Patents by Inventor Jae Mun Hwang

Jae Mun Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for molding glass substrate
    Patent number: 10683228
    Abstract: The present invention relates to an apparatus for molding a glass substrate, and more specifically, to an apparatus for molding a glass substrate capable of forming a glass substrate in a 3D shape and preventing the shape of a vacuum hole from transferring onto the surface of the substrate.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: June 16, 2020
    Assignee: Corning Precision Materials Co., Ltd.
    Inventors: Jae Seon Hong, Myung Hwan Kim, Bong Chul Kim, Jong Hwa Kim, Duck Kyo Seo, Jae Mun Hwang
  • APPARATUS FOR MOLDING GLASS SUBSTRATE
    Publication number: 20160280576
    Abstract: The present invention relates to an apparatus for molding a glass substrate, and more specifically, to an apparatus for molding a glass substrate capable of forming a glass substrate in a 3D shape and preventing the shape of a vacuum hole from transferring onto the surface of the substrate. To this end, the present invention provides the apparatus for molding a glass substrate comprising: a molding frame; a molding groove formed on one surface of the molding frame; at least one vacuum hole formed on the molding frame at the lower portion of the molding groove and is connected to an external vacuum device; and a pressure-reducing groove, which is formed between the molding groove and the vacuum hole and allows communication between the molding groove and the vacuum hole, for reducing vacuum pressure applied to the glass substrate positioned on the molding groove through the vacuum hole.
    Type: Application
    Filed: November 4, 2014
    Publication date: September 29, 2016
    Applicant: Corning Precision Materials Co., Ltd.
    Inventors: Jae Seon Hong, Myung Hwan Kim, Bong Chul Kim, Jong Hwa Kim, Duck Kyo Seo, Jae Mun Hwang
  • Discharge valve arrangement for a hermetic type compressor
    Patent number: 5779459
    Abstract: A hermetic type compressor which makes opening and closing of a exhaust valve installed inside a reentrant groove formed in a cylinder head smooth, and prevents leakage of refrigerant from the exhaust valve by fabricating a valve seat surface to be in the same height as that of a valve fixing surface.
    Type: Grant
    Filed: August 19, 1996
    Date of Patent: July 14, 1998
    Assignee: LG Electronics, Inc.
    Inventors: Jae Sang Park, Jae Mun Hwang
  • Spacer configuration for a discharge reed valve of a hermetic type compressor
    Patent number: 5775887
    Abstract: A hermetic type compressor which makes opening and closing of a exhaust valve installed inside a reentrant groove formed in a cylinder head smooth, and prevents leakage of refrigerant from the exhaust valve by fabricating a valve seat surface to be in the same height as that of a valve fixing surface.
    Type: Grant
    Filed: August 19, 1996
    Date of Patent: July 7, 1998
    Assignee: L. G. Electronics Inc.
    Inventors: Jae Sang Park, Jae Mun Hwang
  • Discharge valve arrangement for a hermetic type compressor
    Patent number: 5676533
    Abstract: A hermetic type compressor which makes opening and closing of a exhaust valve installed inside a reentrant groove formed in a cylinder head smooth, and prevents leakage of refrigerant from the exhaust valve by fabricating a valve seat surface to be in the same height as that of a valve fixing surface.
    Type: Grant
    Filed: April 12, 1996
    Date of Patent: October 14, 1997
    Assignee: LG Electronics Inc.
    Inventors: Jae Sang Park, Jae Mun Hwang