Patents by Inventor Jae Sub Cho

Jae Sub Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Camera module and method of manufacturing the same
    Patent number: 8149321
    Abstract: Provided is a camera module including a housing that is formed in a rectangular box shape and has a cylindrical barrel coupling portion extending upward from the central portion thereof; an image sensor module that is mounted in the housing; a lens barrel that has a lens insertion port provided in the central portion thereof and a housing coupling portion extending downward therefrom, the housing coupling portion being closely coupled to the barrel coupling portion of the housing; a wafer lens that is mounted in the lens insertion port of the lens barrel; and a lens fixing cap that is covered on the upper end portion of the lens barrel.
    Type: Grant
    Filed: April 11, 2008
    Date of Patent: April 3, 2012
    Assignee: Samsung Electro-Mechanincs Co., Ltd.
    Inventors: Jin Mun Ryu, Jung Jin Kim, Bo Kyoung Kim, Jae Sub Cho
  • Camera module package
    Patent number: 7664390
    Abstract: A camera module package comprises a housing having a lens section mounted therein; a circuit board having a window through which light transmitted through the lens section of the housing passes; an image sensor that is flip-chip bonded to a lower surface of the circuit board; and an impact absorbing member attached to an upper surface of the circuit board, of which the side surface serves as a coupling guide which is coupled to an inner periphery of the housing.
    Type: Grant
    Filed: November 30, 2006
    Date of Patent: February 16, 2010
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Sub Cho, Jung Jin Kim
  • Camera module
    Publication number: 20080278621
    Abstract: The present invention relates to a camera module capable of being surface mounted (SMT) on a main substrate.
    Type: Application
    Filed: May 8, 2008
    Publication date: November 13, 2008
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Sub Cho, Jung Jin Kim, Jin Mun Ryu, Bo Kyoung Kim
  • Camera module and method of manufacturing the same
    Publication number: 20080252775
    Abstract: Provided is a camera module including a housing that is formed in a rectangular box shape and has a cylindrical barrel coupling portion extending upward from the central portion thereof; an image sensor module that is mounted in the housing; a lens barrel that has a lens insertion port provided in the central portion thereof and a housing coupling portion extending downward therefrom, the housing coupling portion being closely coupled to the barrel coupling portion of the housing; a wafer lens that is mounted in the lens insertion port of the lens barrel; and a lens fixing cap that is covered on the upper end portion of the lens barrel.
    Type: Application
    Filed: April 11, 2008
    Publication date: October 16, 2008
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Mun Ryu, Jung Jin Kim, Bo Kyoung Kim, Jae Sub Cho
  • Camera module package
    Publication number: 20070217786
    Abstract: A camera module package comprises a housing having a lens section mounted therein; a circuit board having a window through which light transmitted through the lens section of the housing passes; an image sensor that is flip-chip bonded to a lower surface of the circuit board; and an impact absorbing member attached to an upper surface of the circuit board, of which the side surface serves as a coupling guide which is coupled to an inner periphery of the housing.
    Type: Application
    Filed: November 30, 2006
    Publication date: September 20, 2007
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Sub Cho, Jung Jin Kim