Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.

Abstract: Provided are a compound capable of improving the light-emitting efficiency, stability, and lifespan of an element; an organic electronic element using same; and an electronic device thereof.

Abstract: The present disclosure relates to an apparatus for fabricating a display panel including: an attachment member having a fixing portion in a pressurization direction to which a pressurization header is fixed, an attachment driving member configured to move the attachment member and the pressurization header in the pressurization direction or a detachment direction through a fixing frame of the attachment member, a first pressure sensing module between the pressurization header and the attachment member and configured to generate first pressure detection signals according to pressure applied to the pressurization header, a gradient setting module configured to set a gradient of the pressurization header based on magnitudes of the first pressure detection signals, and a gradient control module configured to adjust gradients of the pressurization header, the attachment member, and the fixing frame according to control of the gradient setting module.

Abstract: A method of a first terminal may include: identifying first RB set(s) to be used for SL communication among consecutive RB sets through an LBT procedure; identifying a first subchannel group included in the first RB set(s) and a second subchannel group including a first PRB in the first RB set(s), the first PRB being not included in the first subchannel group; configuring the first PRB within the second subchannel group as an SL communication resource; and transmitting, to a second terminal, control information indicating that the first PRB is configured as the SL communication resource.

Abstract: A display device includes a substrate that includes a display area and a non-display area, a display element layer disposed on the display area of the substrate, an opposing substrate that faces the substrate and the display element layer, a sealing member disposed on the non-display area and that couples the substrate and the opposing substrate, and a filler disposed between the substrate and the opposing substrate. A thickness of the filler varies in the range of 60% to 400% of a thickness of the sealing member.

Abstract: The present disclosure relates to an organic film polishing composition in which a high polishing speed is maintained not only for polymers, an SOC, and an SOH, but also for organic films strongly bonded by covalent bonds such as an amorphous carbon layer (ACL) or a diamond-like carbon (DLC) by including a polishing accelerator containing both a hydrophilic group and a hydrophobic group, and a polishing method using the same.

Abstract: A vehicle seat reinforcement device includes a leg portion mounted on a floor panel, a seat cushion frame slidably mounted on the leg portion, and a load reinforcing structure connected between the leg portion and the seat cushion frame, wherein when a seat belt anchorage load is transferred to the seat cushion frame, the seat cushion frame is locked to the leg portion by the load reinforcing structure.

Abstract: Provided is a peptide composition for preventing or treating Alzheimer's dementia. A peptide or a salt substituent thereof according to the presently claimed subject matter exhibits effects such as suppression of LPS-mediated cytokine production, suppression of LPS-induced neuroinflammation, amelioration of cognitive impairment, suppression of beta amyloid or tau protein aggregation, and suppression of neuronal loss. The polypeptide or the salt substituent thereof can permeate the blood-brain barrier, and thus, is expected to be usefully used for preventing or treating Alzheimer's dementia.

Abstract: A bulk-acoustic wave (BAW) resonator includes a central portion in which a first electrode, a piezoelectric layer, and a second electrode are sequentially stacked on a substrate, and an extension portion extending externally from the central portion, and an insertion layer and a loss prevention film are disposed in the extension portion between the substrate and the second electrode. The loss prevention film is formed to have a thickness of 50 ? to 500 ?. The insertion layer is stacked on the loss prevention film, and has a side surface opposing the central portion, the side surface is formed as a first inclined surface having a first inclination angle. The loss prevention film has a side surface opposing the central portion, the side surface is formed as a second inclined surface having a second inclination angle. The second inclination angle is formed to be greater than the first inclination angle.

Abstract: The present invention provides methods for treating or ameliorating metabolic diseases, cholestatic liver diseases, or organ fibrosis, which comprises administering to a subject a therapeutically effective amount of a pharmaceutical composition comprising an isoxazole derivative, a racemate, an enantiomer, or a diastereoisomer thereof, or a pharmaceutically acceptable salt of the derivative, the racemate, the enantiomer, or the diastereoisomer.

Abstract: The present invention relates to a transfer technology using a technique of transferring LED chips formed on a wafer to another carrier substrate and display panel, a transfer resin, and an apparatus for transferring an LED chip and a display panel using a resin which expands when light is applied. An apparatus for transferring an LED chip in accordance with an embodiment of the present invention, comprises: a substrate and a resin layer, formed on the substrate, which forms a photo-deteriorating layer and expands at a predetermined temperature. An LED chip is disposed on the resin layer and a lower part of the LED chip is placed in a state of being embedded in the resin layer by a clip-up structure. An adhesive force of the LED chip located in the photo-deteriorating layer is offset so that the LED chip is peeled off or transferred.

Abstract: The present invention relates to a photosensitive transfer resin, an LED chip transfer method, and a method for manufacturing a display device, to which are applied a technique for etching and separating LED chips formed on a wafer and transferring each of the separated chips to a carrier substrate, and a technique for using the photosensitive transfer resin to selectively transfer a portion of each of the chips transferred to the carrier substrate to another carrier substrate and a display panel in succession or at intervals. A photosensitive transfer resin for transferring an LED chip according to an embodiment of the present invention is prepared by mixing a photosensitive resin and a photoactive agent solution obtained by mixing a solvent and a photoactive agent powder. The photosensitive transfer resin can be expanded by heating without a development process following exposure, and thereby be used for peeling or transferring LED chips adhered to the photosensitive transfer resin.

Abstract: The present invention provides a LED chip scale package, comprising: a light emitting diode chip having a pad electrically connected to an external object on one side thereof, a phosphor silicon film surrounding the light emitting diode chip so that a bonding surface of the pad is exposed to an outside, and a metal layer connected to the bonding surface and expanding a surface area of the pad, and a method for manufacturing the same.

Abstract: A cooling circuit for a vehicle may include a plurality of cylinder heads into which cooling water is continuously introduced from a plurality of cylinder blocks oppositely disposed parallel with each other, wherein a flow control valve may include a head port, through which the cooling water discharged from the plurality of cylinder heads is joined and the joined cooling water is introduced into the flow control valve, and wherein the flow control valve also may include a set of ports including a radiator port, a heat exchanger port, and a heater core port, through which the cooling water introduced into the flow control valve is discharged towards a radiator, an oil heat exchanger, and a heater core, respectively.

Abstract: An electronic thermostat control system may include a control duty determination portion outputting PWM duty signal for controlling the coolant temperature according to a coolant temperature, a rising rate of the coolant temperature, an engine speed, a load and a vehicle speed, a driving portion applying a time condition to the PWM duty signal output by the control duty determination portion for controlling outputting interval, and a fault diagnosis portion diagnosing operations of the electronic thermostat by analyzing the signals output by the driving portion and changes of the coolant temperature.

Abstract: A cooling circuit for a vehicle may include a plurality of cylinder heads into which cooling water is continuously introduced from a plurality of cylinder blocks oppositely disposed parallel with each other, wherein a flow control valve may include a head port, through which the cooling water discharged from the plurality of cylinder heads is joined and the joined cooling water is introduced into the flow control valve, and wherein the flow control valve also may include a set of ports including a radiator port, a heat exchanger port, and a heater core port, through which the cooling water introduced into the flow control valve is discharged towards a radiator, an oil heat exchanger, and a heater core, respectively.

Abstract: An electronic thermostat control system may include a control duty determination portion outputting PWM duty signal for controlling the coolant temperature according to a coolant temperature, a rising rate of the coolant temperature, an engine speed, a load and a vehicle speed, a driving portion applying a time condition to the PWM duty signal output by the control duty determination portion for controlling outputting interval, and a fault diagnosis portion diagnosing operations of the electronic thermostat by analyzing the signals output by the driving portion and changes of the coolant temperature.

Abstract: An electronic thermostat control system may include a control duty determination portion outputting PWM duty signal for controlling the coolant temperature according to a coolant temperature, a rising rate of the coolant temperature, an engine speed, a load and a vehicle speed, a driving portion applying a time condition to the PWM duty signal output by the control duty determination portion for controlling outputting interval, and a fault diagnosis portion diagnosing operations of the electronic thermostat by analyzing the signals output by the driving portion and changes of the coolant temperature.

Abstract: A control method of an electrical thermostat that includes an operating heater heating wax so as to operate an operating valve that may be disposed to close a coolant passage according to an exemplary embodiment of may include detecting a coolant temperature of coolant circulating a coolant passage, determining whether the coolant temperature may be included in a predetermined heating temperature range, performing a coolant heating mode by supplying a predetermined level of power to the operating heater for a predetermined time, if the coolant temperature may be within the heating temperature range, and stopping the coolant heating mode in a condition that the operating valve may be closed.

Abstract: A sintered alloy for a valve seat may be manufactured using a method including: mixing MnS with an alloy powder for a valve seat including C at 0.8-1.2 wt %, Ni at 2.0-4.5 wt %, Cr at 3.0-5.0 wt %, Mo at 16.0-20.0 wt %, Co at 9.0-13.0 wt %, V at 0.05-0.15 wt %, S at 0.2-0.8 wt %, Fe, and additional inevitable impurities; making a first shape by forming the mixed materials; pre-sintering the first formed shape; making a secondary shape by re-pressing the first pre-sintered shape; main-sintering the secondary shape; and tempering the main-sintered secondary shape.