Abstract: An impregnated printed circuit board and a manufacturing method for the same are disclosed, in which the surface for installing semiconductor devices is uniform. The manufacturing method includes the following steps. That is, a resist is spread on a metal sheet, and copper is coated on areas of the metal sheet other than the areas of the resist. The resist is removed, and another metal sheet is disposed in parallel to and slightly separated from the above metal sheet. Then an insulating resin is inserted into between the two metal sheets, and they are pressed together. Then the metal sheets are removed, thereby completing the manufacture of the impregnated printed circuit board. Thus the component-installing surface is smoothly flat, and any height difference between the circuit pattern and the base sheet is eliminated. Therefore, the formation of a short circuit or open circuit can be prevented.

Abstract: A printed circuit board having multiple layers, includes: a copper film for removing signal interference and noise and matching impedance, formed between pads of a lowermost layer which are connected to of an uppermost layer.