Patents by Inventor Jae Seong Kim

Jae Seong Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250143047
    Abstract: Provided are a display device and a method for manufacturing the same. According to one or more embodiments of the present disclosure, the display device includes a substrate, a bank on the substrate and comprising an opening, a pixel electrode and a common electrode spaced from each other on the substrate in the opening, an organic layer on the pixel electrode and the common electrode in the opening, a light emitting element on the organic layer, and comprising a first electrode and a second electrode on a top surface thereof, a first connection electrode connected to the pixel electrode and the first electrode of the light emitting element, and a second connection electrode connected to the common electrode and the second electrode of the light emitting element. The organic layer is on a bottom surface and at least a portion of one side surface of the light emitting element.
    Type: Application
    Filed: October 25, 2024
    Publication date: May 1, 2025
    Inventors: Ki Seong SEO, Jong Moo HUH, Min Woo KIM, Myung Koo HUR, Hui Won YANG, Jae Phil LEE
  • Patent number: 12284926
    Abstract: The present disclosure relates to a transmission of an agricultural vehicle, the transmission including: a forward shift unit for performing shift with respect to drive transmitted from an engine of an agricultural vehicle; a clutch unit connected to the forward shift unit so as to selectively output drive transmitted from the forward shift unit; an adjustment unit connected to the clutch unit; and a backward shift unit connected to the adjustment unit so as to perform shift with respect to drive transmitted from the adjustment unit. The adjustment unit includes: a first adjustment mechanism connected to a first clutch mechanism included in the clutch unit; a second adjustment mechanism connected to a second clutch mechanism included in the clutch unit; and an integration mechanism connected to both the first adjustment mechanism and the second adjustment mechanism. The backward shift unit includes one backward shift mechanism connected to the integration mechanism.
    Type: Grant
    Filed: July 25, 2024
    Date of Patent: April 29, 2025
    Assignee: LS MTRON LTD.
    Inventors: Jung Su Han, Won Woo Park, Ji Hun Yu, Taek Seong Kim, Young Gyu Lee, Jae Gone Kim
  • Publication number: 20250126801
    Abstract: The present disclosure relates to semiconductor memory devices. An example semiconductor memory device includes a cell region and a peripheral circuit region electrically connected with the cell region. The cell region includes a plurality of gate electrodes spaced apart from each other and stacked in a vertical direction, and a channel structure extending through the plurality of gate electrodes in the vertical direction. The peripheral circuit region includes a substrate, a first element isolation structure, a first gate structure on the first active region, a second element isolation structure, a second gate structure on the second active region, a third element isolation structure, and a third gate structure on the third active region. The third element isolation structure includes a first element isolation pattern and a second element isolation pattern. The first element isolation pattern and the second element isolation pattern include different materials from each other.
    Type: Application
    Filed: June 4, 2024
    Publication date: April 17, 2025
    Inventors: Ju Seong Min, Hak Seon Kim, Jae-Bok Baek, Kang-Oh Yun, Taek Kyu Yoon, Dong Jin Lee, Jae Duk Lee, Se Jin Lim, Jee Hoon Han
  • Patent number: 12258525
    Abstract: Embodiments of the present disclosure relate to a method and system for producing refined hydrocarbons from waste plastic pyrolysis oil. The method and system for producing refined hydrocarbons from waste plastic pyrolysis oil according to the embodiments of the present disclosure may minimize formation of an ammonium salt (NH4Cl) and may prevent an adhesion phenomenon of impurity particles in a reactor in a refining process of waste plastic pyrolysis oil containing impurities including chlorine and nitrogen. In addition, the method and system for producing refined hydrocarbons according to the embodiments of the present disclosure may have excellent refining efficiency and may implement a long-term operation of a process because deactivation of a catalyst used in the process is prevented and may produce refined hydrocarbons having a low content of impurities and a high octane number from waste plastic pyrolysis oil.
    Type: Grant
    Filed: February 7, 2024
    Date of Patent: March 25, 2025
    Assignees: SK INNOVATION CO., LTD., SK GEO CENTRIC CO., LTD.
    Inventors: Yong Woon Kim, Seo Yeong Kang, Soo Kil Kang, Min Gyoo Park, Young Moo Park, Min Woo Shin, Jae Hwan Lee, Jin Seong Jang, Sang Hwan Jo
  • Patent number: 12248018
    Abstract: A semiconductor chip includes a semiconductor device connected between a first node to which a power supply voltage is applied and a second node to which a ground voltage is applied, a first ring oscillator connected to the first node through a first supply switch and the second node through a first ground switch and a second ring oscillator connected to the first node through a second supply switch and the second node through a second ground switch, wherein the first supply and ground switches are configured to operate in response to a first control signal, thereby operating the first ring oscillator, and the second supply and ground switches are configured to operate in response to a second control signal, thereby operating the second ring oscillator.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: March 11, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yeon Ho Jung, Jong Wook Kye, Min Woo Kwak, Mi Joung Kim, Chan Wook Park, Do Hoon Byun, Kwan Seong Lee, Jae Ho Lee, Jae Seung Choi, Hwang Ho Choi
  • Publication number: 20250078136
    Abstract: Proposed is a method for product recommendation by a server. The method may include receiving a gift recommendation request from a first user terminal for a second user, checking available basic information of the second user, and determining a first recommendation information based on the basic information, wherein the first recommendation information comprises a first recommendation reason and at least one product related to the first recommendation reason. The method may also include determining a second recommendation information not based on the basic information, wherein the second recommendation information comprises a second recommendation reason and at least one product related to the second recommendation reason. The method may further include providing recommendation information comprising the first and second recommendation information to the first user terminal. The first recommendation information may be prioritized for display over the second recommendation information.
    Type: Application
    Filed: August 19, 2024
    Publication date: March 6, 2025
    Inventors: Ji Hye PARK, Min Seok KIM, Min A KIM, Won Jun JANG, Do Eun KIM, Kyu Min CHOI, Andrew Ho Jun YANG, Eun Soo KIM, Young Woo CHOI, Lim Ah LEE, Hye Jin KIM, Hye Young KANG, Soo Yeon NA, Hyo Eun LEE, Min Seong KIM, Jae Heon KIM, Min Jeong KIM
  • Publication number: 20250059421
    Abstract: A mixed refrigerant composition includes carbon dioxide (R-744), 2,3,3,3-tetrafluoropropene (R-1234yf) and 1,1-difluoroethane (R-152a). A content of the carbon dioxide (R-744) ranges from 1 to 10 wt. % based on a total weight of the mixed refrigerant composition, and a content of the 2,3,3,3-tetrafluoropropene (R-1234yf) ranges from 65 to 95 wt. % based on the total weight of the mixed refrigerant composition, and a content of the 1,1-difluoroethane (R-152a) ranges from 1 to 30 wt. % based on the total weight of the mixed refrigerant composition. A boiling point at 1 atm of the mixed refrigerant composition ranges from ?65 to ?30° C.
    Type: Application
    Filed: August 15, 2024
    Publication date: February 20, 2025
    Inventors: Bong Ho KANG, Hye Ri KIM, Ji Seong NOH, Sang Gu WOO, Jae Min LEE
  • Publication number: 20250059422
    Abstract: A mixed refrigerant composition includes carbon dioxide (R-744), 2,3,3,3-tetrafluoropropene (R-1234yf) and trifluoroiodomethane (R-13I1). A content of the carbon dioxide (R-744) ranges from 1 to 10 wt. % based on a total weight of the mixed refrigerant composition, and a sum of a content of the 2,3,3,3-tetrafluoropropene (R-1234yf) and a content of the trifluoroiodomethane (R-13I1) ranges from 90 to 99 wt. % based on the total weight of the mixed refrigerant composition. A boiling point at 1 atm of the mixed refrigerant composition ranges from ?76 to ?35° C.
    Type: Application
    Filed: August 16, 2024
    Publication date: February 20, 2025
    Inventors: Bong Ho KANG, Hye Ri KIM, Ji Seong NOH, Sang Gu WOO, Jae Min LEE
  • Publication number: 20250040140
    Abstract: A semiconductor memory device comprises a cell structure and a peripheral circuit structure electrically connected to the cell structure. The peripheral circuit structure comprises an active region, a first gate structure comprising a first gate insulating layer intersecting the active region and in contact with the active region, a second gate structure comprising a second gate insulating layer spaced apart from the first gate structure, and in contact with the active region, and a source/drain region between the first gate structure and the second gate structure. A thickness of the first gate insulating layer is less than a thickness of the second gate insulating layer. The source/drain region comprises a first region adjacent to the first gate structure and a second region adjacent to the second gate structure. A depth of the first region is equal to a depth of the second region.
    Type: Application
    Filed: March 13, 2024
    Publication date: January 30, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ju Seong MIN, Jun Gyeom KIM, Hyun Min KIM, Kang-Oh YUN, Taek Kyu YOON, Dong Jin LEE, Jae Duk LEE, Jee Hoon HAN
  • Publication number: 20250040032
    Abstract: A circuit board according to an embodiment includes a first substrate layer; and a second substrate layer disposed on the first substrate layer and including a cavity, wherein the cavity of the second substrate layer includes a first part disposed adjacent to an upper surface of the second substrate layer and having a first inclination such that a width gradually decreases toward a lower surface of the second substrate layer; and a second part disposed below the first part adjacent to the lower surface of the second substrate layer and having a second inclination such that a width gradually decreases toward the lower surface of the second substrate layer, and the first inclination of the first part relative to a bottom surface of the cavity is greater than the second inclination of the second part relative to the bottom surface of the cavity, and a vertical length of the first part is different from a vertical length of the second part.
    Type: Application
    Filed: August 10, 2022
    Publication date: January 30, 2025
    Inventors: Jong Bae SHIN, Moo Seong KIM, Soo Min LEE, Jae Hun JEONG
  • Patent number: 12206663
    Abstract: Disclosed are an authentication information processing method and apparatus and a user terminal including an authentication information processing method and apparatus. The authentication information processing method performed by the disclosed authentication information processing apparatus comprises the steps of: obtaining biometric information of a user; obtaining a unique key corresponding to the authentication information processing apparatus; and generating an authentication key by using at least a part of the biometric information and at least a part of the unique key.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: January 21, 2025
    Assignee: ICTK Holdings Co., Ltd.
    Inventors: Dong Hyun Kim, Jae Seong Lee
  • Publication number: 20250022784
    Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.
    Type: Application
    Filed: September 27, 2024
    Publication date: January 16, 2025
    Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na
  • Patent number: 11969807
    Abstract: An insert configured to be assembled to a tool for cutting a workpiece, includes: an upper surface including first to fourth upper corner portions formed in respective quadrants divided by a first imaginary vertical axis and a first imaginary horizontal axis that are perpendicular to each other; and a lower surface formed below the upper surface in a height direction and including first to fourth lower corner portions formed in respective quadrants divided by a second imaginary vertical axis and a second imaginary horizontal axis that are perpendicular to each other. A lower ridge portion protruding downward in the height direction is formed on the lower surface, and extends across the second and fourth lower corner portions, which are symmetrical with respect to a center of the lower surface.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: April 30, 2024
    Assignee: TaeguTec Ltd.
    Inventors: Chang Gyu Park, Jae Seong Kim
  • Publication number: 20220341832
    Abstract: The present invention discloses a thermal fatigue crack generator for a large pipe. According to the present invention, the thermal fatigue crack generator for a large pipe precisely manages and controls the heating and cooling conditions for the large size test pipes having a diameter of 250 to 610 mm to significantly improve the reliability of the accuracy and a reproducibility of the thermal fatigue cycle so that a useful advantage is expected to ensure the reliability and the effectiveness of the skill verification of the non-destructive testing.
    Type: Application
    Filed: January 10, 2020
    Publication date: October 27, 2022
    Inventors: HYEONG GEUN AHN, JAE SEONG KIM
  • Publication number: 20210213546
    Abstract: An insert configured to be assembled to a tool for cutting a workpiece, includes: an upper surface including first to fourth upper corner portions formed in respective quadrants divided by a first imaginary vertical axis and a first imaginary horizontal axis that are perpendicular to each other; and a lower surface formed below the upper surface in a height direction and including first to fourth lower corner portions formed in respective quadrants divided by a second imaginary vertical axis and a second imaginary horizontal axis that are perpendicular to each other.
    Type: Application
    Filed: January 15, 2020
    Publication date: July 15, 2021
    Inventors: Chang Gyu Park, Jae Seong Kim
  • Patent number: 10550745
    Abstract: A cooling device for a reducing agent injection module, includes a reducing agent injection module installed in an exhaust pipe to inject a reducing agent into the exhaust pipe and having a module cooling channel therein through which a coolant flows to cool the reducing agent injection module, a coolant pump configured to supply the coolant to the module cooling channel, a coolant circulation line including a coolant supply line and a coolant recovery line to connect the coolant pump and the module cooling channel, and a coolant recovery portion installed in the coolant recovery line to store the coolant flowing through the reducing agent injection module and positioned higher than the reducing agent injection module along a gravitational direction.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: February 4, 2020
    Assignee: DOOSAN INFRACORE CO., LTD.
    Inventors: Jae-seong Kim, Ku-yeon Han
  • Patent number: 10287947
    Abstract: A selective catalytic reduction system includes a reducing agent injection module installed in an exhaust pipe through which an exhaust gas is discharged from an engine and configured to inject a reducing agent into the exhaust pipe, a temperature calculator configured to calculate a temperature of the reducing agent injection module using temperature-related information of the reducing agent injection module, and a temperature controller configured to control to increase a reducing agent injection amount of the reducing agent injection module when the calculated temperature.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: May 14, 2019
    Assignee: DOOSAN INFRACORE CO., LTD.
    Inventors: Jae-Seong Kim, Eun-Hyoung Kim, Nam-Il Choi, Won-Jun Choi
  • Publication number: 20180328247
    Abstract: A cooling device for a reducing agent injection module, includes a reducing agent injection module installed in an exhaust pipe to inject a reducing agent into the exhaust pipe and having a module cooling channel therein through which a coolant flows to cool the reducing agent injection module, a coolant pump configured to supply the coolant to the module cooling channel, a coolant circulation line including a coolant supply line and a coolant recovery line to connect the coolant pump and the module cooling channel, and a coolant recovery portion installed in the coolant recovery line to store the coolant flowing through the reducing agent injection module and positioned higher than the reducing agent injection module along a gravitational direction.
    Type: Application
    Filed: November 7, 2016
    Publication date: November 15, 2018
    Inventors: Jae-seong KIM, Ku-yeon HAN
  • Patent number: D1020824
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: April 2, 2024
    Assignee: TaeguTec Ltd.
    Inventors: Chang Gyu Park, Su Jin Ryu, Jae Seong Kim
  • Patent number: D1064007
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: February 25, 2025
    Assignee: TaeguTec Ltd.
    Inventors: Chang Gyu Park, Su Jin Ryu, Jae Seong Kim