Patents by Inventor Jae Woong WON

Jae Woong WON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12098087
    Abstract: This application relates to a method and system for cutting a brittle body. In one aspect, the method includes preparing a brittle body having a rotary shaft. The method may also include forming a scribing line by irradiating laser on the brittle body along a preset route by using a laser irradiation unit. The method may further include cutting the brittle body by bringing a vibration unit that vibrates at a preset frequency in contact with a first region of the brittle body, which is spaced apart from the scribing line.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: September 24, 2024
    Assignee: Meere Company Inc.
    Inventors: Joon Jung Lee, Jae Woong Won, Dae Sung Park
  • Publication number: 20210317030
    Abstract: This application relates to a method and system for cutting a brittle body. In one aspect the method includes preparing a brittle body having a rotary shaft. The method may also include forming a scribing line by irradiating laser on the brittle body along a preset route by using a laser irradiation unit. The method may further include cutting the brittle body by bringing a vibration unit that vibrates at a preset frequency in contact with a first region of the brittle body, which is spaced apart from the scribing line.
    Type: Application
    Filed: December 11, 2019
    Publication date: October 14, 2021
    Inventors: Joon Jung LEE, Jae Woong WON, Dae Sung PARK