Patents by Inventor Jae Weon Shim

Jae Weon Shim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS film for semiconductor device test socket including MEMS bump
    Patent number: 10506714
    Abstract: A microelectromechanical system (MEMS) film for a test socket is arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device and includes a flexible bare film and a plurality of round-type MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: December 10, 2019
    Assignee: Okins Electronics Co., Ltd.
    Inventors: Jin Kook Jun, Sung Gye Park, Jae Weon Shim, Sang Hoon Cha
  • Mems Film for Semiconductor Device Test Socket Including Mems Bump
    Publication number: 20170027056
    Abstract: A microelectromechanical system (MEMS) film for a test socket is arranged between a semiconductor device and a test apparatus for performing an electrical test of the semiconductor device and includes a flexible bare film and a plurality of round-type MEMS bumps on the bare film, each of the MEMS bumps being formed on the bare film by using a MEMS processing technique, having an electrical contact with an electrode pad of the test apparatus or a conductive ball of the semiconductor device, and having a contact surface rounded from an edge side toward a center side in a convex manner in a direction toward the electrode pad or the conductive ball.
    Type: Application
    Filed: October 21, 2015
    Publication date: January 26, 2017
    Inventors: Jin Kook Jun, Sung Gye Park, Jae Weon Shim, Sang Hoon Cha