Abstract: An N-value prediction apparatus according to an embodiment of the present invention includes a hypothetical learning data augmentation unit, based on an actual N-value measured at an actual location according to the Standard Penetration Test through drilling investigation, generating at least one of hypothetical N-values corresponding to a preset hypothetical point based on the actual location, an N-value prediction model learning unit learning ground characteristic data corresponding to each of the actual location and the hypothetical point by artificial intelligence, the ground characteristic data including the actual N-value and the hypothetical N-values, and an N-value prediction result calculation unit predicting an N-value at an arbitrary prediction target point by using an N-value prediction model generated by artificial intelligence learning executed in the N-value prediction model learning unit.

Abstract: A stent device including a stent coated with a photosensitizer, the stent including a pair of electrodes; and a circuit fixed to the stent, the circuit including a light emitting diode, a power receiving means for wirelessly receiving power from the outside, and converting the power to electric power; a second communicating means for receiving a control command from the outside; and a second control means for applying, based on the control command, the electric power to the electrodes causing an electric current to flow through the stent between the electrodes, the flow causing heating of the stent, and for controlling a temperature of the stent to provide hyperthermia therapy to a tumor, the second control means further for applying, based on the control command, the electric power to the light emitting diode to emit a predetermined wavelength of light to the photosensitizer to provide photodynamic therapy to the tumor.

Abstract: The present invention relates to a stent using wirelessly transmitted power, and to an external driving device thereof. To this end, a stent is provided with: a power receiving part wirelessly receiving power from the outside; a power storing part storing the power; a second communicating part receiving a control command from the outside; an electrical stimulation part generating electrical stimulation by using the power; a photosensitizer coated onto a stent; an LED illuminating the vicinity of the stent; and a second control part controlling the heat-generating stent on the basis of the control command.

Abstract: A method for manufacturing of a lead-on-chip type semiconductor chip package is disclosed, which comprises the steps of coating a liquid polyimide coating material on the bonding faces of at least one of the inner leads and the bus bars of the lead frame and the semiconductor chip, attaching the semiconductor chip by using the cured liquid polyimide coating material as an attaching medium, and forming a package body for wrapping and protecting the semiconductor chip and bonding wires. Since the liquid polyimide coating material protects the wafer from which the chips are obtained and also serves as a bonding agent for the semiconductor chip at the same time, the semiconductor chip package according to the present invention can be protected from damage, such as by air bubbles, which are generated at the interface of the conventional polyimide tape, and by separation and expansion of adhesives.

Abstract: An apparatus for burn-in test comprising, a socket body including an accommodation groove in which an integrated circuit chip is accommodated to be tested, a step sill portion formed around the accommodation groove, a plurality of inner leads formed on the step sill portion, a plurality of outer leads protruded from the socket body and electrically connected to said inner leads through the socket body, and a supporting element attached to opposite inside walls of the accommodation groove to support the integrated circuit chip, and a method for burn-in test comprising the steps of: (a) mounting an integrated circuit chip to be tested in the accommodation groove; (b) bonding pads of the integrated circuit chip with the corresponding inner leads through a plurality of wires; (c) mounting the socket body on a test board by the outer leads and applying test pattern signals to the integrated circuit chip through the inner and outer leads in the condition of high temperature and high voltage; and (d) severing and re