Abstract: A cigarette includes a tobacco rod, a front end plug positioned at a front end of the tobacco rod, a filter rod positioned at a rear end of the tobacco rod, and a wrapper surrounding the tobacco rod, the front end plug, and the filter rod and including at least one perforation formed in an area of the wrapper to allow air to flow to the inside of the wrapper.

Abstract: Provided is an aerosol-generating article including a wrapper which is discolored as the aerosol-generating material is heated, the aerosol-generating article including: a tobacco rod; a front-end plug arranged on a side of the tobacco rod; a filter rod arranged on the other side of the tobacco rod; and the wrapper surrounding the tobacco rod, the front-end plug, and the filter rod, wherein the wrapper includes a thermochromic material which is heated and discolored by an aerosol-generating device when the aerosol-generating article is inserted into the aerosol-generating device.

Abstract: A vehicle seat reinforcement device includes a leg portion mounted on a floor panel, a seat cushion frame slidably mounted on the leg portion, and a load reinforcing structure connected between the leg portion and the seat cushion frame, wherein when a seat belt anchorage load is transferred to the seat cushion frame, the seat cushion frame is locked to the leg portion by the load reinforcing structure.

Abstract: The present disclosure relates to a method for manufacturing a semiconductor device structure, comprising the steps of: securing the position of a semiconductor device on a plate; securing the positions of electrodes such that the electrodes face the plate; covering the semiconductor device with an encapsulating material; and separating, from the plate, the semiconductor device covered with the encapsulating material.

Abstract: The present disclosure relates to a method for manufacturing a semiconductor device structure, comprising the steps of: securing the position of a semiconductor device on a plate; securing the positions of electrodes such that the electrodes face the plate; covering the semiconductor device with an encapsulating material; and separating, from the plate, the semiconductor device covered with the encapsulating material.

Abstract: The invention is directed to a food cup comprising a body formed of an edible, flour based, raised bread composition, the body comprising a bottom wall having a periphery, a sidewall extending from the periphery of the bottom wall and an opening defined by the top of the sidewall. The bottom wall and the sidewall define a cavity therein accessible by the opening, the cavity being adapted to receive and contain food. The invention is also directed to a food cup serving wherein a food cup is at least partially filled with a food filling. The invention is further directed to a food cup delivery system comprising a container comprising a plurality of receptacles, each receptacle being configured to receive a food cup such that the food cup is supported in an approximately vertical position by the receptacle. At least one food cup is provided in a receptacle, the cavity of the food cup being filled to at least partial capacity with an edible food filling.