Patents by Inventor Jae-Seong Hwang

Jae-Seong Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240103362
    Abstract: Disclosed herein is a method of printing a nanostructure including: preparing a template substrate on which a pattern is formed; forming a replica pattern having an inverse phase of the pattern by coating a polymer thin film on an upper portion of the template substrate, adhering a thermal release tape to an upper portion of the polymer thin film, and separating the polymer thin film from the template substrate; forming a nanostructure by depositing a functional material on the replica pattern; and printing the nanostructure deposited on the replica pattern to a substrate by positioning the nanostructure on the substrate, applying heat and pressure to the nanostructure, and weakening an adhesive force between the thermal release tape and the replica pattern by the heat.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 28, 2024
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jong Min KIM, Seung Yong LEE, So Hye CHO, Ho Seong JANG, Jae Won CHOI, Chang Kyu HWANG
  • Publication number: 20240088059
    Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
  • Publication number: 20180176536
    Abstract: An electronic device is provided that includes a display displaying an image and a processor electrically connected with the display. The processor is configured to vary a start position of projection, where the image is played based on a resolution of the display and a resolution of the image, and to resize and display a portion of the image which is displayed on the display.
    Type: Application
    Filed: December 19, 2017
    Publication date: June 21, 2018
    Inventors: Han-Sol JO, Kyung-Tae Kim, Keon-Ho Kim, Sung-Min Yoon, Seon-Ho Lee, Chang-Ho Lee, Sun-Goo Jung, Ji-Hoon Chung, Yoon-Jeong Choi, Ho-Seon Lee, Jae-Seong Hwang