Patents by Inventor Jae-Wan Sung

Jae-Wan Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180058078
    Abstract: The present invention relates to a flame-retardant decorative flooring material including a lower layer; a base layer; a printed layer; and a transparent layer sequentially from bottom to top, wherein at least any one of the layers includes a polyvinyl acetal resin.
    Type: Application
    Filed: March 30, 2015
    Publication date: March 1, 2018
    Inventors: Hyun Jong KWON, Suk Je SON, Jae Wan SUNG, Jong dae PARK, Kwang Sug Yang, Ung Kil KIM, Jun Young KIM
  • Patent number: 9677286
    Abstract: The present invention relates to a conductive flooring material containing a conductive deformation-preventing layer containing conductive fibers comprising glass fibers and carbon fibers, and to a production method therefor. The present invention can provide a conductive material which is useful not only in the form of tiles but also in the form of long sheets because the conductive fibers comprise glass fiber and carbon fiber impart not only outstanding electrical conductivity but also stable deformation-preventing properties.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: June 13, 2017
    Assignee: LG HAUSYS, LTD.
    Inventors: Kyungtae Ha, Jae Wan Sung, Sung ha Park
  • Publication number: 20170043558
    Abstract: Disclosed are a flame retardant flooring material in which a balance layer forming the main portion of the flooring material is formed of PVB so as to achieve cost reduction and to have flame retardancy, and a method of manufacturing the same. The flame retardant flooring material includes a plain weave layer, a PVB balance layer stacked on the upper surface of the plain weave layer, a dimension reinforcing layer stacked on the upper surface of the PVB balance layer using an adhesive, a printed layer stacked on the upper surface of the dimension reinforcing layer, and a transparent PVC layer stacked on the printed layer.
    Type: Application
    Filed: March 30, 2015
    Publication date: February 16, 2017
    Applicant: LG HAUSYS, LTD.
    Inventors: Sung Ha PARK, Jae Wan SUNG
  • Patent number: 9284425
    Abstract: The present invention provides a resin composition for flooring characterized in that it comprises a PLA resin, a plasticizer, and an acrylate oligomer. Also, the present invention provides a method for manufacturing flooring, comprising the step of processing flooring which includes a sheet-like molded body of the resin composition and manufacturing the sheet-like molded body by processing the resin composition through extrusion or calendaring methods.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: March 15, 2016
    Assignees: LG Hausys, Ltd.
    Inventors: Sang Joon Park, Sung Ha Park, Jae Wan Sung, Jung Seop Lim
  • Publication number: 20150025183
    Abstract: The present invention provides a resin composition for flooring characterized in that it comprises a PLA resin, a plasticizer, and an acrylate oligomer. Also, the present invention provides a method for manufacturing flooring, comprising the step of processing flooring which includes a sheet-like molded body of the resin composition and manufacturing the sheet-like molded body by processing the resin composition through extrusion or calendaring methods.
    Type: Application
    Filed: December 27, 2012
    Publication date: January 22, 2015
    Inventors: Sang Joon Park, Sung Ha Park, Jae Wan Sung, Jung Seop Lim
  • Publication number: 20140227484
    Abstract: Disclosed is anti-slip vinyl flooring that is capable of forming a concavo-convex portion having a thickness of more than a given value on a PVC surface layer of the vinyl flooring, thus effectively preventing slipping thereon and further ensuring a high degree of dimension stability. The anti-slip vinyl flooring according to the present invention is formed by sequentially laminating a PVC surface layer, a PVC base layer, and a backing layer, from the top thereof, wherein a concavo-convex portion having a thickness in the range of 70 ?m to 160 ?m is formed on the PVC surface layer.
    Type: Application
    Filed: September 21, 2011
    Publication date: August 14, 2014
    Applicant: LG HAUSYS, LTD.
    Inventors: Jae Wan Sung, Sung Ha Park, Kyung Tae Ha
  • Publication number: 20140213132
    Abstract: Disclosed is a inlaid type floor sheet having polyvinyl chloride chip and a method of manufacturing thereof. The in-laid type floor sheet having polyvinyl chloride (PVC) chip, includes an inlaid chip layer in which polyvinyl chloride is formed into chips; a UV paint layer which is coated on the inlaid chip layer; and a dimensionally reinforcing layer which is formed of a fabric and pressed on a lower surface of the inlaid chip layer at high temperature. According to the present invention, since the plain weave type dimensionally reinforcing layer is provided at the lower side of the inlaid type floor sheet having polyvinyl chloride chip, it is possible to improve the durability, realize the dimensional stability and balance of the product and increase the adhesive force with the construction floor.
    Type: Application
    Filed: September 5, 2012
    Publication date: July 31, 2014
    Applicant: LG HAUSYS, LTD.
    Inventors: Sung Ha Park, Jae Wan Sung, Dae Jin Kim, Ki Jae Jang
  • Patent number: 8703299
    Abstract: A plywood flooring including a plywood as a substrate, where the plywood is heat-compressive treated in a density of 0.6 to 1.0 g/cm3 and is impregnated with a synthetic resin having a viscosity of 100 to 20,000 cp, which has both of the advantages of reinforced floorboards and the advantages of plywood floorboards.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: April 22, 2014
    Assignee: LG Hausys, Ltd.
    Inventors: Sung-Ha Park, Jae-Wan Sung
  • Publication number: 20130078461
    Abstract: The present invention relates to a PLA flooring material having a fabric surface. The flooring material includes fabrics of a PLA material on the surface thereof, thereby achieving a fabric texture which cannot be obtained by printing in the art, environmental burden in disposal of petroleum resin products, and realizing an environmentally friendly flooring material through application of a PLA resin to a fabric layer, a rear layer and the like of the flooring material. The flooring material further includes a dimension stabilizing layer to improve dimensional stability.
    Type: Application
    Filed: June 3, 2011
    Publication date: March 28, 2013
    Applicant: LG HAUSYS, LTD.
    Inventors: Kyung-Tae Ha, Hyun-Jong Kwon, Jae-Wan Sung, Sung-Ha Park
  • Publication number: 20120070646
    Abstract: The present invention relates to a conductive flooring material containing a conductive deformation-preventing layer containing conductive fibers comprising glass fibers and carbon fibers, and to a production method therefor. The present invention can provide a conductive material which is useful not only in the form of tiles but also in the form of long sheets because the conductive fibers comprise glass fiber and carbon fiber impart not only outstanding electrical conductivity but also stable deformation-preventing properties.
    Type: Application
    Filed: September 7, 2010
    Publication date: March 22, 2012
    Applicant: LG HAUSYS, LTD.
    Inventors: Kyungtae Ha, Jae Wan Sung, Sung ha Park
  • Publication number: 20110162308
    Abstract: The present invention relates to click structure plywood flooring, which has both of the advantages of reinforced floorboards and the advantages of plywood floorboards and the present invention provides plywood flooring of which the plywood is heat-compressive treated and click-shaped.
    Type: Application
    Filed: March 9, 2009
    Publication date: July 7, 2011
    Inventors: Sung-Ha Park, Jae-Wan Sung
  • Publication number: 20090197036
    Abstract: Disclosed is a wood flooring containing laminated wood and high-density fiberboard using a symmetric structure and a process for manufacturing the same. The wood flooring includes a high-density fiberboard core layer and an upper laminated wood layer and lower laminated wood or veneer layer symmetrically stacked about the high-density fiberboard core layer to achieve a stable structure, and the lower laminated wood or veneer layer has a density of 100±30% of that of the upper laminated wood layer to keep the balance therebetween. With this configuration it is possible to completely eliminate deformation problems caused by variation of environmental conditions such as temperature, humidity, etc., and to impart the natural texture of raw lumber and high durability to the flooring surface.
    Type: Application
    Filed: July 25, 2006
    Publication date: August 6, 2009
    Applicant: LG CHEM, LTD.
    Inventors: Sung-chul Hwang, Jae-Wan Sung, Seung-Baik Nam, Seung-Hun Lee, Jong-Bum Kim, Bum-Soo Kim
  • Publication number: 20090049786
    Abstract: Disclosed herein is a low-priced flooring comprising a transfer-printed high-density fiberboard (HDF). According to the flooring, an aqueous primer layer is formed on a high-density fiberboard as a core layer and transfer printing is performed on the surface of the primer layer to form a printed layer so that the background fiber pattern of the high-density fiberboard is covered, the adhesion of the core layer to the printed layer is enhanced, and the natural beauty of wood is faithfully imparted to the surface of the flooring.
    Type: Application
    Filed: October 20, 2006
    Publication date: February 26, 2009
    Applicant: LG CHEM, LTD.
    Inventors: Sung-Chul Hwang, Seung-Baik Nam, Seung-Hun Lee, Jong-Bum Kim, Jae-Wan Sung