Patents by Inventor Jae-Sub OH

Jae-Sub OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230367201
    Abstract: A method for forming a line and a space pattern, according to one embodiment of the present invention, comprises exposing a mask in a first direction and a second direction on a substrate and stitching same. The method for forming a line and a space pattern comprises the steps of: performing first exposure on the substrate so that first shots of the mask come in contact with each other in the first direction; and performing second exposure on the substrate so that second shots of the mask come in contact with each other so as to be distanced in the second direction and be offset with respect to the first shots in the first direction.
    Type: Application
    Filed: July 18, 2023
    Publication date: November 16, 2023
    Inventors: Jungchul SONG, Jae-Sub OH, Min Jun PARK, Hui Jae CHO, Kwang Hee KIM, Chang Hee HAN
  • Patent number: 11359973
    Abstract: A MEMS device according to an example embodiment of the present disclosure includes: a lower substrate; an infrared sensor formed on the lower substrate; and a lower bonding pad disposed to cover the infrared sensor. The infrared sensor includes: a metal pad formed on an upper surface of the lower substrate and electrically connected to a detection circuit; a reflective layer formed on the upper surface of the lower substrate and reflecting an infrared band; an absorption plate disposed to be spaced apart from an upper portion of the reflective layer and absorbing infrared rays to change resistance; and an anchor formed on the metal pad to support the absorption plate and to electrically connect the metal pad and the absorption plate to each other. The reflective layer has a curved or stepped shape such that a distance between the reflective layer and the absorption plate varies depending on a position of the reflective layer.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: June 14, 2022
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jong-Kwon Lee, Jae-Sub Oh, Jongcheol Park
  • Publication number: 20210278282
    Abstract: A MEMS device according to an example embodiment of the present disclosure includes: a lower substrate; an infrared sensor formed on the lower substrate; and a lower bonding pad disposed to cover the infrared sensor. The infrared sensor includes: a metal pad formed on an upper surface of the lower substrate and electrically connected to a detection circuit; a reflective layer formed on the upper surface of the lower substrate and reflecting an infrared band; an absorption plate disposed to be spaced apart from an upper portion of the reflective layer and absorbing infrared rays to change resistance; and an anchor formed on the metal pad to support the absorption plate and to electrically connect the metal pad and the absorption plate to each other. The reflective layer has a curved or stepped shape such that a distance between the reflective layer and the absorption plate varies depending on a position of the reflective layer.
    Type: Application
    Filed: May 24, 2021
    Publication date: September 9, 2021
    Inventors: Jong-Kwon LEE, Jae-Sub OH, Jongcheol PARK