Abstract: Disclosed is a wheel bearing assembly comprising a wheel hub fastened to a vehicle wheel so as to rotate as a unit and having a plurality of fastening protrusion portions, and a brake disc having a plurality of fastening protrusion portions respectively fastened to the plurality of fastening protrusion portions of the wheel hub. Thus, the wheel bearing assembly may facilitate weight reduction and improvement in ease of assembly, and enhance run-out properties of sliding surfaces of the brake disc.

Abstract: Disclosed is a wheel bearing assembly comprising a wheel hub fastened to a vehicle wheel so as to rotate as a unit and having a plurality of fastening protrusion portions, and a brake disc having a plurality of fastening protrusion portions respectively fastened to the plurality of fastening protrusion portions of the wheel hub. Thus, the wheel bearing assembly may facilitate weight reduction and improvement in ease of assembly, and enhance run-out properties of sliding surfaces of the brake disc.

Abstract: The present invention relates to a structure and a method for coupling a wheel bearing that include a wheel hub for mounting a vehicle wheel, a hollow inner ring press-fitted into an end portion of the wheel hub, an annular outer ring disposed at a radial exterior of the wheel hub and the inner ring, and rolling elements disposed between the wheel hub or the inner ring and the outer ring, wherein the wheel hub and the inner ring are splined to each other and the inner ring and the joint member are coupled through facial spline. According to the present invention, driving torque of a constant velocity joint may be stably delivered to the wheel hub and noise may be reduced.

Abstract: A wheel bearing assembly includes an outer race in which a plurality of rows of track portions are formed at an inner side thereof; a hub that is coaxially disposed with the outer race to be rotatably disposed in the outer race; an inner race that is engaged with a portion of an outside surface of the hub to rotate together with the hub; a first roller that is interposed between the hub and the outer race to be rolled; and a second roller that is interposed between the inner race and the outer race to be rolled.

Abstract: The present invention relates to a structure and a method for coupling a wheel bearing that include a wheel hub for mounting a vehicle wheel, a hollow inner ring press-fitted into an end portion of the wheel hub, an annular outer ring disposed at a radial exterior of the wheel hub and the inner ring, and rolling elements disposed between the wheel hub or the inner ring and the outer ring, wherein the wheel hub and the inner ring are splined to each other and the inner ring and the joint member are coupled through facial spline. According to the present invention, driving torque of a constant velocity joint may be stably delivered to the wheel hub and noise may be reduced.

Abstract: A three dimensional shape measurement apparatus includes m projecting sections, each of which includes a light source and a grating element, and, while moving the grating element by n times, projects a grating pattern light onto a measurement target for each movement, wherein the ‘n’ and the ‘m’ are natural numbers greater than or equal to 2, an imaging section photographing a grating pattern image reflected by the measurement target, and a control section controlling that, while photographing the grating pattern image by using one of the m projecting sections, a grating element of at least another projecting section is moved. Thus, measurement time may be reduced.

Abstract: The present invention discloses a wheel bearing assembly according to an exemplary embodiment of the present invention may include: an outer race in which a plurality of rows of track portions are formed at an inner side thereof; a hub that is coaxially disposed with the outer race to be rotatably disposed in the outer race; an inner race that is engaged with one side outside surface of the hub to rotate together with the hub; and rollers that are interposed between the hub and the outer race and between the inner race and the outer race to be rolled.

Abstract: A three dimensional shape measurement apparatus includes m projecting sections, each of which includes a light source and a grating element, and, while moving the grating element by n times, projects a grating pattern light onto a measurement target for each movement, wherein the ‘n’ and the ‘m’ are natural numbers greater than or equal to 2, an imaging section photographing a grating pattern image reflected by the measurement target, and a control section controlling that, while photographing the grating pattern image by using one of the m projecting sections, a grating element of at least another projecting section is moved. Thus, measurement time may be reduced.

Abstract: A three dimensional shape measurement apparatus includes m projecting sections, each of which includes a light source and a grating element, and, while moving the grating element by n times, projects a grating pattern light onto a measurement target for each movement, wherein the ‘n’ and the ‘m’ are natural numbers greater than or equal to 2, an imaging section photographing a grating pattern image reflected by the measurement target, and a control section controlling that, while photographing the grating pattern image by using one of the m projecting sections, a grating element of at least another projecting section is moved. Thus, measurement time may be reduced.

Abstract: A carrier for carrying a packaged chip includes a housing having a space into which the packaged chip is placed and at least one guiding hole formed between outside and inside lateral surfaces thereof A moving block moves along the guiding hole and engages with a latch, which is also provided in the guiding hole. The latch rotates to hold and release a packaged chip placed into the space. Corresponding steps on the moving block and the latch prevent the latch from rotating when the moving block makes small movements caused by jolts or shocks.

Abstract: A carrier for carrying a packaged chip includes a housing having a holding space and at least one guiding hole. A guiding block ascends and descends along the guiding hole. A latch moves backwards and forwards as the guiding block ascends and descends to move into and out of the holding space.

Abstract: Provided is a method for transferring test trays in a handler including a second chamber having two test sites arranged in parallel, a first chamber having a plurality of passages along which a plurality of test trays are horizontally moved, provided over the second chamber, and a third chamber having a plurality of passages along which the plurality of test trays are horizontally moved, provided under the second chamber, the method including steps of (a) enabling two test trays to wait in parallel in a horizontal position at a waiting location provided to a forward section of the handler, (b) loading packaged chips onto the two test trays, (c) rotating the two test trays to be in the upright position, (d) moving upwards the two test trays into the first chamber, (e) heating or cooling the two test trays while moving horizontally the two test trays forward in the first chamber, (f) moving downward the two test trays from the first chamber into the second chamber, (g) moving horizontally the two test trays tow

Abstract: Methods for compensating for a test temperature deviation in a semiconductor device handler are provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing of the semiconductor device at a preset temperature is compensated for. This allows a test of the semiconductor device to be carried out at an exact temperature.

Abstract: A semiconductor device handler is provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing is compensated for, allowing a test of the semiconductor device to be carried out at an exact temperature, or within an exact temperature range.

Abstract: A handler for testing semiconductor devices is provided, wherein a soaking plate is fitted on a handler body having temperature control means for heating and/or cooling semiconductor devices placed thereon. Loading/unloading shuttles are movably fitted, such that they can move in a forward/backward direction, for carrying the semiconductor deices to/from a test site, thereby simplifying a handler system and permitting accurate temperature testing under in high or low temperature environments.

Abstract: Methods for compensating for a test temperature deviation in a semiconductor device handler are provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing of the semiconductor device at a preset temperature is compensated for. This allows a test of the semiconductor device to be carried out at an exact temperature.

Abstract: A semiconductor device handler is provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing is compensated for, allowing a test of the semiconductor device to be carried out at an exact temperature, or within an exact temperature range.