Abstract: The present invention relates to a composition including decursinol as an active ingredient for preventing or treating angina, arteriosclerosis, cerebral infarction, and hypertension. Poorly soluble decursinol was found to improve angina, arteriosclerosis, cerebral infarction, prostate hypertrophy, and diabetic hypertension by inhibiting the overgrowth of vascular endothelial cells, and is expected to be usable in the development of a composition for preventing or treating angina, arteriosclerosis, cerebral infarction, prostate hypertrophy, and diabetic hypertension.

Abstract: Disclosed is a semiconductor package comprising a substrate, a semiconductor chip on the substrate, a molding layer on the substrate covering the semiconductor chip, and a shield layer on the molding layer. The shield layer includes a polymer in which a plurality of conductive structures and a plurality of nano-structures are distributed wherein at least some of the conductive structures are connected to one another.

Abstract: A method of manufacturing a semiconductor package includes providing a substrate main body to which external connection terminals are attached, attaching a protective member to the substrate main body to cover the external connection terminals, mounting a semiconductor chip on a surface of the substrate main body that is opposite from the protective member, and removing the protective member from the substrate main body.

Abstract: Disclosed is a semiconductor package comprising a substrate, a semiconductor chip on the substrate, a molding layer on the substrate covering the semiconductor chip, and a shield layer on the molding layer. The shield layer includes a polymer in which a plurality of conductive structures and a plurality of nano-structures are distributed wherein at least some of the conductive structures are connected to one another.

Abstract: A method of manufacturing a semiconductor package includes providing a substrate main body to which external connection terminals are attached, attaching a protective member to the substrate main body to cover the external connection terminals, mounting a semiconductor chip on a surface of the substrate main body that is opposite from the protective member, and removing the protective member from the substrate main body.

Abstract: A steel frame structure includes brackets connected to columns to allow the columns to be connected to a girder. Each bracket includes a U-shaped plate having a bottom plate, side plates extended upwardly perpendicularly from both ends of the bottom plate, and base plates extended outwardly from the side plates, a vertical plate welded perpendicularly to the center of the bottom plate of the U-shaped plate in such a manner as to be parallel to the side plates, and a horizontal plate welded to the top end of the vertical plate in such a manner as to be parallel to the bottom plate of the U-shaped plate. The girder has a generally U-shaped section.

Abstract: A test socket may include a socket frame, a plate, a socket pin and a link. The socket frame may have a slot configured to accept an object. The plate may be free to move in the slot along an inserting direction of the object to support a lower surface of the object. The socket pin may be movably arranged in a direction substantially perpendicular to the inserting direction of the object. The socket pin may selectively make contact with a tab of the object. A link may be pivotally connected to the socket pin and the plate. Thus, the socket pin of the test socket may avoid dragging along the tab of the object during insertion, and accordingly, the tab of the object may avoid damage.

Abstract: A steel frame structure includes brackets connected to columns to allow the columns to be connected to a girder. Each bracket includes a U-shaped plate having a bottom plate, side plates extended upwardly perpendicularly from both ends of the bottom plate, and base plates extended outwardly from the side plates, a vertical plate welded perpendicularly to the center of the bottom plate of the U-shaped plate in such a manner as to be parallel to the side plates, and a horizontal plate welded to the top end of the vertical plate in such a manner as to be parallel to the bottom plate of the U-shaped plate. The girder has a generally U-shaped section.

Abstract: A pressure conductive sheet includes a connector body formed of a thin plate of insulation material, an elastic body deposited as one body with the connector body, pluralities of connection terminals provided with a given interval to pass through the elastic body and the connector body, and a ground plate constituting a matching circuit, the ground plate being buried by a given width in between the connector body and the elastic body. The ground plate is coupled to a ground terminal among the connection terminals and is separated from an outer circumference face of a signal terminal. The connector body, the elastic body, the connection terminals and the ground plate are combined with one another to substantially reduce an interference between signal terminals through the matching circuit formed based on capacitance of a gap between a ground face of the ground plate and the signal terminal, and to improve electrical characteristics.

Abstract: A test socket may include a socket frame, a plate, a socket pin and a link. The socket frame may have a slot configured to accept an object. The plate may be free to move in the slot along an inserting direction of the object to support a lower surface of the object. The socket pin may be movably arranged in a direction substantially perpendicular to the inserting direction of the object. The socket pin may selectively make contact with a tab of the object. A link may be pivotally connected to the socket pin and the plate. Thus, the socket pin of the test socket may avoid dragging along the tab of the object during insertion, and accordingly, the tab of the object may avoid damage.

Abstract: A pressure conductive sheet includes a connector body formed of a thin plate of insulation material, an elastic body deposited as one body with the connector body, pluralities of connection terminals provided with a given interval to pass through the elastic body and the connector body, and a ground plate constituting a matching circuit, the ground plate being buried by a given width in between the connector body and the elastic body. The ground plate is coupled to a ground terminal among the connection terminals and is separated from an outer circumference face of a signal terminal. The connector body, the elastic body, the connection terminals and the ground plate are combined with one another to substantially reduce an interference between signal terminals through the matching circuit formed based on capacitance of a gap between a ground face of the ground plate and the signal terminal, and to improve electrical characteristics.