Patents by Inventor Jae-Seung Jeong

Jae-Seung Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240054505
    Abstract: An integrated certification system is a system for performing integrated certification on products to which genuine-product certification labels are attached. The integrated certification system includes an integrated certification management server. The integrated certification management server includes a distribution management module configured to acquire distributor identification information and a distribution number of each of the products from each distributor and match the distribution number to an identification number assigned to a corresponding distributor and a genuine-product certification module configured to receive a genuine-product certification request including user-related information and an identification number extracted from each of the genuine-product certification labels from a user terminal and perform genuine-product certification according to the received genuine-product certification request.
    Type: Application
    Filed: October 26, 2023
    Publication date: February 15, 2024
    Inventors: KI HYEOK BAE, IN JE CHO, JAE SEUNG JEONG
  • Publication number: 20230001585
    Abstract: An embodiment rehabilitation robot control apparatus includes a brainwave signal measuring device configured to measure a brainwave signal of a user, a preprocessing device configured to preprocess the measured brainwave signal, a classification device configured to classify a motor intention of the user based on the brainwave signal preprocessed by the preprocessing device, and a controller configured to reflect the motor intention of the user in real time to control an operation or a stop of a rehabilitation robot.
    Type: Application
    Filed: May 25, 2022
    Publication date: January 5, 2023
    Inventors: Seung Kyu Nam, Ju Young Yoon, Tae Jun Lee, Beom Su Kim, Jae Seung Jeong, Jae Hyun Kim, Adedoyin Olumuyiwa Aderinwale, Jun Ha Jung, Dong Hwa Jeong
  • Publication number: 20210150538
    Abstract: An integrated certification system is a system for performing integrated certification on products to which genuine-product certification labels are attached. The integrated certification system includes an integrated certification management server. The integrated certification management server includes a distribution management module configured to acquire distributor identification information and a distribution number of each of the products from each distributor and match the distribution number to an identification number assigned to a corresponding distributor and a genuine-product certification module configured to receive a genuine-product certification request including user-related information and an identification number extracted from each of the genuine-product certification labels from a user terminal and perform genuine-product certification according to the received genuine-product certification request.
    Type: Application
    Filed: October 27, 2020
    Publication date: May 20, 2021
    Inventors: Ki Hyeok BAE, In Je CHO, Jae Seung JEONG
  • Publication number: 20190055990
    Abstract: A tripod constant velocity joint includes: a spider having a plurality of trunnions; a plurality of roller assemblies which are respectively assembled to the plurality of the trunnions; and a housing defining a plurality of track grooves which respectively receive the plurality of roller assemblies. The respective roller assembly includes: an inner roller which is coupled to the trunnion; an outer roller which is disposed to surround the inner roller; a needle roller which is interposed between the inner roller and the outer roller; and an elastic member which elastically supports the outer roller outwardly in a radial direction with respect to the inner roller.
    Type: Application
    Filed: February 24, 2017
    Publication date: February 21, 2019
    Applicant: ERAE AMS CO., LTD.
    Inventors: Young-Doo LEE, Hyun-Il LEE, Jae-Seung JEONG, Jang-Sun LEE
  • Patent number: 10082182
    Abstract: A constant-velocity universal joint includes: an outer joint member having a plurality of outer ball grooves; an inner joint member having a plurality of inner ball grooves; a plurality of torque transmitting balls; and a ball cage. The outer ball groove and the inner ball groove respectively have a double shape, and a ratio O/H of an offset value O which is a distance between an inflection point of the outer ball groove and a line connecting centers of the torque transmitting balls in a state that the outer joint member and the inner joint member form 0 angle and a distance H between a center line of the inner joint member and a center of the torque transmitting ball in a state that the outer joint member and the inner joint member form 0 angle is within a range of 0.07 to 0.11.
    Type: Grant
    Filed: September 11, 2014
    Date of Patent: September 25, 2018
    Assignee: erae AMS Co., Ltd.
    Inventors: Hyun-Il Lee, Jang-Sun Lee, Dong-Jin Kim, Jae-Seung Jeong
  • Patent number: 10018219
    Abstract: Provided are a hollow drive shaft and a method for manufacturing the same in which a concentrated load to a weak point which may be occurred by differences of sectional thicknesses and outer diameters of the shaft is dispersed so that the strength may be uniform throughout the whole length of the drive shaft. The hollow drive shaft includes: one or more small-diameter portion having a hollow shape; and a large-diameter portion which is disposed in a vicinity of the small-diameter portion and has an outer diameter relatively greater than the small-diameter portion. A sectional thickness of the large-diameter portion is less than a sectional thickness of the small-diameter portion, and a first sectional portion from an outer surface to a point corresponding to 35% to 60% of a sectional thickness of the large-diameter portion is carburized to have a first hardness.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: July 10, 2018
    Assignee: ERAE AMS CO., LTD.
    Inventors: Hyun-Il Lee, Jung-Su Noh, Jang-Sun Lee, Jong-Uk Seo, Jae-Seung Jeong, Myung-Gil Chun, Ki-Hoon Kim, Dong-Hyun Song
  • Publication number: 20160223027
    Abstract: A constant-velocity universal joint includes: an outer joint member having a plurality of outer ball grooves; an inner joint member having a plurality of inner ball grooves; a plurality of torque transmitting balls; and a ball cage. The outer ball groove and the inner ball groove respectively have a double shape, and a ratio O/H of an offset value O which is a distance between an inflection point of the outer ball groove and a line connecting centers of the torque transmitting balls in a state that the outer joint member and the inner joint member form 0 angle and a distance H between a center line of the inner joint member and a center of the torque transmitting ball in a state that the outer joint member and the inner joint member form 0 angle is within a range of 0.07 to 0.11.
    Type: Application
    Filed: September 11, 2014
    Publication date: August 4, 2016
    Inventors: Hyun-ll LEE, Jang-Sun LEE, Dong-Jin KIM, Jae-Seung JEONG
  • Publication number: 20160223011
    Abstract: The present invention has been made in an effort to provide a hollow drive shaft and a method for manufacturing the same in which the concentrated load to a weak point which may be occurred by differences of sectional thicknesses and outer diameters is dispersed so that the strength may be uniform throughout the whole length. A hollow drive shaft includes: one or more small-diameter portion having a hollow shape; and a large-diameter portion which is disposed in the vicinity of the small-diameter portion and has an outer diameter relatively greater than the small-diameter portion. A sectional thickness of the large-diameter portion is less than a sectional thickness of the small-diameter portion, and a first sectional portion from an outer surface to a point corresponding to 35% to 60% of a sectional thickness of the large-diameter portion is carburized to have a first hardness.
    Type: Application
    Filed: September 5, 2014
    Publication date: August 4, 2016
    Inventors: Hyun-Il LEE, Jung-Su NOH, Jang-Sun LEE, Jong-Uk SEO, Jae-Seung JEONG, Myung-Gil CHUN, Ki-Hoon KIM, Dong-Hyun SONG
  • Publication number: 20050119526
    Abstract: A mouthpiece for an endoscope includes a main body disposed to closely contact an outer side of a mouth and provided with an central insertion hole through which the endoscope is inserted, an guide body supported on the central insertion hole of the main body to guide insertion of the endoscope, and a movement preventing unit disposed in an oral cavity to prevent the mouthpiece from moving in the oral cavity. The guide body and the movement preventing unit may designed to be separable from the main body.
    Type: Application
    Filed: November 26, 2004
    Publication date: June 2, 2005
    Inventors: Jae-Seung Jeong, Soo Suh, Poong-Lyul Rhee
  • Patent number: 5693183
    Abstract: A method for treating the surface of a silicon substrate, which has been subjected to a dry etching process, including applying an electron cyclotron resonance process to the exposed surface to thereby etch away a thin layer of the exposed surface. The ECR etching process is preferably conducted in an SF.sub.6 --O.sub.2 gas mixture and the thickness of the thin layer is no greater than 500 .ANG.. The silicon wafer damaged and contaminated by the dry etching processes can be repaired to the level of virgin, bare silicon wafer by this method. This silicon wafer treatment method allows the semiconductor device thereby fabricated to have improved operating characteristics. For example, the leak current generated in a semiconductor device fabricated on the silicon wafer which has undergone the present treatment is markedly diminished to approximately one-tenth of the leak current generated in the semiconductor device fabricated on the silicon wafer which has not undergone this treatment.
    Type: Grant
    Filed: October 16, 1996
    Date of Patent: December 2, 1997
    Assignee: LG Semicon Co., Ltd.
    Inventor: Jae Seung Jeong
  • Patent number: D538926
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: March 20, 2007
    Assignee: TNO Co., Ltd.
    Inventors: Jae-Seung Jeong, Soo Won Suh, Poong-Lyul Rhee