Abstract: A package substrate of a semiconductor package includes conductive lines of a first layer disposed on a first surface of a base layer and conductive lines of a second layer disposed on a second surface of the base layer. An opening hole located between a first remaining portion and a second remaining portion to separate the first and second remaining portions from each other. The first remaining portion is electrically connected to a first conductive line among the conductive lines of the second layer, and the second remaining portion is electrically connected to a second conductive line among the conductive lines of the second layer.

Abstract: A package substrate of a semiconductor package includes conductive lines of a first layer disposed on a first surface of a base layer and conductive lines of a second layer disposed on a second surface of the base layer. An opening hole located between a first remaining portion and a second remaining portion to separate the first and second remaining portions from each other. The first remaining portion is electrically connected to a first conductive line among the conductive lines of the second layer, and the second remaining portion is electrically connected to a second conductive line among the conductive lines of the second layer.

Abstract: A package substrate of a semiconductor package includes conductive lines of a first layer disposed on a first surface of a base layer and conductive lines of a second layer disposed on a second surface of the base layer. An opening hole located between a first remaining portion and a second remaining portion to separate the first and second remaining portions from each other. The first remaining portion is electrically connected to a first conductive line among the conductive lines of the second layer, and the second remaining portion is electrically connected to a second conductive line among the conductive lines of the second layer.

Abstract: The semiconductor package includes a package substrate. The package substrate includes a base layer, a first group of conductive lines disposed on a first surface of the base layer, and a second group of conductive lines disposed on a second surface of the base layer and electrically connected to respective ones of the first group of conductive lines. The package substrate further includes a plating lead line connected to one of the first group of conductive lines.

Abstract: A package substrate of a semiconductor package includes conductive lines of a first layer disposed on a first surface of a base layer and conductive lines of a second layer disposed on a second surface of the base layer. An opening hole located between a first remaining portion and a second remaining portion to separate the first and second remaining portions from each other. The first remaining portion is electrically connected to a first conductive line among the conductive lines of the second layer, and the second remaining portion is electrically connected to a second conductive line among the conductive lines of the second layer.

Abstract: There is provided a method of forming a semiconductor package and a semiconductor package. The semiconductor package includes a package substrate. The package substrate includes a base layer, a first group of conductive lines disposed on a first surface of the base layer, and a second group of conductive lines disposed on a second surface of the base layer and electrically connected to respective ones of the first group of conductive lines. The package substrate further includes a plating lead line connected to one of the first group of conductive lines.

Abstract: A semiconductor package includes a semiconductor chip and a package substrate. The package substrate includes a base layer, a first group of conductive lines disposed on a first surface of the base layer, and a second group of conductive lines disposed on a second surface of the base layer and electrically connected to respective ones of the first group of conductive lines. The package substrate further includes a plating lead line connected to one of the first group of conductive lines, opening holes located between remaining portions of the second group of conductive lines to separate the second group of conductive lines from each other.

Abstract: A semiconductor package may include a substrate having a first surface and a second surface facing away from the first surface, a window defined through a center portion of the substrate, and a plurality of first bond fingers, a plurality of second bond fingers, and a plurality of external electrodes arranged on the second surface; two or more first semiconductor chips each having a plurality of first bonding pads arranged adjacent to edges of the first semiconductor chips, and each of the first semiconductor chips separately attached to the first surface of the substrate in a face-down type position exposing the first bonding pads; and a second semiconductor chip having a plurality of second bonding pads arranged at a center portion of the second semiconductor chip, and attached to each of the first semiconductor chips in a face-down type position exposing the second bonding pads through the window.

Abstract: A semiconductor package may include a substrate having a first surface and a second surface facing away from the first surface, a window defined through a center portion of the substrate, and a plurality of first bond fingers, a plurality of second bond fingers, and a plurality of external electrodes arranged on the second surface; two or more first semiconductor chips each having a plurality of first bonding pads arranged adjacent to edges of the first semiconductor chips, and each of the first semiconductor chips separately attached to the first surface of the substrate in a face-down type position exposing the first bonding pads; and a second semiconductor chip having a plurality of second bonding pads arranged at a center portion of the second semiconductor chip, and attached to each of the first semiconductor chips in a face-down type position exposing the second bonding pads through the window.

Abstract: Package substrates are provided. The package substrate includes a core layer having a first surface defining trench portions and ridge portions between the trench portions, at least one first trace on a bottom surface of each of the trench portions, and second traces on respective ones of top surfaces of the ridge portions. Related methods are also provided.

Abstract: The present invention relates to a method of fabricating an organic photovoltaic device with improved power conversion efficiency by reducing lateral contribution of series resistance between subcells through active area partitioning by introducing a patterned structure of insulating partitioning walls inside the device. According to the method of the present invention, since the lateral contribution of series resistance between the partitioned subcells is minimized and each subcell works independently, there is no interference phenomenon against the current output of each subcells. As such, the function of a charge extraction layer with high conductivity can be maximized. Thus, the method of the present invention can be effectively used in the fabrication and development of a next-generation large area organic thin layer photovoltaic cell device.

Abstract: Organic white-light-emitting blend materials were prepared by light-doping method and electroluminescent devices fabricated using the same, including a transparent substance, translucent electrode, white-light-emitting layer and metal electrode in order, can efficiently control Förster energy transfer in organic light-emitting materials by performing light doping, thus to fabricate a white electroluminescent device using the blend materials which can emit white-light with high efficiency. The white-light-emitting blend materials can be obtained by the light-doping method, in which the energy transfer occurs only between a host which is a donor and each dopant which is an acceptor, while the energy transfers between dopants are efficiently blocked.

Abstract: The present invention relates to a method of fabricating an organic photovoltaic device with improved power conversion efficiency by reducing lateral contribution of series resistance between subcells through active area partitioning by introducing a patterned structure of insulating partitioning walls inside the device. According to the method of the present invention, since the lateral contribution of series resistance between the partitioned subcells is minimized and each subcell works independently, there is no interference phenomenon against the current output of each subcells. As such, the function of a charge extraction layer with high conductivity can be maximized. Thus, the method of the present invention can be effectively used in the fabrication and development of a next-generation large area organic thin layer photovoltaic cell device.

Abstract: There is provided a polymer electroluminescent device, which comprises a transparent substrate, an anode, a polymer emitting layer, a polymer insulating nanolayer and a cathode. The polymer insulating nanolayer having the dielectric constant (?) of less than 3.0 is located between the cathode and the polymer emitting layer. According to the present invention, it is possible to obtain the polymer electroluminescent device showing more improved luminance efficiency.

Abstract: Organic white-light-emitting blend materials were prepared by light-doping method and electroluminescent devices fabricated using the same, including a transparent substance, translucent electrode, white-light-emitting layer and metal electrode in order, can efficiently control Förster energy transfer in organic light-emitting materials by performing light doping, thus to fabricate a white electroluminescent device using the blend materials which can emit white-light with high efficiency. The white-light-emitting blend materials can be obtained by the light-doping method, in which the energy transfer occurs only between a host which is a donor and each dopant which is an acceptor, while the energy transfers between dopants are efficiently blocked.

Abstract: A polymeric electroluminescent device suppresses photo-oxidation and enhances luminous stability and efficiency by using a nanocomposite of a luminescent polymer and metal nanoparticles as its emitting layer.

Abstract: There is provided a polymer electroluminescent device, which comprises a transparent substrate, an anode, a polymer emitting layer, a polymer insulating nanolayer and a cathode. The polymer insulating nanolayer having the dielectric constant (?) of less than 3.0 is located between the cathode and the polymer emitting layer. According to the present invention, it is possible to obtain the polymer electroluminescent device showing more improved luminance efficiency.

Abstract: A polymeric electroluminescent device suppresses photo-oxidation and enhances luminous stability and efficiency by using a nanocomposite of a luminescent polymer and metal nanoparticles as its emitting layer.

Abstract: Organic white-light-emitting blend materials were prepared by light-doping method and electroluminescent devices fabricated using the same, including a transparent substance, translucent electrode, white-light-emitting layer and metal electrode in order, can efficiently control Forster energy transfer in organic light-emitting materials by performing light doping, thus to fabricate a white electroluminescent device using the blend materials which can emit white-light with high efficiency. The white-light-emitting blend materials can be obtained by the light-doping method, in which the energy transfer occurs only between a host which is a donor and each dopant which is an acceptor, while the energy transfers between dopants are efficiently blocked.

Abstract: A diacetylene-based polymer of the following formula (I): wherein, Ar represents a light emitting group. The present invention also provides an electroluminescence device having a structure of anode/luminescent layer/cathode added with a transfer layer and/or a reflection layer, if necessary, in which the luminescent layer is made of the diacetylene-based polymer containing the light emitting group. The polymer of the present invention can be easily blended with a variety of macromolecules for general use.