Abstract: The present disclosure relates to a method for manufacturing a semiconductor device structure, comprising the steps of: securing the position of a semiconductor device on a plate; securing the positions of electrodes such that the electrodes face the plate; covering the semiconductor device with an encapsulating material; and separating, from the plate, the semiconductor device covered with the encapsulating material.

Abstract: The present disclosure relates to a method for manufacturing a semiconductor device structure, comprising the steps of: securing the position of a semiconductor device on a plate; securing the positions of electrodes such that the electrodes face the plate; covering the semiconductor device with an encapsulating material; and separating, from the plate, the semiconductor device covered with the encapsulating material.

Abstract: The invention is directed to a food cup comprising a body formed of an edible, flour based, raised bread composition, the body comprising a bottom wall having a periphery, a sidewall extending from the periphery of the bottom wall and an opening defined by the top of the sidewall. The bottom wall and the sidewall define a cavity therein accessible by the opening, the cavity being adapted to receive and contain food. The invention is also directed to a food cup serving wherein a food cup is at least partially filled with a food filling. The invention is further directed to a food cup delivery system comprising a container comprising a plurality of receptacles, each receptacle being configured to receive a food cup such that the food cup is supported in an approximately vertical position by the receptacle. At least one food cup is provided in a receptacle, the cavity of the food cup being filled to at least partial capacity with an edible food filling.