Patents by Inventor Jae-Sun Cho

Jae-Sun Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240141061
    Abstract: The present disclosure relates to an antibody binding specifically to CD55 or an antigen-binding fragment thereof; and a composition for preventing, treating and/or diagnosing cancer containing the same. The antibody of the present disclosure may be used as an effective therapeutic composition for various CD55-mediated diseases since it shows high binding ability and inhibitory effect for the CD55 protein which promotes tumor growth by inhibiting the complement immune mechanism. In addition, the antibody of the present disclosure may be usefully used as an effective therapeutic adjuvant that fundamentally removes drug resistance and remarkably improves therapeutic responsiveness in various diseases in which resistance to therapeutic agents with CDC (complement-dependent cytotoxicity) as a mechanism of action has been induced due to overexpression of CD55.
    Type: Application
    Filed: January 12, 2022
    Publication date: May 2, 2024
    Applicants: SG MEDICAL INC, KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, KOREA ATOMIC ENERGY RESEARCH INSTITUTE
    Inventors: Ji Chul LEE, Hye In PARK, Sung-Won MIN, Sung-Won MIN, Hyeong Sun KWON, Jae Cheong LIM, So Hee DOH, Eun Ha CHO, So-Young LEE, Sung Hee JUNG
  • Publication number: 20240139003
    Abstract: Provided is a bioresorbable stent including a stent substrate including a bioresorbable polymer and a contrast medium containing an iodine component, coated on the stent substrate. Since the stent according to the present invention is absorbed in and removed from the human body after a predetermined time, it has excellent biodegradability since it has improved radiopacity by iodine contrast medium coating, it has a high radiography contrast and is very efficient even when a procedure is performed with real time radiography, and since it has low foreshortening and high flexibility, radial force, and re-coil, it may be useful for insertion into a blood vessel having a small diameter, an acute occlusive lesion, an imminent occlusive lesion, and the like.
    Type: Application
    Filed: May 13, 2022
    Publication date: May 2, 2024
    Inventors: Myung Ho JEONG, Dae Sung PARK, Jae Un KIM, Mun Ki KIM, Doo Sun SIM, Kyung Hoon CHO, Dae Young HYUN, Jun Kyu PARK
  • Publication number: 20240136175
    Abstract: The present invention relates to an auxiliary precursor, a thin film precursor composition, a method of forming a thin film using the thin film precursor composition, and a semiconductor substrate fabricated using the method. The present invention provides the thin film precursor composition including a thin film precursor compound and a compound having a predetermined structure that exhibits reaction stability as the auxiliary precursor. By using the thin film precursor composition in a thin film deposition process, side reactions may be suppressed, and thin film growth rate may be appropriately controlled. In addition, since process by-products are removed from a thin film, even when a thin film is formed on a substrate having a complicated structure, step coverage and the thickness uniformity and resistivity characteristics of the thin film may be greatly improved.
    Type: Application
    Filed: February 22, 2022
    Publication date: April 25, 2024
    Inventors: Jae Sun JUNG, Chang Bong YEON, Seung Hyun LEE, Ji Hyun NAM, Sung Woo CHO
  • Publication number: 20240103958
    Abstract: A method performed by a managing server includes: receiving, from an electronic device, operation data of the electronic device; identifying, by using artificial intelligence (AI), a device usage pattern of the electronic device; identifying, by using the AI, information related to a failure or an abnormal operation of the electronic device and a solution to the failure or the abnormal operation based on the device usage pattern and the operation data received from the electronic device; and transmitting, to a user terminal, the information related to the failure or the abnormal operation of the electronic device and the solution to the failure or the abnormal operation.
    Type: Application
    Filed: December 4, 2023
    Publication date: March 28, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Hun LEE, Myung-Sun KIM, Ayush JAIN, Tae-Ho SWANG, Jae-Hong KIM, Hye-Jung CHO
  • Publication number: 20240093307
    Abstract: The present disclosure relates to a serum exosomal SF3B4 marker composition for diagnosing early stage hepatocellular carcinoma for noninvasive in vitro diagnosis, wherein, by analyzing an expression level of SF3B4 in plasma proteins as well as expression of SF3B4 in exosomes present in sera of hepatocellular carcinoma patients, the possibility as the most suitable liquid biopsy marker was identified, and a new noninvasive biomarker with high diagnostic accuracy in early stage hepatocellular carcinoma for which no reliable biomarker exists at this present was discovered. As such, by using exosomes to identify cancer cell genomes and proteomes without biopsy, the exosomes are highly applicable in the future as a diagnostic biomarker that is useful in a disease group with a high risk in the biopsy such as hepatocellular carcinoma.
    Type: Application
    Filed: May 24, 2023
    Publication date: March 21, 2024
    Applicant: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Soon Sun KIM, Jung Woo EUN, Jae Youn CHEONG, Hyo Jung CHO, Ho Chul KANG, JuA SON
  • Publication number: 20240093771
    Abstract: The present invention relates to a method for designing a cycloidal gear tooth profile of a gear shift actuator, the method designing a profile to have a backlash through a change in the radius of a rolling circle of an internal or external tooth profile of a cycloidal gear, and thus enables the smooth engagement of internal teeth and external teeth, reduces the engagement range of the internal teeth and the external teeth to have excellent durability and enable power loss to be reduced, and enables the shape machining of the gear by using general cycloidal gear machining, thereby facilitating manufacturing and being capable of improving machining precision.
    Type: Application
    Filed: November 24, 2021
    Publication date: March 21, 2024
    Inventors: Jong Sun OH, Chul yong KANG, Soo Bong CHO, Jae Seung KIM
  • Publication number: 20240079413
    Abstract: A complementary thin film transistor (TFT) includes a substrate and a first TFT and a second TFT disposed on the substrate, wherein a first conductive semiconductor layer of the first TFT and a second gate electrode layer of the second TFT are disposed in the same layer and include the same material.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 7, 2024
    Inventors: Himchan OH, Jong-Heon YANG, Ji Hun CHOI, Seung Youl KANG, Yong Hae KIM, Jeho NA, Jaehyun MOON, Chan Woo PARK, Sung Haeng CHO, Jae-Eun PI, Chi-Sun HWANG
  • Patent number: 7339663
    Abstract: A method and apparatus of classifying repetitive defects on a substrate is provided. Defects of dies on the substrate are sequentially compared with a predetermined reference die. Sets of coordinates are marked on the reference die which are corresponding to the position of the defects on the dies on the substrate. Then, repetitive defects are classified which are repeatedly marked in a specified region on the reference die.
    Type: Grant
    Filed: July 13, 2005
    Date of Patent: March 4, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Kyu Lim, Byung-Am Lee, Byung-Seol Ahn, Jae-Sun Cho, Chang-Hoon Lee, Jung-Lan Lee, Sung-Man Lee
  • Patent number: 7155366
    Abstract: A wafer pattern inspecting apparatus and method are disclosed. The apparatus comprises an image sensor to acquire image data from a reference die and a sample die, an external memory to store the image data, an encoder to compress the data, a decoder to decompress the data, an internal memory device to store the compressed image data of the reference die, an arithmetic module to process the image data for the reference dies to extract a reference image data, a reference storage memory to store compressed reference image data, and a comparison module to compare the sample die image data with the reference image data to an extract defect data for the sample die.
    Type: Grant
    Filed: November 30, 2004
    Date of Patent: December 26, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chang-Hoon Lee, Byung-Am Lee, Byung-Seol Ahn, Jae-Sun Cho, Joo-Woo Kim, Sung-Man Lee
  • Publication number: 20060012782
    Abstract: A method and apparatus of classifying repetitive defects on a substrate is provided. Defects of dies on the substrate are sequentially compared with a predetermined reference die. Sets of coordinates are marked on the reference die which are corresponding to the position of the defects on the dies on the substrate. Then, repetitive defects are classified which are repeatedly marked in a specified region on the reference die.
    Type: Application
    Filed: July 13, 2005
    Publication date: January 19, 2006
    Inventors: Young-Kyu Lim, Byung-Am Lee, Byung-Seol Ahn, Jae-Sun Cho, Chang-Hoon Lee, Jung-Lan Lee, Sung-Man Lee
  • Publication number: 20060013092
    Abstract: A method of aligning a substrate can comprise primarily aligning the substrate having a pattern, obtaining pattern information corresponding to a configuration of the pattern, comparing the pattern information with predetermined reference pattern information to corroborate the acceptability of the pattern information, selectively exchanging the predetermined reference pattern information with the pattern information based on the acceptability of the pattern information, and secondarily aligning the substrate to correlate the position of the pattern with the pattern information.
    Type: Application
    Filed: July 8, 2005
    Publication date: January 19, 2006
    Inventors: Sung-Man Lee, Byung-Am Lee, Byung-Seol Ahn, Jae-Sun Cho, Chang-Hoon Lee, Young-Kyu Lim
  • Publication number: 20050119844
    Abstract: A wafer pattern inspecting apparatus and method are disclosed. The apparatus comprises an image sensor to acquire image data from a reference die and a sample die, an external memory to store the image data, an encoder to compress the data, a decoder to decompress the data, an internal memory device to store the compressed image data of the reference die, an arithmetic module to process the image data for the reference dies to extract a reference image data, a reference storage memory to store compressed reference image data, and a comparison module to compare the sample die image data with the reference image data to an extract defect data for the sample die.
    Type: Application
    Filed: November 30, 2004
    Publication date: June 2, 2005
    Inventors: Chang-Hoon Lee, Byung-Am Lee, Byung-Seol Ahn, Jae-Sun Cho, Joo-Woo Kim, Sung-Man Lee