Abstract: An encapsulation film, a manufacturing method therefor, an organic electronic device comprising same, and a method for manufacturing an organic electronic device by using same, which provides an encapsulation film that has a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, and long-term reliability of the organic electronic device can be ensured. The encapsulation film includes an encapsulation layer that is a cured product of an encapsulation composition, wherein the encapsulation composition includes an encapsulation resin and a moisture adsorbent, and the encapsulation layer is a single layer and includes a first region, a second region, and a third region in which the concentrations of the moisture adsorbent are different according to the thickness direction.

Abstract: Provided is an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device comprising the same. The encapsulation film comprises an encapsulation layer comprising a moisture adsorbent, and a metal mesh layer formed on the encapsulation layer.

Abstract: Provided is an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device comprising the same. The encapsulation film comprises an encapsulation layer comprising a moisture adsorbent, and a metal mesh layer formed on the encapsulation layer.

Abstract: The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can effectively release heat accumulated inside the organic electronic device and prevent occurrence of bright spots of the organic electronic device.

Abstract: The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can effectively release heat accumulated inside the organic electronic device and prevent occurrence of bright spots of the organic electronic device.

Abstract: The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can effectively release heat accumulated inside the organic electronic device and prevent occurrence of bright spots of the organic electronic device.

Abstract: Disclosed is a vacuum insulation panel having excellent thermal insulation and cold retention performance using conventional glass fibers. The vacuum insulation panel employs annealed binderless glass fibers as a core material, thus ensuring superior thermal insulation performance and preventing out-gassing in a vacuum due to the absence of organic residues in the fibers, and thereby a vacuum level of the vacuum insulation panel can be maintained for a long period of time.

Abstract: Disclosed is a vacuum insulation panel having excellent thermal insulation and cold retention performance using conventional glass fibers. The vacuum insulation panel employs annealed binderless glass fibers as a core material, thus ensuring superior thermal insulation performance and preventing out-gassing in a vacuum due to the absence of organic residues in the fibers, and thereby a vacuum level of the vacuum insulation panel can be maintained for a long period of time.