Patents by Inventor Jae-myeong Cha

Jae-myeong Cha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method of manufacturing the same
    Patent number: 10964618
    Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip attached to an upper surface of the first semiconductor chip, a silicon heat-dissipation body thermally connected to at least one of the first semiconductor chip and the second semiconductor chip, and a molding member configured to surround the first semiconductor chip and the second semiconductor chip and exposing an upper surface of the silicon heat-dissipation body.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: March 30, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jang-woo Lee, Kyung-suk Oh, Yung-cheol Kong, Woo-hyun Park, Jong-bo Shim, Jae-myeong Cha
  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200168522
    Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip attached to an upper surface of the first semiconductor chip, a silicon heat-dissipation body thermally connected to at least one of the first semiconductor chip and the second semiconductor chip, and a molding member configured to surround the first semiconductor chip and the second semiconductor chip and exposing an upper surface of the silicon heat-dissipation body.
    Type: Application
    Filed: August 1, 2019
    Publication date: May 28, 2020
    Inventors: Jang-woo Lee, Kyung-suk Oh, Yung-cheol Kong, Woo-hyun Park, Jong-bo Shim, Jae-myeong Cha