Patents by Inventor Jae Sik Sim

Jae Sik Sim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100140662
    Abstract: Provided are an optical receiver and a method of forming the same. The optical receiver includes a lens, a photo detector, and a hetero-junction bipolar transistor. The lens is attached to a backside of a substrate. The photo detector is disposed on a top surface of the substrate. The hetero-junction bipolar transistor is disposed on the top surface of the substrate. The lens condenses an incident optical signal to transmit the condensed optical signal to the photo detector.
    Type: Application
    Filed: July 7, 2009
    Publication date: June 10, 2010
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Young-Jun CHONG, Eun-Soo NAM, Jae-Sik SIM, Yong-Hwan KWON, Bong-Ki MHEEN
  • Publication number: 20100144123
    Abstract: Provided is a method of forming a compound semiconductor device. In the method, a dopant element layer is formed on an undoped compound semiconductor layer. An annealing process is performed to diffuse dopants in the dopant element layer into the undoped compound semiconductor layer, thereby forming a dopant diffusion region. A rapid cooling process is performed using liquid nitrogen with respect to the substrate having the dopant diffusion region.
    Type: Application
    Filed: July 23, 2009
    Publication date: June 10, 2010
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Mi-Ran PARK, Jae-Sik SIM, Yong-Hwan KWON, Bongki MHEEN, Dae Kon OH
  • Publication number: 20100133590
    Abstract: An image sensor with a shared photodiode is provided. The image sensor includes at least two unit pixels, each of which includes a photodiode, a diffusion region which gathers electrons from the photodiode, a transfer transistor which connects the photodiode with the diffusion region, and a readout circuit which reads out a signal from the diffusion region. Photodiodes of neighboring unit pixels are disposed symmetrically to be adjacent to one another to form a shared photodiode. The image sensor does not have a STI region which causes a dark current restricting its performance and does not require a basic minimum design factor (a distance or an area) related to a STI region. A region corresponding to a STI region may be used as a region of a photodiode or for additional pixel scaling. Therefore, a limitation in scaling of a photodiode is overcome, and pixel performance is improved in spite of pixel scaling.
    Type: Application
    Filed: November 25, 2009
    Publication date: June 3, 2010
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Bong Ki Mheen, Albert J. P. Theuwissen, Jae Sik Sim, Mi Ran Park, Yong Hwan Kwon, Eun Soo Nam
  • Publication number: 20080285978
    Abstract: Provided is an optical hybrid module in which an optical device, a filter, an amplifier and an antenna are hybrid-integrated, which includes: a silicon optical bench disposed on a substrate and having an optical fiber and an optical device; an amplifier disposed on the substrate and connected to the optical device disposed on the silicon optical bench to amplify a signal transmitted from the optical device; and an antenna disposed on the substrate to be connected to the amplifier and transmitting a signal amplified by the amplifier. Thus, a foot-print module may be embodied by disposing an antenna and a filter on a single- or multi-layer substrate and providing a bias required for the optical device and the amplifier through a solder ball. Also, due to the antenna and filter disposed on the substrate, an expensive connector is not needed, and thus a production costs can be reduced.
    Type: Application
    Filed: March 24, 2008
    Publication date: November 20, 2008
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kwang Seong Choi, Yong Duck Chung, Jae Sik Sim, Jong Tae Moon, Hyun Kyu Yu, Je Ha Kim
  • Publication number: 20080137178
    Abstract: Provided is a reflection-type optical modulation module. According to the reflection-type optical modulation module, an anti-reflective thin film is formed on the optical input/output side surface of a waveguide to reduce optical coupling loss, and also a high-reflective thin film is formed on the opposite side surface to feed back a modulated optical signal. Thus, even when the length of an absorption layer is shortened, a sufficient optical path length is available, and it is possible to obtain a sufficient extinction ratio. Since the optical path length is sufficiently long despite a reduction in the length of the device, capacitance is reduced, and high-speed operation is enabled. In addition, only one lensed optical fiber for optical input and output is used, and thus it is possible to reduce production cost and the number of installation processes.
    Type: Application
    Filed: December 4, 2007
    Publication date: June 12, 2008
    Inventors: Yong Duck CHUNG, Kwang Seong CHOI, Jae Sik SIM, Je Ha KIM
  • Patent number: 7310469
    Abstract: A waveguide PIN photodiode is provided. The waveguide PIN photodiode includes a lower light guide layer, a light absorption layer, an upper light guide layer, and a cladding layer. The lower light guide is formed on a substrate, and the light absorption layer is formed on the lower light guide layer. The upper light guide layer is formed on the light absorption layer, and the cladding layer is formed on the upper light guide layer. The lower light guide layer, the light absorption layer, and the upper light guide layer constitute a core layer, which is an optical waveguide, and graded index distribution is symmetrically formed in a depth direction, centering around the light absorption layer having a highest refractive index.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: December 18, 2007
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Sahng Gi Park, Eun Deok Sim, Jeong Woo Park, Jae Sik Sim, Yong Soon Baek