Abstract: Disclosed is a source drive integrated circuit comprising: a core unit, a channel processing unit provided in each of a channel area disposed in a first side of the control area and a channel area disposed in a second side of the control area facing the first side to convert digital data, corresponding to a digital image signal transferred from the core unit, into a data voltage corresponding to an analog image signal and to output the data voltage, a resistor string provided in at least one of a pad area disposed in a third side of the control area and a pad area disposed in a fourth side of the control area facing the third side to generate a gamma voltage for converting the digital data into the data voltage and to supply the gamma voltage to the channel processing unit, and N number of gamma pads.

Abstract: Disclosed are a drive integrated circuit (IC) capable of being applied to all of a chip on film (COF) type and a chip on glass (COG) type and a display device including the drive IC. The drive IC includes an input pad part including a plurality of input bumps and an output pad part including a plurality of first diode parts, a plurality of second diode parts, and a plurality of output bumps. At least two of the plurality of output bumps overlap the plurality of first diode parts and the plurality of second diode parts, and a first output bump of the at least two output bumps is connected to at least one of the plurality of first diode parts and at least one of the plurality of second diode parts.

Abstract: Disclosed is a source drive integrated circuit comprising: a core unit, a channel processing unit provided in each of a channel area disposed in a first side of the control area and a channel area disposed in a second side of the control area facing the first side to convert digital data, corresponding to a digital image signal transferred from the core unit, into a data voltage corresponding to an analog image signal and to output the data voltage, a resistor string provided in at least one of a pad area disposed in a third side of the control area and a pad area disposed in a fourth side of the control area facing the third side to generate a gamma voltage for converting the digital data into the data voltage and to supply the gamma voltage to the channel processing unit, and N number of gamma pads.

Abstract: Disclosed are a drive integrated circuit (IC) capable of being applied to all of a chip on film (COF) type and a chip on glass (COG) type and a display device including the drive IC. The drive IC includes an input pad part including a plurality of input bumps and an output pad part including a plurality of first diode parts, a plurality of second diode parts, and a plurality of output bumps. At least two of the plurality of output bumps overlap the plurality of first diode parts and the plurality of second diode parts, and a first output bump of the at least two output bumps is connected to at least one of the plurality of first diode parts and at least one of the plurality of second diode parts.

Abstract: A heat pipe having a woven-wired wick according to the present invention is for improving a capillary force and permeability and simplifying the manufacturing process thereof. The heat pipe uses a wick in order to increase permeability. The heat pipe comprises a pipe body; and a wick having a larger diameter than that of the pipe body before being inserted into the pipe body and a smaller diameter than that of the pipe body after being inserted into the pipe body. The wick includes a plurality of groups of wires which are spirally woven to form a cylindrical wick and each wire is made of a material having an elasticity.

Abstract: A power on/off mechanism of a plug-in unit driven by an insertion/ejection device in a printed circuit board (PCB) which is adapted to various power switch on/off switches in accordance with a characteristic of a plug-in unit, thus reducing manufacturing costs and easily maintaining parts. The mechanism includes a power switch on/off lever having a protrusion formed in one end thereof which is inserted into a guide groove formed in a center portion of the handle when inserting/ejecting the plug-in unit and a jaw formed in another end thereof for receiving the power switch lever. The power switch on/off lever is inserted into a lever engaging hole formed in the bracket, and the power switch lever is position in the interior of the jaw.

Abstract: An improved electrostatic discharge protection guide rail system for a PCB which is capable of providing an electrostatic discharge protection function so that a PCB of a plug-in unit disposed in a sub-rack of an electronic instrument from a damage due to an electrostatic discharge (ESD), which includes an ESD ground surface formed on the PCB, an engaging jaw portion formed in a lower portion of the guide rail and having a groove, and an insertion groove formed in a side portion of the guide rail in order for the ESD strip to be inserted therein, wherein the bent ESD strip is inserted into the insertion groove, the ESD ground surface contact portion and the ESD PCB contact portion are inserted into a groove formed in the engaging jaw portion of the guide rail, both ends of the ESD PCB having a copper plate are protruded beyond a side surface of a sub-rack and horizontally cross with respect to the parallel guide rails, and a ground cable is connected to both ends of the ESD PCB, respectively.