Abstract: Disclosed herein are a distributed cloud system, a data processing method of the distributed cloud system, a storage medium. The data processing method of the distributed cloud system includes running an application of an edge computing system requested by a user device, generating a snapshot image of the application, and storing the generated snapshot image and transmitting the stored image during migration.

Abstract: Disclosed herein is a multi-cloud edge system. The multi-cloud edge system includes a core cloud, a multi-cluster-based first edge node system, and a multi-cluster-based near edge node system, wherein the multi-cluster-based first edge node system includes multiple worker nodes, and a master node including a scheduler.

Abstract: Disclosed is an optical modulator including: a substrate; an insulation layer disposed on the substrate; a ribbon layer, a center portion of which is spaced apart from the insulation layer by a predetermined gap; a piezoelectric element that is disposed on the ribbon layer and allows the center portion of the ribbon layer to bend vertically; and a passivation layer that is disposed on the piezoelectric element and comprises a main passivation film.

Abstract: Disclosed is an optical modulator including: a substrate; an insulation layer disposed on the substrate; a ribbon layer, a center portion of which is spaced apart from the insulation layer by a predetermined gap; a piezoelectric element that is disposed on the ribbon layer and allows the center portion of the ribbon layer to bend vertically; and a passivation layer that is disposed on the piezoelectric element and comprises a main passivation film.

Abstract: A manufacturing method for a MEMS element having a flat surface, comprising: (a) depositing a first layer on a substrate, a center portion of the first layer being spaced-apart from the substrate by a predetermined gap; (b) depositing a second layer on the first layer, the inner stresses in the first and second layers having opposite properties; and (c) heat-treating the first and second layers, so that the inner stresses in them have same properties.

Abstract: A film bulk acoustic resonator (FBAR) includes an insulation layer on a substrate to prevent a signal from being transmitted to a substrate. The FBAR includes a portion of a membrane layer corresponding to an activation area to adjust a resonance frequency band and improve a transmission gain of the resonance frequency band, the portion of the membrane layer being partially etched to have a thickness less than the other portion of the membrane layer. A method of forming the FBAR includes forming an sacrificing layer made of polysilicon, forming an air gap using a dry etching process, and forming a via hole. The method prevents structural problems occurred in a conventional air gap forming process and provides locations and the number of the via holes to be controlled.

Abstract: FBAR device includes a membrane supporting layer between a substrate and a membrane layer, surrounding an air gap region. The membrane supporting layer support the membrane layer to obtain a robust structure. The substrate has a first area and a second area surrounding the first area. The membrane supporting layer is formed on the second area of the substrate so as to form the air gap on the first area of the substrate. The membrane layer is formed on the membrane supporting layer and the air gap. A first electrode is formed on a portion of the membrane layer. A piezoelectric layer is formed on a portion of the first electrode. A second electrode is formed on a portion of the piezoelectric layer.

Abstract: A film bulk acoustic resonator (FBAR) includes an insulation layer on a substrate to prevent a signal from being transmitted to a substrate. The FBAR includes a portion of a membrane layer corresponding to an activation area to adjust a resonance frequency band and improve a transmission gain of the resonance frequency band, the portion of the membrane layer being partially etched to have a thickness less than the other portion of the membrane layer. A method of forming the FBAR includes forming an sacrificing layer made of polysilicon, forming an air gap using a dry etching process, and forming a via hole. The method prevents structural problems occurred in a conventional air gap forming process and provides locations and the number of the via holes to be controlled.

Abstract: The present invention provides a robust FBAR device and a simplified method of fabricating a FBAR device. FBAR device according to the present invention includes a membrane supporting layer between a substrate and a membrane layer, surrounding an air gap region. The membrane supporting layer supports the membrane layer to obtain a robust structure. Firstly, the method forms a sacrificial layer on the substrate, then a photoresist pattern is formed on air gap forming region at a top surface of the sacrificial layer, the method removes the sacrificial layer to form a sacrificial pattern by using the photoresist pattern as an etching mask. An insulating material then deposits on the substrate, the photoresist pattern is remove, and a membrane layer is formed on a top surface of the sacrificial layer and the insulating material layer. Finally, the method removes the sacrificial pattern to form an air gap.

Abstract: The present invention provides a robust FBAR device and a simplified method of fabricating a FBAR device. FBAR device according to the present invention includes a membrane supporting layer between a substrate and a membrane layer, surrounding an air gap region. The membrane supporting layer supports the membrane layer to obtain a robust structure. Firstly, the method forms a sacrificial layer on the substrate, then a photoresist pattern is formed on air gap forming region at a top surface of the sacrificial layer, the method removes the sacrificial layer to form a sacrificial pattern by using the photoresist pattern as an etching mask. An insulating material then deposits on the substrate, the photoresist pattern is remove, and a membrane layer is formed on a top surface of the sacrificial layer and the insulating material layer. Finally, the method removes the sacrificial pattern to form an air gap.

Abstract: The present invention provides a robust FBAR device and a simplified method of fabricating a FBAR device. FBAR device according to the present invention includes a membrane supporting layer between a substrate and a membrane layer, surrounding an air gap region. The membrane supporting layer supports the membrane layer to obtain a robust structure. Firstly, the method forms a sacrificial layer on the substrate, then a photoresist pattern is formed on air gap forming region at a top surface of the sacrificial layer, the method removes the sacrificial layer to form a sacrificial pattern by using the photoresist pattern as an etching mask. An insulating material then deposits on the substrate, the photoresist pattern is remove, and a membrane layer is formed on a top surface of the sacrificial layer and the insulating material layer. Finally, the method removes the sacrificial pattern to form an air gap.