Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.

Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.

Abstract: The present invention relates to a transfer technology using a technique of transferring LED chips formed on a wafer to another carrier substrate and display panel, a transfer resin, and an apparatus for transferring an LED chip and a display panel using a resin which expands when light is applied. An apparatus for transferring an LED chip in accordance with an embodiment of the present invention, comprises: a substrate and a resin layer, formed on the substrate, which forms a photo-deteriorating layer and expands at a predetermined temperature. An LED chip is disposed on the resin layer and a lower part of the LED chip is placed in a state of being embedded in the resin layer by a clip-up structure. An adhesive force of the LED chip located in the photo-deteriorating layer is offset so that the LED chip is peeled off or transferred.

Abstract: The present invention relates to a photosensitive transfer resin, an LED chip transfer method, and a method for manufacturing a display device, to which are applied a technique for etching and separating LED chips formed on a wafer and transferring each of the separated chips to a carrier substrate, and a technique for using the photosensitive transfer resin to selectively transfer a portion of each of the chips transferred to the carrier substrate to another carrier substrate and a display panel in succession or at intervals. A photosensitive transfer resin for transferring an LED chip according to an embodiment of the present invention is prepared by mixing a photosensitive resin and a photoactive agent solution obtained by mixing a solvent and a photoactive agent powder. The photosensitive transfer resin can be expanded by heating without a development process following exposure, and thereby be used for peeling or transferring LED chips adhered to the photosensitive transfer resin.

Abstract: The present invention provides a LED chip scale package, comprising: a light emitting diode chip having a pad electrically connected to an external object on one side thereof, a phosphor silicon film surrounding the light emitting diode chip so that a bonding surface of the pad is exposed to an outside, and a metal layer connected to the bonding surface and expanding a surface area of the pad, and a method for manufacturing the same.

Abstract: The present invention relates to a finger-bar-type mower in which blades reciprocate left and right to mow grass. The mower includes: a connection gear which is power-connected to a driving means of the mower; a reduction gear connected to the connection gear; a shaft rotating according to rotation of the reduction gear; a bridge accommodating and supporting the connection gear and the reduction gear; a blade which is power-connected to the shaft and is reciprocated left and right according to rotation of the shaft, the blade including cutting edges; a guide part supporting the bridge and extending along the blade; and wheels respectively connected to both ends of the guide part, wherein the shaft is disposed in center regions of the blade and the guide part.

Abstract: The present invention provides a round chip scale package comprising: a light emitting diode for providing blue light from a side surface and an upper surface thereof; and a three-dimensional fluorescent layer arranged to encompass the side surface and the upper surface of the light emitting diode, thereby converting the blue light emitted from the side surface and the upper surface of the light emitting diode into white light, wherein the three-dimensional fluorescent layer comprises a phosphor and silicon, and an edge region of the three-dimensional fluorescent layer is formed into a round shape.

Abstract: Provided are a manufacturing method of mass-producing a nano or micro color conversion light emitting diode by a photolithography process, and a nano or micro color conversion light emitting diode manufactured therefrom.

Abstract: The present invention provides a round chip scale package comprising: a light emitting diode for providing blue light from a side surface and an upper surface thereof; and a three-dimensional fluorescent layer arranged to encompass the side surface and the upper surface of the light emitting diode, thereby converting the blue light emitted from the side surface and the upper surface of the light emitting diode into white light, wherein the three-dimensional fluorescent layer comprises a phosphor and silicon, and an edge region of the three-dimensional fluorescent layer is formed into a round shape.

Abstract: An apparatus arranges a plurality of items automatically in a form of collage in a canvas while maintaining the original size ratio between the items. The apparatus includes: an arrangement position selecting unit determining a position of a cell which is divided to arrange a k-th item among the respective cells having k?1 items arranged therein in the canvas; a cell dividing unit dividing a cell region of the position determined by the arrangement position selecting unit; an item arranging unit arranging the k-th item at the position of the divided cell; and a first canvas size adjusting unit increasing an entire size of the canvas as needed in the case in which a space to be arranged is insufficient when the item arranging unit arranges the k-th item at the position of the divided cell.

Abstract: The present invention relates to an apparatus for manufacturing fluorescent layers and, more particularly, to an apparatus for manufacturing fluorescent layers, which converts light from a light-emitting diode into white light by varying a wavelength of the light emitted from the light-emitting diode. The present invention provides the apparatus for manufacturing fluorescent layers includes a vertical frame and a fluorescent layer pattern hole formed in a direction vertical to the vertical frame in a fluorescent layer pattern form within the vertical frame.

Abstract: Disclosed herein is a light-emitting diode (LED) package in accordance with an embodiment of the present invention, which includes an LED configured to provide light of a wavelength having a specific region, a circuit board electrically connected to the LED through bonding pads formed at the bottom of the LED, a phosphor layer formed as a cap, disposed to surround sides and a top of the LED, and configured to have sides and top thereof formed to a uniform thickness, and a buffer layer disposed between the top of the LED and a bottom of the phosphor layer and configured to suppress heat, generated from the top of the LED, from being transferred to the bottom of the phosphor layer and to prevent a bottom of the phosphor layer from being deviated from the top of the LED.

Abstract: The present invention provides a light-emitting diode (LED) package including: a substrate on which a set of bonding pads are formed; an LED element configured to provide light of a predetermined wavelength region, having a set of chip pads formed on a top surface thereof and being attached on a top surface of the substrate; a set of gold wires connecting the bonding pads of the substrate with the chip pads of the LED element; a phosphor layer formed in a cap shape having side and top portions of a uniform thickness and being configured to surround sides and a top surface of the LED element while being spaced apart therefrom; and a filler disposed to fill a space formed between the phosphor layer and the LED element, wherein the LED element, the gold wires, and the bonding pads of the substrate are under the phosphor layer cap.

Abstract: The present invention provides a method of manufacturing a phosphor for a light-emitting diode, including filling a phosphor frame in which phosphor models are formed in an engraving form with a fluorescent material solution including a fluorescent material that converts light provided by the light-emitting diode into white light by changing a wavelength of the light provided by the light-emitting diode, polishing a top surface of the phosphor frame filled with the fluorescent material solution, and drying the phosphor frame filled with the fluorescent material solution and polished.

Abstract: A semiconductor light emitting diode is provided. The semiconductor light emitting diode comprises a metal electrode; an n-type cladding over the metal electrode, the n-type cladding comprising a pillar support part formed of an n-type semiconductor material, and a pillar part having a plurality of pillars formed of an n-type semiconductor material over the pillar support part; an active part conformally formed over the pillar part so as to enclose the pillar part and over the pillar support part between the pillar parts, the active part having a quantum well layer and a barrier layer stacked alternately; a p-type cladding conformally formed of a p-type semiconductor material over the active part; and a transparent electrode formed over the p-type cladding.

Abstract: The present invention provides a light-emitting diode (LED) package including: a substrate on which a set of bonding pads are formed; an LED element configured to provide light of a predetermined wavelength region, having a set of chip pads formed on a top surface thereof and being attached on a top surface of the substrate; a set of gold wires connecting the bonding pads of the substrate with the chip pads of the LED element; a phosphor layer formed in a cap shape having side and top portions of a uniform thickness and being configured to surround sides and a top surface of the LED element while being spaced apart therefrom; and a filler disposed to fill a space formed between the phosphor layer and the LED element, wherein the LED element, the gold wires, and the bonding pads of the substrate are under the phosphor layer cap.

Abstract: The present invention provides a Light Emitting Diode (LED) package, comprising a Printed Circuit Board (PCB), an LED mounted on the PCB, a pillar placed higher than the LED around the LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED, and a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting the light emitted from the LED into white light by changing a wavelength of the light, wherein an electrical pad of the LED and an electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.

Abstract: Disclosed herein is a light-emitting diode (LED) package in accordance with an embodiment of the present invention, which includes an LED configured to provide light of a wavelength having a specific region, a circuit board electrically connected to the LED through bonding pads formed at the bottom of the LED, a phosphor layer formed as a cap, disposed to surround sides and a top of the LED, and configured to have sides and top thereof formed to a uniform thickness, and a buffer layer disposed between the top of the LED and a bottom of the phosphor layer and configured to suppress heat, generated from the top of the LED, from being transferred to the bottom of the phosphor layer and to prevent a bottom of the phosphor layer from being deviated from the top of the LED.

Abstract: The present invention provides a package for a light-emitting device, including the light-emitting device configured to provide light having a specific wavelength region, electrode pads formed on the light-emitting device, and a phosphor layer formed over the light-emitting device other than regions where the electrode pads are formed and configured to convert the light of the light-emitting device into white light by changing the wavelength of the light provided by the light-emitting device, wherein the phosphor layer is formed in a conformable thickness and is formed in a region wider than an upper region of the light-emitting device other than the regions where the electrode pads are formed.

Abstract: Disclosed herein is a method of disposing phosphor layers, which can prevent damage to phosphors and also effectively dispose phosphor layers at desired locations of Light-Emitting Diodes (LEDs) when the phosphor layers are detached and disposed at the top surfaces of the LEDs. According to an embodiment, phosphor layers fabricated by filling phosphor layer pattern holes within an area of the vertical frame with a phosphor solution are detached from the phosphor layer pattern holes by applying force downwardly or upwardly in a vertical manner.