Patents by Inventor Jae-Sub Shin

Jae-Sub Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5455680
    Abstract: The present invention relates to an apparatus for compressing and decompressing the digital image data designed for minimizing degradation of the image quality and for improving the compression efficiency. Discriminative over the conventional package quantization method based on the statistical characteristics of an image, the invention is configured such that the image is firstly segmented into predetermined number of sub-blocks by the block segmentator, and each divided blocks are adopted by the different compression technique in accordance with the shape or complicity of the image.
    Type: Grant
    Filed: November 17, 1993
    Date of Patent: October 3, 1995
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jae-Sub Shin
  • Patent number: 5381490
    Abstract: There is disclosed an image processing apparatus for emphasizing edge components of an image signal to be provided from an image input system.
    Type: Grant
    Filed: August 19, 1992
    Date of Patent: January 10, 1995
    Assignee: Samsung Electronics Co. Ltd.
    Inventor: Jae-Sub Shin
  • Patent number: 5307454
    Abstract: An image processing apparatus extracts a local image from an original image which is supplied by an image input unit, the local image corresponding to a local area, designated by a coordinate data input unit, and being supplied to an image output unit. The apparatus extracts local image data by using coordinate data associated with boundary pixels positioned in boundary lines between the local image and other parts of the original image. The extracted local image data are then provided to the image output unit in accordance with horizontal and vertical synchronizing signals applied from a generator.
    Type: Grant
    Filed: November 25, 1992
    Date of Patent: April 26, 1994
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jae-Sub Shin