Patents by Inventor Jae Min Na

Jae Min Na has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for unsupervised domain adaptation
    Patent number: 12039010
    Abstract: The present invention relates to a method and apparatus for unsupervised domain adaptation, including the steps of generating a first augmented domain associated with a source domain, generating a second augmented domain associated with a target domain, and performing unsupervised domain adaptation by using the first augmented domain and the second augmented domain as a bridge for connecting the source domain and the target domain, and it is possible to apply to other exemplary embodiments.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: July 16, 2024
    Assignee: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Won Jun Hwang, Jae Min Na
  • METHOD AND APPARATUS FOR UNSUPERVISED DOMAIN ADAPTATION
    Publication number: 20220383047
    Abstract: The present invention relates to a method and apparatus for unsupervised domain adaptation, including the steps of generating a first augmented domain associated with a source domain, generating a second augmented domain associated with a target domain, and performing unsupervised domain adaptation by using the first augmented domain and the second augmented domain as a bridge for connecting the source domain and the target domain, and it is possible to apply to other exemplary embodiments.
    Type: Application
    Filed: December 28, 2021
    Publication date: December 1, 2022
    Applicant: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Won Jun HWANG, Jae Min NA
  • Semiconductor device and manufacturing method thereof
    Patent number: 10497650
    Abstract: A semiconductor device having an EMI shield layer and/or EMI shielding wires, and a manufacturing method thereof, are provided. In an example embodiment, the semiconductor device includes a semiconductor die, an EMI shield layer shielding the semiconductor die, and an encapsulating portion encapsulating the EMI shield layer. In another example embodiment, the semiconductor device further includes EMI shielding wires extending from the EMI shield layer and shielding the semiconductor die.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: December 3, 2019
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Soo Hyun Kim, Jae Min Na, Dae Gon Kim, Tae Kyung Hwang, Kwang Mo Chris Lim, SungSun Park, KyeRyung Kim
  • SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20180301420
    Abstract: A semiconductor device having an EMI shield layer and/or EMI shielding wires, and a manufacturing method thereof, are provided. In an example embodiment, the semiconductor device includes a semiconductor die, an EMI shield layer shielding the semiconductor die, and an encapsulating portion encapsulating the EMI shield layer. In another example embodiment, the semiconductor device further includes EMI shielding wires extending from the EMI shield layer and shielding the semiconductor die.
    Type: Application
    Filed: April 13, 2017
    Publication date: October 18, 2018
    Inventors: Soo Hyun Kim, Jae Min Na, Dae Gon Kim, Tae Kyung Hwang, Kwang Mo Chris Lim, SungSun Park, KyeRyung Kim