Patents by Inventor Jae Pil Jung

Jae Pil Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10286498
    Abstract: This invention relates to a lead-free solder alloy composition and a method of preparing a lead-free solder alloy, wherein the lead-free solder alloy composition includes a ceramic powder added to a lead-free solder of Sn-(0.1 to 2) wt % Cu, Sn-(0.5 to 5) wt % Ag, or Sn-(0.1 to 2) wt % Cu-(0.5 to 5) wt % Ag. According to this invention, a novel lead-free solder alloy, which functions as a replacement for a conventional lead-free solder, is provided, thus exhibiting superior spreadability, wettability, and mechanical properties than a conventional lead-free solder.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: May 14, 2019
    Assignee: KYUNG DONG ONE CORPORATION
    Inventors: Ashutosh Sharma, Jae Pil Jung, Jong Hyun Yoon, Bum Gyu Baek, Heung Rak Sohn, Song Hee Yim, Jong Hyuk Yoon
  • Publication number: 20170225277
    Abstract: This invention relates to a lead-free solder alloy composition and a method of preparing a lead-free solder alloy, wherein the lead-free solder alloy composition includes a ceramic powder added to a lead-free solder of Sn-(0.1 to 2) wt % Cu, Sn-(0.5 to 5) wt % Ag, or Sn-(0.1 to 2) wt % Cu-(0.5 to 5) wt % Ag. According to this invention, a novel lead-free solder alloy, which functions as a replacement for a conventional lead-free solder, is provided, thus exhibiting superior spreadability, wettability, and mechanical properties than a conventional lead-free solder.
    Type: Application
    Filed: August 18, 2015
    Publication date: August 10, 2017
    Inventors: Ashutosh Sharma, Jae Pil Jung, Jong Hyun Yoon, Bum Gyu Baek, Heung Rak Sohn, Song Hee Yim, Jong Hyuk Yoon
  • Patent number: 8916119
    Abstract: The present disclosure relates to a method for removing nitrogen oxides (NOx) more effectively at 300° C. or below in boilers, gas turbines, incinerators, diesel engines, glass melting furnaces, etc. by selective catalytic reduction (SCR). To this end, an oxidation catalyst is mounted in front of a NOx-reducing device based on selective catalytic reduction and the NOx composition, i.e. the ratio of NO:NO2, in the exhaust gas is adjusted to about 1:1, such that de-NOx catalytic reaction is carried out under optimized fast SCR condition and de-NOx efficiency at low temperature can be maximized.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: December 23, 2014
    Assignee: GEESCO Co., Ltd.
    Inventors: Dae Woo Kim, Ha Kue Park, Jae Pil Jung
  • Publication number: 20140010748
    Abstract: The present disclosure relates to a method for removing nitrogen oxides (NOx) more effectively at 300° C. or below in boilers, gas turbines, incinerators, diesel engines, glass melting furnaces, etc. by selective catalytic reduction (SCR). To this end, an oxidation catalyst is mounted in front of a NOx-reducing device based on selective catalytic reduction and the NOx composition, i.e. the ratio of NO:NO2, in the exhaust gas is adjusted to about 1:1, such that de-NOx catalytic reaction is carried out under optimized fast SCR condition and de-NOx efficiency at low temperature can be maximized.
    Type: Application
    Filed: October 20, 2011
    Publication date: January 9, 2014
    Applicant: GEESCO CO., LTD.
    Inventors: Dae Woo Kim, Ha Kue Park, Jae Pil Jung
  • Publication number: 20080308189
    Abstract: A lead free solder is provided. The lead free solder includes about 1.5 wt % to about 2.5 wt % silver (Ag), about 3 wt % to about 6 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % of a deoxidizing agent, and a balance of tin (Sn). The lead free solder has improved wettability, a lowered melting point, little or substantially no formation of oxidation layer in a solder bath, suppressed brittleness, improved thermal shock resistance and drop resistance.
    Type: Application
    Filed: January 25, 2008
    Publication date: December 18, 2008
    Applicant: MK ELECTRON CO., LTD.
    Inventors: Young Woo Lee, Kyung In Kang, Byung Wook Jeong, Jae Pil Jung, Ki Ju Lee, Hee Yul Lee