augmented domain and the second augmented domain as a bridge for connecting the source domain and the target domain, and it is possible to apply to other exemplary embodiments.
    Type: Application
    Filed: December 28, 2021
    Publication date: December 1, 2022
    Applicant: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Won Jun HWANG, Jae Min NA
  • Patent number: 11483673
    Abstract: A method of wirelessly connecting a first device to a target device is provided. The method includes searching for at least one device located in an orientation region of the first device, when a first input signal is received, determining the target device based on a direction that the first device is oriented, performing a wireless connection with the target device, and determining whether to maintain the wireless connection with the target device, when a second input signal is received.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: October 25, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kang-min Lee, Hyun-geun Jo, Hyung-rae Cho, Gi-ppeum Choi, Jae-keun Na, Young-eun Lee
  • Publication number: 20220247305
    Abstract: The present embodiment relates to a DC-DC converter including: a housing; a plurality of electronic components disposed inside the housing; and a flow path disposed on a lower plate of the housing. The flow path includes an expanding portion. The horizontal width of the expanding portion is greater than the horizontal width of a flow path on the front end of the expanding portion, and the vertical width of the expanding portion is less than the vertical width of the flow path on the front end of the expanding portion. The differential between the part wherein the surface area of the vertical cross section of the flow path is the biggest and the part wherein the surface area of the vertical cross section of the flow path is the smallest is 10% or less.
    Type: Application
    Filed: January 14, 2022
    Publication date: August 4, 2022
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Ji Hoon KIM, Geun Ho KIM, Hyun Min NA, Jae Hoo JUNG, Seok BAE, Jai Hoon YEOM
  • Patent number: 10497650
    Abstract: A semiconductor device having an EMI shield layer and/or EMI shielding wires, and a manufacturing method thereof, are provided. In an example embodiment, the semiconductor device includes a semiconductor die, an EMI shield layer shielding the semiconductor die, and an encapsulating portion encapsulating the EMI shield layer. In another example embodiment, the semiconductor device further includes EMI shielding wires extending from the EMI shield layer and shielding the semiconductor die.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: December 3, 2019
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Soo Hyun Kim, Jae Min Na, Dae Gon Kim, Tae Kyung Hwang, Kwang Mo Chris Lim, SungSun Park, KyeRyung Kim
  • Publication number: 20180301420
    Abstract: A semiconductor device having an EMI shield layer and/or EMI shielding wires, and a manufacturing method thereof, are provided. In an example embodiment, the semiconductor device includes a semiconductor die, an EMI shield layer shielding the semiconductor die, and an encapsulating portion encapsulating the EMI shield layer. In another example embodiment, the semiconductor device further includes EMI shielding wires extending from the EMI shield layer and shielding the semiconductor die.
    Type: Application
    Filed: April 13, 2017
    Publication date: October 18, 2018
    Inventors: Soo Hyun Kim, Jae Min Na, Dae Gon Kim, Tae Kyung Hwang, Kwang Mo Chris Lim, SungSun Park, KyeRyung Kim