Patents by Inventor Jae Pil Boo

Jae Pil Boo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity
    Patent number: 7491118
    Abstract: A chemical mechanical polishing apparatus includes a platen, a polishing pad affixed to a surface of the platen, and a polishing head configured to retain and rotate a wafer while pressing a surface of the rotating wafer against the polishing pad. A first portion of the polishing pad that engages the polishing head proximate the edge of the wafer provides less rigidity than a second portion of the polishing pad that engages a portion of the surface of the wafer. For example, the polishing pad and/or the platen may have a recess or other cushioning structure positioned proximate a locus of movement of a portion of the polishing head that supports the edge of the wafer.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: February 17, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun Joo Yun, Young Sam Lim, Jae Pil Boo
  • Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity
    Patent number: 7090570
    Abstract: A chemical mechanical polishing apparatus includes a platen, a polishing pad affixed to a surface of the platen, and a polishing head configured to retain and rotate a wafer while pressing a surface of the rotating wafer against the polishing pad. A first portion of the polishing pad that engages the polishing head proximate the edge of the wafer provides less rigidity than a second portion of the polishing pad that engages a portion of the surface of the wafer. For example, the polishing pad and/or the platen may have a recess or other cushioning structure positioned proximate a locus of movement of a portion of the polishing head that supports the edge of the wafer.
    Type: Grant
    Filed: April 22, 2004
    Date of Patent: August 15, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun Joo Yun, Young Sam Lim, Jae Pil Boo