Patents by Inventor Jae Mook Kim

Jae Mook Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240171197
    Abstract: A bit interleaver, a bit-interleaved coded modulation (BICM) device and a bit interleaving method are disclosed herein. The bit interleaver includes a first memory, a processor, and a second memory. The first memory stores a low-density parity check (LDPC) codeword having a length of 64800 and a code rate of 7/15. The processor generates an interleaved codeword by interleaving the LDPC codeword on a bit group basis. The size of the bit group corresponds to a parallel factor of the LDPC codeword. The second memory provides the interleaved codeword to a modulator for quadrature phase shift keying (QPSK) modulation.
    Type: Application
    Filed: January 31, 2024
    Publication date: May 23, 2024
    Inventors: Sung-Ik PARK, Sun-Hyoung KWON, Jae-Young LEE, Heung-Mook KIM, Nam-Ho HUR
  • Patent number: 11943090
    Abstract: An apparatus and method for multiplexing signals using layered division multiplexing are disclosed. A signal multiplexing apparatus according to an embodiment of the present invention includes a combiner configured to combine a core layer signal and an enhanced layer signal at different power levels, and a time interleaver configured to perform interleaving applied to both the core layer signal and the enhanced layer signal.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: March 26, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Sung-Ik Park, Jae-Young Lee, Sun-Hyoung Kwon, Heung-Mook Kim, Nam-Ho Hur
  • Publication number: 20240098880
    Abstract: The present disclosure relates to an electronic device, and more specifically, to an electronic device including a printed circuit board including a heat-generating element arranged on one surface thereof, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element. Accordingly, the present disclosure provides an advantage of improving heat dissipation performance without increasing the thickness of the printed circuit board.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: KMW INC.
    Inventors: Bae Mook JEONG, Kyo Sung JI, Seong Min AHN, Chi Back RYU, Jae Eun KIM, Seung Min LEE, Ki Hun PARK, Won Jun PARK, Jun Woo YANG
  • Publication number: 20240098885
    Abstract: A communication apparatus is provided to include an apparatus enclosure that includes a substrate seating surface and at least one or more connection grooves formed on the substrate seating surface, a first printed circuit board disposed on the substrate seating surface, a second printed circuit board disposed on the substrate seating surface on one side of the first printed circuit board, and at least one or more connectors disposed within the connection groove and configured to electrically connect the first printed circuit board and the second printed circuit board.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Applicant: KMW INC.
    Inventors: Bae Mook JEONG, Kyo Sung JI, Seong Min AHN, Chi Back RYU, Jae Eun KIM, Seung Min LEE, Ki Hun PARK, Won Jun PARK, Duk Yong KIM
  • Publication number: 20240088553
    Abstract: The present invention relates to a signal shielding apparatus and an antenna apparatus including same, and in particular, comprises a shield cover which is stacked and disposed on a printed board assembly (hereinafter, abbreviated to “PBA”), in which a plurality of signal-related components are mounted on one side thereof to prevent leakage of a signal from the plurality of signal-related components, wherein a grooved shield cover seating groove is formed in one surface of the PBA, and an insertion end insertably seated in the shield cover seating groove is integrally formed in the other surface from among one surface and the other surface of the shield cover, the other surface facing the one surface of the PBA, thereby providing advantages in that an increase in the manufacturing cost may be prevented, EMI shielding may be facilitated, and heat dissipation performance may be significantly improved.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Bae Mook JEONG, Kyo Sung JI, Chi Back RYU, Won Jun PARK, Jun Woo YANG, Seong Min AHN, Ki Hun PARK, Jae Eun KIM
  • Patent number: 11923872
    Abstract: A bit interleaver, a bit-interleaved coded modulation (BICM) device and a bit interleaving method are disclosed herein. The bit interleaver includes a first memory, a processor, and a second memory. The first memory stores a low-density parity check (LDPC) codeword having a length of 64800 and a code rate of 7/15. The processor generates an interleaved codeword by interleaving the LDPC codeword on a bit group basis. The size of the bit group corresponds to a parallel factor of the LDPC codeword. The second memory provides the interleaved codeword to a modulator for quadrature phase shift keying (QPSK) modulation.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: March 5, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Sung-Ik Park, Sun-Hyoung Kwon, Jae-Young Lee, Heung-Mook Kim, Nam-Ho Hur
  • Patent number: 6049116
    Abstract: A structure and the fabrication method of two-color IR detector are disclosed. Disclosed two-color IR detector structure is a n-p-N structure which can be realized using only two-layer HgCdTe. The most important factor in the two-color IR detector structure is the formation of the potential barrier in the conduction band of p-N heterojunction. This potential barrier prevents photogenerated minority carriers in p-HgCdTe region from diffusing to and being collected by N-HgCdTe region (larger band gap diode). The calculated potential barrier heights under the thermal equilibrium at 77 K are 21 kT (141 meV) and 13.4 kT (89 meV) for the cases of p-Hg.sub.0.78 Cd.sub.0.22 Te/N-Hg.sub.0.69 Cd.sub.0.3l Te and p-Hg.sub.0.69 Cd.sub.0.31 Te/N-Hg.sub.0.636 Cd.sub.0.364 Te with each side carrier concentration of 5.times.10.sup.15 and 1.times.10.sub.16 cm.sup.-3, respectively.
    Type: Grant
    Filed: May 13, 1998
    Date of Patent: April 11, 2000
    Assignee: Agency for Defense Development
    Inventors: Seung-Man Park, Jae Ryong Yoon, Jae Mook Kim, Hee Chul Lee, Choong-Ki Kim