Patents by Inventor Jae-Seok Yi
Jae-Seok Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230066593Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.Type: ApplicationFiled: October 24, 2022Publication date: March 2, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok YI, Il Ro LEE, Chang Hak CHOI, Bon Seok KOO, Jung Min KIM, Byung Woo KANG, San KYEONG
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Patent number: 11562859Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.Type: GrantFiled: October 19, 2021Date of Patent: January 24, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok Yi, Jung Min Kim, Chang Hak Choi, Bon Seok Koo, Byung Woo Kang, Hae Sol Kang, San Kyeong, Jun Hyeon Kim
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Patent number: 11561763Abstract: An electronic device is provided. The electronic device includes a housing, a touchscreen display exposed through a first portion of the housing, a microphone disposed at a second portion of the housing, a speaker disposed at a third portion of the housing, a memory disposed inside the housing, a processor disposed inside the housing, and electrically connected to the display, the microphone, the speaker, and the memory. The memory is configured to store a plurality of application programs, each of which includes a graphic user interface (GUI).Type: GrantFiled: May 27, 2021Date of Patent: January 24, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: In Jong Rhee, Ji Min Lee, Sang Ki Kang, Han Jun Ku, Sung Pa Park, Jang Seok Seo, In Wook Song, Won Ick Ahn, Kyoung Gu Woo, Ji Soo Yi, Chang Kyun Jeon, Ho Jun Jaygarl, Il Hwan Choi, Yoo Jin Hong, Ji Hyun Kim, Jae Yung Yeo
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Patent number: 11508522Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.Type: GrantFiled: April 24, 2020Date of Patent: November 22, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok Yi, Il Ro Lee, Chang Hak Choi, Bon Seok Koo, Jung Min Kim, Byung Woo Kang, San Kyeong
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Patent number: 11469051Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 ?m or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.Type: GrantFiled: April 16, 2021Date of Patent: October 11, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hye Han, Jung Min Kim, Jae Seok Yi, Hye Jin Park, Byung Woo Kang, Jeong Ryeol Kim, Bon Seok Koo, Il Ro Lee
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Publication number: 20220301783Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.Type: ApplicationFiled: June 9, 2022Publication date: September 22, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
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Publication number: 20220262571Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.Type: ApplicationFiled: April 29, 2022Publication date: August 18, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok YI, Jung Min KIM, Bon Seok KOO, Chang Hak CHOI, Il Ro LEE, Byung Woo KANG, San KYEONG, Hae Sol KANG
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Patent number: 11393630Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.Type: GrantFiled: March 30, 2020Date of Patent: July 19, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
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Patent number: 11393633Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.Type: GrantFiled: May 15, 2020Date of Patent: July 19, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
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Publication number: 20220139618Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.Type: ApplicationFiled: May 5, 2021Publication date: May 5, 2022Inventors: Byung Woo Kang, Bon Seok Koo, Jeong Ryeol Kim, Jung Min Kim, Jae Seok Yi, Ji Hye Han, Hye Jin Park
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Publication number: 20220093337Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 ?m or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.Type: ApplicationFiled: April 16, 2021Publication date: March 24, 2022Inventors: Ji Hye HAN, Jung Min KIM, Jae Seok YI, Hye Jin PARK, Byung Woo KANG, Jeong Ryeol KIM, Bon Seok KOO, Il Ro LEE
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Publication number: 20220037087Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.Type: ApplicationFiled: October 19, 2021Publication date: February 3, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok YI, Jung Min KIM, Chang Hak CHOI, Bon Seok KOO, Byung Woo KANG, Hae Sol KANG, San KYEONG, Jun Hyeon KIM
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Patent number: 11183331Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.Type: GrantFiled: August 12, 2019Date of Patent: November 23, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok Yi, Jung Min Kim, Chang Hak Choi, Bon Seok Koo, Byung Woo Kang, Hae Sol Kang, San Kyeong, Jun Hyeon Kim
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Publication number: 20210193391Abstract: A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.Type: ApplicationFiled: April 24, 2020Publication date: June 24, 2021Inventors: Jae Seok YI, Il Ro LEE, Chang Hak CHOI, Bon Seok KOO, Jung Min KIM, Byung Woo KANG, San KYEONG
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Publication number: 20210074481Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.Type: ApplicationFiled: March 30, 2020Publication date: March 11, 2021Inventors: Jae Seok YI, Jung Min KIM, Bon Seok KOO, Chang Hak CHOI, Il Ro LEE, Byung Woo KANG, San KYEONG, Hae Sol KANG
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Publication number: 20210057160Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.Type: ApplicationFiled: May 15, 2020Publication date: February 25, 2021Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
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Publication number: 20200273621Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.Type: ApplicationFiled: August 12, 2019Publication date: August 27, 2020Inventors: Jae Seok YI, Jung Min KIM, Chang Hak CHOI, Bon Seok KOO, Byung Woo KANG, Hae Sol KANG, San KYEONG, Jun Hyeon KIM
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Patent number: 9059345Abstract: A solar cell using a p-i-n nanowire that may generate light by absorbing solar light in a wide wavelength region efficiently without generating light loss and may be manufactured with a simplified process and low cost.Type: GrantFiled: July 6, 2010Date of Patent: June 16, 2015Assignee: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, HANYANG UNIVERSITYInventors: Tae-Whan Kim, Joo-Hyung You, Jae-Hun Jung, Jae-Seok Yi, Won-Il Park
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Publication number: 20120097232Abstract: A solar cell using a p-i-n nanowire that may generate light by absorbing solar light in a wide wavelength region efficiently without generating light loss and may be manufactured with a simplified process and low cost.Type: ApplicationFiled: July 6, 2010Publication date: April 26, 2012Applicant: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION, HANYANG UNIVERSITYInventors: Tae-Whan Kim, Joo-Hyung You, Jae-Hun Jung, Jae-Seok Yi, Won-Il Park