Patents by Inventor Jae Woo

Jae Woo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935703
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
  • Patent number: 11935876
    Abstract: A light-emitting element ink, a display device, and a method of fabricating the display device are provided. The light-emitting element ink includes a light-emitting element solvent, light-emitting elements dispersed in the light-emitting element solvent, each of the light-emitting elements including a plurality of semiconductor layers and an insulating film that surrounds parts of outer surfaces of the semiconductor layers, and a surfactant dispersed in the light-emitting element solvent, the surfactant including a fluorine-based and/or a silicon-based surfactant.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: March 19, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jun Bo Sim, Duk Ki Kim, Yong Hwi Kim, Hyo Jin Ko, Chang Hee Lee, Chan Woo Joo, Jae Kook Ha, Na Mi Hong
  • Publication number: 20240090328
    Abstract: The present invention relates to a multi-component host material and an organic electroluminescent device comprising the same. By comprising a specific combination of the multi-component host compounds, the organic electroluminescent device according to the present invention can provide high luminous efficiency and excellent lifespan characteristics.
    Type: Application
    Filed: October 26, 2023
    Publication date: March 14, 2024
    Inventors: Hee-Choon AHN, Young-Kwang KIM, Su-Hyun LEE, Ji-Song JUN, Seon-Woo LEE, Chi-Sik KIM, Kyoung-Jin PARK, Nam-Kyun KIM, Kyung-Hoon CHOI, Jae-Hoon SHIM, Young-Jun CHO, Kyung-Joo LEE
  • Publication number: 20240086012
    Abstract: A display device having a touch sensor can include a display panel including a plurality of touch electrodes, and a readout integrated circuit (IC). Also, the readout IC is configured to apply a touch driving signal to the plurality of touch electrodes and amplify charges from the plurality touch electrodes according to an amplifier reset signal to generate an amplifier output voltage, and differentially adjust a toggle timing of the amplifier reset signal based on positions of the plurality of touch electrodes to control a level of the amplifier output voltage.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Applicant: LG Display Co., Ltd.
    Inventors: Hyun Woo JANG, Ki Yong KIM, Jae Kyu PARK, Young Woo JO
  • Publication number: 20240088553
    Abstract: The present invention relates to a signal shielding apparatus and an antenna apparatus including same, and in particular, comprises a shield cover which is stacked and disposed on a printed board assembly (hereinafter, abbreviated to “PBA”), in which a plurality of signal-related components are mounted on one side thereof to prevent leakage of a signal from the plurality of signal-related components, wherein a grooved shield cover seating groove is formed in one surface of the PBA, and an insertion end insertably seated in the shield cover seating groove is integrally formed in the other surface from among one surface and the other surface of the shield cover, the other surface facing the one surface of the PBA, thereby providing advantages in that an increase in the manufacturing cost may be prevented, EMI shielding may be facilitated, and heat dissipation performance may be significantly improved.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Bae Mook JEONG, Kyo Sung JI, Chi Back RYU, Won Jun PARK, Jun Woo YANG, Seong Min AHN, Ki Hun PARK, Jae Eun KIM
  • Publication number: 20240087991
    Abstract: A semiconductor package including a die paddle, a first lead spaced apart from the die paddle and on one side of the die paddle, a second lead spaced apart from the die paddle and on another side of the die paddle, a spacer on the die paddle, a semiconductor die on the spacer, a first wire configured to connect an upper surface of the semiconductor die to the first lead, and a mold film configured to cover the die paddle, the first lead, the second lead, the spacer, the semiconductor die, and the first wire, wherein a first width of the spacer is greater than a second width of the die paddle so that the spacer overlaps the first lead may be provided.
    Type: Application
    Filed: June 30, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jae Hyun LIM, Sung Woo PARK, Hyun Jong MOON, Kwang Jin LEE
  • Publication number: 20240088059
    Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
  • Patent number: 11929262
    Abstract: A stack package and a method of manufacturing the stack package are provided. The method includes: attaching a first semiconductor device onto a first surface of a first package substrate; attaching a molding resin material layer onto a first surface of a second package substrate; arranging the first surface of the first package substrate and the first surface of the second package substrate to face each other; compressing the first package substrate and the second package substrate while reflowing the molding resin material layer; and hardening the reflowed molding resin material layer.
    Type: Grant
    Filed: April 10, 2023
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-in Won, Jong-kak Jang, Dong-woo Kang, Do-yeon Kim
  • Patent number: 11928303
    Abstract: The present disclosure generally relates to user interfaces for managing shared-content sessions. In some embodiments, content is shared with a group of users participating in a shared-content session. In some embodiments, the content is screen-share content that is shared from one device to other participants of the shared-content session. In some embodiments, the content is synchronized content for which output of the content is synchronized across the participants of the shared-content session.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: March 12, 2024
    Assignee: Apple Inc.
    Inventors: Jae Woo Chang, Taylor G. Carrigan, Marcel Van Os, Elliot A. Barer, Kyle William Horn, Kaely Coon
  • Patent number: 11930179
    Abstract: An image encoding/decoding method is provided. An image decoding method of the present invention may comprise deriving an intra-prediction mode of a current luma block, deriving an intra-prediction mode of a current chroma block based on the intra-prediction mode of the current luma block, generating a prediction block of the current chroma block based on the intra-prediction mode of the current chroma block, and the deriving of an intra-prediction mode of a current chroma block may comprise determining whether or not CCLM (Cross-Component Linear Mode) can be performed for the current chroma block.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: March 12, 2024
    Assignees: Electronics and Telecommunications Research Institute, INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNI, CHIPS & MEDIA, INC, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITY
    Inventors: Sung Chang Lim, Jung Won Kang, Ha Hyun Lee, Jin Ho Lee, Hui Yong Kim, Yung Lyul Lee, Ji Yeon Jung, Nam Uk Kim, Myung Jun Kim, Yang Woo Kim, Dae Yeon Kim, Jae Gon Kim, Do Hyeon Park
  • Publication number: 20240081099
    Abstract: An organic light emitting diode display according to an exemplary embodiment includes: a substrate; a first buffer layer on the substrate; a first semiconductor layer on the first buffer layer; a first gate insulating layer on the first semiconductor layer; a first gate electrode and a blocking layer on the first gate insulating layer; a second buffer layer on the first gate electrode; a second semiconductor layer on the second buffer layer; a second gate insulating layer on the second semiconductor layer; and a second gate electrode on the second gate insulating layer.
    Type: Application
    Filed: November 9, 2023
    Publication date: March 7, 2024
    Applicant: Samsung Display Co., Ltd.
    Inventors: Joon Woo BAE, So Young KOO, Han Bit KIM, Thanh Tien NGUYEN, Kyoung Won LEE, Yong Su LEE, Jae Seob LEE, Gyoo Chul JO
  • Publication number: 20240080228
    Abstract: A data receiving device may include a dummy stage block. The dummy stage block may include m dummy stages, wherein m is a natural number greater than or equal to two. Each of the m dummy stages may be configured to remove inter-symbol interference (ISI) from a dummy input signal using dummy coefficient information to generate a dummy output signal free of the ISI. Each of the m dummy stages may be further configured to output the dummy output signal. A normal stage block may include n normal stages, wherein n is a natural number greater than or equal to two. Each of the n normal stages may be configured to remove ISI from an input signal using coefficient information to generate an output signal free of the ISI and may be further configured to output the output signal.
    Type: Application
    Filed: April 13, 2023
    Publication date: March 7, 2024
    Inventors: Jin Ook JUNG, Jae Woo PARK, Myoung Bo KWAK, Young Min KU, Kyoung Jun ROH, Jung Hwan CHOI
  • Publication number: 20240078974
    Abstract: A display device including: a power supply configured to supply a first power, a second power, and a third power to a first power line, a second power line, and a third power line, respectively, wherein each of the first power, the second power and the third power varies in voltage level during one frame period; and pixels connected to at least one of scan lines and data lines, and connected to a common control line, the first power line, the second power line, and the third power line, wherein the pixels simultaneously emit light when the second power is changed to a low level, and a number of times the second power is changed to the low level during the one frame period changes in response to an image refresh rate.
    Type: Application
    Filed: June 6, 2023
    Publication date: March 7, 2024
    Inventors: Hong Soo KIM, Myung Woo LEE, Suk Hun LEE, Jae Keun LIM
  • Publication number: 20240079456
    Abstract: A method of manufacturing a semiconductor device includes: forming a trench in an insulating interlayer by etching the insulating interlayer; forming a conductive layer on bottom, side, and upper surfaces of the insulating interlayer where the trench is formed, using a first deposition process, the conductive layer on the bottom surface of the trench being thicker than the conductive layer on the side surface of the trench; forming a sacrificial layer in the trench covering the conductive layer formed on the bottom surface of the trench using a second deposition process different from the first deposition process; selectively removing the conductive layer formed on the upper surface of the insulating interlayer and formed on the side surface of the trench left exposed through the sacrificial layer; and selectively removing the sacrificial layer, to form a conductive line using the conductive layer remaining on the bottom surface of the trench.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 7, 2024
    Applicant: SK hynix Inc.
    Inventors: Jae Man YOON, Jun Ki KIM, Tae Kyun KIM, Jung Woo PARK, Jae Won HA
  • Publication number: 20240076252
    Abstract: A preparation process of 5-ethylidene-2-norbornene, including: introducing dicyclopentadiene into a dicyclopentadiene decomposition reactor to thermally decompose the dicyclopentadiene; introducing a product of the above step into a cyclopentadiene purification tower; introducing 1,3-butadiene, a solvent, and cyclopentadiene separated from the top of the cyclopentadiene purification tower into a Diels-Alder reactor to react the same; introducing a product of the immediate above step into a 1,3-butadiene removal tower to recover 1,3-butadiene from the top; introducing a mixture at the bottom of the 1,3-butadiene removal tower into a desolvation tower, and recycling a solvent and unreacted raw materials recovered from the top of the desolvation tower to the dicyclopentadiene decomposition reactor; introducing a mixture at the bottom of the desolvation tower into a 5-vinyl-2-norbornene separation tower to separate 5-vinyl-2-norbornene; and introducing the 5-vinyl-2-norbornene into an isomerization reactor to rea
    Type: Application
    Filed: May 26, 2023
    Publication date: March 7, 2024
    Applicant: KOREA KUMHO PETROCHEMICAL CO., LTD.
    Inventors: Young Rok LEE, Jae Woom KIM, Kyoung Ho ROW, Ick Jin AN, Jin Woo PARK, Yu Mi KIM
  • Publication number: 20240078774
    Abstract: An apparatus and a method for editing 3D SLAM data according to an exemplary embodiment of the present disclosure directly edits a key frame or an edge of simultaneous localization and mapping (SLAM) data by the user's manipulation, optimizes a pose graph of the 3D SLAM data based on the key frame and the edge edited by the user's manipulation, and generates a 2D grid map corresponding to the 3D SLAM data based on the updated 3D SLAM data to improve the convenience of the user for editing the 3D SLAM data.
    Type: Application
    Filed: May 11, 2023
    Publication date: March 7, 2024
    Inventors: Seong Ju PARK, Jun Young PARK, Hyun Woo JO, In Hwan KWON, Jae Young LEE
  • Publication number: 20240080385
    Abstract: A method includes, at a computer system with a display and a housing, while a call is ongoing between the computer system and a remote device, detecting a coupling of a case to the computer system, and in response to detecting the coupling of the case to the computer system, in accordance with a determination that the computer system is operating in a first audio mode, continuing the call, and, in accordance with a determination that the computer system is operating in a second audio mode different than the first audio mode, terminating the call.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 7, 2024
    Inventors: Jae Woo Chang, Arian Behzadi, Deena Khattab, Robert Garcia, III, Lauren E. Tappana, Marcel Van Os, Alan C. Dye
  • Publication number: 20240079413
    Abstract: A complementary thin film transistor (TFT) includes a substrate and a first TFT and a second TFT disposed on the substrate, wherein a first conductive semiconductor layer of the first TFT and a second gate electrode layer of the second TFT are disposed in the same layer and include the same material.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 7, 2024
    Inventors: Himchan OH, Jong-Heon YANG, Ji Hun CHOI, Seung Youl KANG, Yong Hae KIM, Jeho NA, Jaehyun MOON, Chan Woo PARK, Sung Haeng CHO, Jae-Eun PI, Chi-Sun HWANG
  • Patent number: 11918632
    Abstract: The present invention provides a method for preventing or treating liver cancer in a subject comprising administrating at least one selected from the group consisting of an Ssu72 peptide, a polynucleotide encoding the Ssu72 peptide and an expression vector containing the polynucleotide to the subject.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: March 5, 2024
    Assignees: CUROGEN TECHNOLOGY CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Chang Woo Lee, Jin Kwan Lee, Hyun Soo Kim, Jae-kyung Kim, Joon Sup Yoon
  • Patent number: D1016837
    Type: Grant
    Filed: July 10, 2023
    Date of Patent: March 5, 2024
    Assignee: Apple Inc.
    Inventors: Jae Woo Chang, Patrick Lee Coffman, Nathan de Vries, Christopher P. Foss, Robert Garcia, III, Heena Ko, Stephen O. Lemay, Marcel van Os