Abstract: A rotor for an induction motor is provide. The rotor includes a core built with stacks of a plurality of steel sheets and includes a plurality of rotor slots that are radially arranged. The rotor further includes a plurality of conductor bars contained in the plurality of rotor slots, respectively, and end-rings attached to both longitudinal ends of each of the plurality of conductor bars. The rotor further includes at least one slit formed inward from an outer periphery of the rotor along a perimeter of the rotor, wherein the slit has a depth deep enough to form a groove portion in at least some region of each of the plurality of conductor bars.

Abstract: The method for treating wastewater includes a first flocculation-and-sedimentation process and a second flocculation-and-sedimentation process, wherein the first flocculation-and-sedimentation process include: passing wastewater through a first flocculation reaction tank; passing the first treated water through a third flocculation reaction tank; passing the third treated water through a fourth flocculation reaction tank; and passing the fourth treated water through a first sedimentation tank to generate fifth treated water and sludge, and the second flocculation-and-sedimentation process include: passing the fifth treated water through a fifth flocculation reaction tank to generate sixth treated water; passing the sixth treated water through a sixth flocculation reaction tank to generate sixth treated water; passing the sixth treated water through a seventh flocculation reaction tank to generate eighth treated water; and passing the eighth treated water through a second sedimentation tank to generate ninth t

Abstract: A rotor for an induction motor includes a rotor core having a hollow portion on a central portion wherein a shaft is coupled to the rotor core by being inserted through the hollow portion, a plurality of slots radially formed in the rotor core around a central axis of the shaft, a plurality of conductor bars coupled to the plurality of slots, and an end ring electrically connecting the plurality of conductor bars to each other, wherein the rotor core is thermally treated above Curie temperature to form a predetermined pattern on an outer circumference of the rotor core.

Abstract: An electrostatic chuck and an apparatus having the electrostatic chuck are provided. The electrostatic chuck may attract a substrate during a substrate assembling process for manufacturing a flat display panel. An elastic layer made of an elastic material may be provided in a base part of the electrostatic chuck, thus preventing non-uniform stress from being distributed on the substrate due to external force, therefore maintaining the flatness of the substrate and improving the quality of assembled substrates. The electrostatic chuck may include an electrostatic force generating part provided on an upper surface of the base part, the force generating part including an insulating layer, an electrode layer, a dielectric layer. The base part may be provided with the elastic layer made of the elastic material having elastic restoring force.

Abstract: A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a board having a receiving surface opposite to a substrate fixed at one side thereof, a plurality of chucking members located between the receiving surface of the board and the substrate, and a substrate separation device to separate the substrate from the chucking members. The substrate separation device includes a pusher for pushing the substrate to separate the substrate from the chucking members, and a base plate installed at the receiving surface of the board, the base plate having an installation space to install the pusher formed therein. The pusher protrudes out of the base plate through an inlet and outlet port located at one end of the installation space to pressurize the substrate.

Abstract: An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.

Abstract: A substrate bonding apparatus includes a first chamber including a first surface plate on which a first substrate is supported, a second chamber spaced from the first chamber and including a second surface plate on which a second substrate to be bonded to the first substrate is supported, an adhesive module provided on the first surface plate and including a plurality of adhesive rubber areas holding the first substrate, and a lift module for lifting at least one of the plurality of adhesive rubber areas.

Abstract: An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.

Abstract: An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.

Abstract: An apparatus for attaching substrates is provided with a buffering member between an upper chamber and a lower chamber. The buffering member reduces a load applied to a lifting device during vacuum exhaustion of a sealing space between the chambers. Therefore, it is possible to reduce a force applied to a lifting screw and a frame supporting a chamber, thereby extending the lifetime of the substrate attaching apparatus and component replacement. Also, it is possible to increase a lower chamber supporting force of a lifting part by coupling the lifting part to an external frame with a fixing device. As the result, the lower chamber is stably fixed and thus it is possible to reduce failures in a substrate attaching process.

Abstract: An apparatus for attaching two substrates to one another includes a lower chamber that holds a first substrate and an upper chamber that holds a second substrate. The upper and lower chambers are brought together to provide a space in which an attaching process is performed. Chamber transportation mechanisms are located at corners of the lower chamber and serve to move the lower chamber up toward the upper chamber so that it can be coupled with the upper chamber. Guide parts are also formed on side surfaces of the lower chamber to guide movement, and to reduce deformation of the chamber when pressure differentials act to deform the sides of the chamber.

Abstract: An electrostatic chuck and an apparatus having the electrostatic chuck are provided. The electrostatic chuck may attract a substrate during a substrate assembling process for manufacturing a flat display panel. An elastic layer made of an elastic material may be provided in a base part of the electrostatic chuck, thus preventing non-uniform stress from being distributed on the substrate due to external force, therefore maintaining the flatness of the substrate and improving the quality of assembled substrates. The electrostatic chuck may include an electrostatic force generating part provided on an upper surface of the base part, the force generating part including an insulating layer, an electrode layer, a dielectric layer. The base part may be provided with the elastic layer made of the elastic material having elastic restoring force.

Abstract: A system for attaching a display panel and a stereoscopic lens panel is provided. The system may include a panel supply device that receives a display panel and a stereoscopic lens panel, and a conveyance device that conveys the display panel and the stereoscopic lens panel. A cleaning device cleans attachment surfaces of the display panel and stereoscopic lens panel, and a laminating device laminates an adhesive film onto an attachment surface of the display panel. A panel attachment device then attaches the display panel and the stereoscopic lens panel, either of which may be laminated with the adhesive film by the laminating device, and a baking device bakes the adhesive film interposed between the display panel and the stereoscopic lens panel to form a stereoscopic display panel. A panel discharge device then loads the stereoscopic display panel thereon for subsequent processing.

Abstract: A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a board having a receiving surface opposite to a substrate fixed at one side thereof, a plurality of chucking members located between the receiving surface of the board and the substrate, and a substrate separation device to separate the substrate from the chucking members. The substrate separation device includes a pusher for pushing the substrate to separate the substrate from the chucking members, and a base plate installed at the receiving surface of the board, the base plate having an installation space to install the pusher formed therein. The pusher protrudes out of the base plate through an inlet and outlet port located at one end of the installation space to pressurize the substrate.

Abstract: A substrate bonding apparatus includes a first chamber including a first surface plate on which a first substrate is supported, a second chamber spaced from the first chamber and including a second surface plate on which a second substrate to be bonded to the first substrate is supported, an adhesive module provided on the first surface plate and including a plurality of adhesive rubber areas holding the first substrate, and a lift module for lifting at least one of the plurality of adhesive rubber areas.

Abstract: A substrate bonding apparatus including a first chamber including a first surface plate on which a first substrate is received, a surface plate lift for lifting the first surface plate, a second chamber including a second surface plate on which a second substrate to be bonded to the first substrate is received, at least one adhesive included with the first surface plate to adhere to the first substrate, and an adhesive lift for independently lifting the adhesive.

Abstract: An apparatus for attaching substrates includes an upper chamber for holding an upper substrate and a lower chamber for holding a lower substrate which is to be attached to the upper substrate. The lower chamber is moved up and down so as to come together with the upper chamber to form a sealed attaching space. A substrate receiving part is fixed to a frame of the apparatus so that it does not move as the lower chamber is raised and lowered. The substrate receiving part alternatively projects from the lower chamber is the lower chamber is moved down, or is recessed into the top of the lower chamber when the lower chamber is lifted up.

Abstract: An apparatus for attaching two substrates to one another includes a lower chamber that holds a first substrate and an upper chamber that holds a second substrate. The upper and lower chambers are brought together to provide a space in which an attaching process is performed. Chamber transportation mechanisms are located at corners of the lower chamber and serve to move the lower chamber up toward the upper chamber so that it can be coupled with the upper chamber. Guide parts are also formed on side surfaces of the lower chamber to guide movement, and to reduce deformation of the chamber when pressure differentials act to deform the sides of the chamber.

Abstract: An apparatus for attaching substrates is provided with a buffering member between an upper chamber and a lower chamber. The buffering member reduces a load applied to a lifting device during vacuum exhaustion of a sealing space between the chambers. Therefore, it is possible to reduce a force applied to a lifting screw and a frame supporting a chamber, thereby extending the lifetime of the substrate attaching apparatus and component replacement. Also, it is possible to increase a lower chamber supporting force of a lifting part by coupling the lifting part to an external frame with a fixing device. As the result, the lower chamber is stably fixed and thus it is possible to reduce failures in a substrate attaching process.