Patents by Inventor Jae-Sang Baik

Jae-Sang Baik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked semiconductor module, method of fabricating the same, and electronic system using the same
    Patent number: 7715200
    Abstract: A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: May 11, 2010
    Assignees: Samsung Electronics Co., Ltd., Samsung Electro-Mechanics
    Inventors: Jung-Chan Cho, Yang-Je Lee, Hyun-Seok Choi, Yong-Hyun Kim, Jung-Hyeon Kim, Hyo-Jae Bang, Do-Hyung Kim, Kyoung-Sun Kim, Young-Ho Lee, Jae-Sang Baik, Yong-Jin Kim
  • Stacked semiconductor module, method of fabricating the same, and electronic system using the same
    Publication number: 20090129041
    Abstract: A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.
    Type: Application
    Filed: September 26, 2008
    Publication date: May 21, 2009
    Inventors: Jung-Chan Cho, Yang-Je Lee, Hyun-Seok Choi, Yong-Hyun Kim, Jung-Hyeon Kim, Hyo-Jae Bang, Do-Hyung Kim, Kyoung-Sun Kim, Young-Ho Lee, Jae-Sang Baik, Yong-Jin Kim