Abstract: A display device with improved circuit integration of a gate driver, and an electronic device, an optical device, and a vehicle each including the display device are provided. The display device includes: a substrate; a pixel transistor on the substrate; an anode electrode on the pixel transistor and connected to the pixel transistor; a light emitting layer on the anode electrode; a pixel defining film on the light emitting layer; a cathode electrode on the light emitting layer and the pixel defining film; and a gate driver in a non-display area of the substrate and connected to the pixel transistor, wherein the gate driver includes a first transistor and a second transistor on the substrate, and a first gate electrode of the first transistor and a second gate electrode of the second transistor are directly connected to each other.

Abstract: The present invention provides a semiconductor chip delamination apparatus for peeling off a protective film attached to one surface of a semiconductor chip, the apparatus comprising: a stage unit (400) on which a ring frame, having the semiconductor chip to which the protective film is attached, arranged thereon is mounted; and a fluid delamination unit (1000) for discharging and spraying a delamination actuating fluid for peeling off, from the semiconductor chip, at least the protective film arranged on one surface of the semiconductor chip.

Abstract: The present invention provides a semiconductor chip delamination device for peeling off a protective film attached to one surface of a semiconductor chip, including: a stage unit (400) configured to allow a ring frame, in which the semiconductor chip having the protective film attached thereto is disposed, to be seated thereon; a delamination feeding unit (300) configured to feed a delamination seal contactable with the protective film so as to peel off the protective film from the semiconductor chip; a covering unit (500, 600) configured to allow the delamination seal to cover the semiconductor chip such that the delamination seal comes into close contact with the protective film; and a delaminating unit (700) configured to peel off, from the semiconductor chip, the delamination seal disposed to cover the semiconductor chip having the protective film disposed on one surface thereof, and provides a method of controlling the semiconductor chip delamination device.

Abstract: The present invention provides a semiconductor chip delamination apparatus for peeling off a protective film attached to one surface of a semiconductor chip, the apparatus comprising: a stage unit (400) on which a ring frame, having the semiconductor chip to which the protective film is attached, arranged thereon is mounted; and a fluid delamination unit (1000) for discharging and spraying a delamination actuating fluid for peeling off, from the semiconductor chip, at least the protective film arranged on one surface of the semiconductor chip.

Abstract: The present specification provides a method for providing information about a therapeutic response to anticancer immunotherapy, and a kit for providing information by using same, the method comprising: measuring DNA methylation of pDMRs in a biological sample isolated from a subject; and evaluating the therapeutic reaction to anticancer immunotherapy for the subject on the basis of the measured DNA methylation of pDMRs.

Abstract: A golf aiming and address assisting device and a golf address method. The device includes a body attached to a golfer's body; a CPU installed in the body to calculate, compare and process input information; a motion sensor connected to the CPU and including a 3-axis gyroscope sensor and a 3-axis accelerator sensor to measure a current forward orientation value of the golfer, a speaker connected to the CPU to output a sound outwardly from the body; a main button installed to the body to set a target orientation value by a pressing operation of a user; and a battery installed in the body to supply a power to each component.

Abstract: A tire wheel having an air pressure regulator capable of immediately varying the air pressure of a tire of a vehicle in accordance with external environments is disclosed. To regulate the internal air pressure of the tire, the air pressure regulator includes a vacuum chamber, an ultra-high pressure chamber, and a generator for generating electricity to drive the air pressure regulator. The air pressure regulator is actuated by a force generated when the tire is pressed by the ground during the rolling of the tire. An electronic controller collects data obtained by various sensors, and communicates with a central processing unit in a wireless manner. The central processing unit processes the collected data. The driver can monitor all tire states, and can set a control mode associated with the air pressure of the tire. It is possible to deflate the tire in a moment in accordance with the vacuum pressure of the vacuum chamber.

Abstract: A tire wheel having an air pressure regulator capable of immediately varying the air pressure of a tire of a vehicle in accordance with external environments is disclosed. To regulate the internal air pressure of the tire, the air pressure regulator includes a vacuum chamber, an ultra-high pressure chamber, and a generator for generating electricity to drive the air pressure regulator. The air pressure regulator is actuated by a force generated when the tire is pressed by the ground during the rolling of the tire. An electronic controller collects data obtained by various sensors, and communicates with a central processing unit in a wireless manner. The central processing unit processes the collected data. The driver can monitor all tire states, and can set a control mode associated with the air pressure of the tire. It is possible to deflate the tire in a moment in accordance with the vacuum pressure of the vacuum chamber.

Abstract: A substrate for a semiconductor package, a fabrication method for the substrate, thereof and a stacked-type semiconductor package using the substrate, and a method of making the package are disclosed. The substrate includes: an insulator having top and bottom surfaces, there being upper and lower recesses respectively formed in the top and bottom surfaces of the insulator; plural first upper and lower conductive lines respectively formed at least in part on exposed surface of the upper and lower recesses; and plural second upper and lower conductive lines respectively formed at least in part on the top and bottom surfaces and connected with corresponding ones of the first upper and lower conductive lines, respectively, the second upper and lower conductive lines extending outwardly from the upper and lower recesses, respectively.