Patents by Inventor Jae Yeol Choi

Jae Yeol Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10312022
    Abstract: A capacitor includes a capacitor body having upper and lower surfaces and end surfaces connecting the upper and lower surfaces; and an external electrode disposed on a surface of the capacitor body and having a first electrode layer, a second electrode layer, and a third electrode layer. The second electrode layer includes metal and resin and is interposed between the first electrode layer and the third electrode layer, and a portion of the second electrode layer covering the end surface of the capacitor body has a thickness less than that of a portion of the first electrode layer covering the end surface of the capacitor body.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: June 4, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Moon Lee, Myung Jun Park, Hye Jin Jeong, Chung Yeol Lee, Young Sook Lee, Jae Yeol Choi, Hye Young Choi, Byoung Jin Chun
  • Patent number: 10304632
    Abstract: A multilayer ceramic electronic component includes a ceramic body contributing to capacitance formation and including an active region formed by alternately stacking dielectric layers and first and second internal electrodes and, and a protective layer provided on at least one of upper and lower surfaces of the active region; and first and second external electrodes formed on respective ends of the ceramic body, wherein a step portion absorption layer is disposed in at least one of: both end portions of the ceramic body in a length direction or both end portions of the ceramic body in a width direction, and a total thickness of dielectric layers disposed on the same plane as the step portion absorption layer is greater than a thickness of a dielectric layer disposed in another region.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: May 28, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Ho Lee, Jae Yeol Choi, Ki Pyo Hong, Beom Seock Oh
  • Publication number: 20190157003
    Abstract: A capacitor includes a body including dielectric layers and internal electrodes; and external electrodes disposed on the body. The capacitor includes Sn, the Sn having an alpha particle emission rate equal to or less than 0.02 cph/cm2.
    Type: Application
    Filed: July 2, 2018
    Publication date: May 23, 2019
    Inventors: Seon Jae MUN, Jae Yeol CHOI, Seung Heui LEE, Jong Ho LEE, Kyoung Jin CHA
  • Publication number: 20190115153
    Abstract: A multilayer ceramic capacitor includes: a ceramic body having first and second surfaces opposing each other and third and fourth surfaces connecting the first and second surfaces to each other; a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and each having one end exposed to the third or fourth surface; and first and second side margin portions disposed on the first and second surfaces and covering exposed surfaces of the internal electrodes. A dielectric composition contained in the first and second side margin portions is different from a dielectric composition contained in the ceramic body, the first and second side margin portions contain a barium titanate-based base material powder and magnesium (Mg), manganese (Mn), and aluminum (Al) as accessory ingredients, and a content ratio of manganese (Mn) to magnesium (Mg), manganese (Mn), and aluminum (Al) satisfies 0.316?Mn/(Mn+Mg+Al)?0.
    Type: Application
    Filed: April 10, 2018
    Publication date: April 18, 2019
    Inventors: Jae Sung PARK, Jong Han KIM, Jin Seong KIM, Jeong Yun PARK, Jae Yeol CHOI, Sea Han Na DOO
  • Patent number: 10262795
    Abstract: A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately disposed. Ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers. Additionally, in some examples, spaces between adjacent internal electrodes are fully occupied by the dielectric layers and the dielectric layers contain a ceramic-metal compound containing metal particle. The ceramic-metal compound layer may have an embossing type configuration or a dendrite type configuration.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: April 16, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hong Seok Kim, Chung Eun Lee, Doo Young Kim, Ki Han Kim, Ji Ye Choi, Kyung Ryul Lee, Jae Yeol Choi, Soo Kyong Jo
  • Patent number: 10256043
    Abstract: A multilayer ceramic electronic component includes a ceramic body and first and second external electrodes. The ceramic body includes an active region including a plurality of dielectric layers and first and second internal electrodes alternately disposed on surfaces of the plurality of dielectric layers to contribute to capacitance formation, and a protective layer provided on at least one of upper and lower surfaces of the active region. The first and second external electrodes are electrically connected to the first and second internal electrodes, respectively, and formed on both end surfaces of the ceramic body. The ceramic body includes a plurality of first and second dummy electrodes respectively extended from the second and first external electrodes into length-direction margin parts of the active region so as to face the first and second internal electrodes, respectively. Further, step portion absorbing layers are disposed in width-direction margin parts of the active region.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: April 9, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: You Na Kim, Jae Yeol Choi, Ki Pyo Hong, Jong Ho Lee
  • Patent number: 10249438
    Abstract: A multilayer ceramic capacitor includes a ceramic body in which a plurality of dielectric layers are layered in a width direction, an active part including a plurality of first and second internal electrodes alternately exposed to opposing end surfaces of the ceramic body with the dielectric layer interposed therebetween to form capacitance, an upper cover part provided on an upper surface of the active part, a lower cover part provided on a lower surface of the active part and having a thickness greater than that of the upper cover part, and first and second external electrodes formed to cover opposing end surfaces of the ceramic body, wherein a ratio of the cube root of the volume of the active part to the thickness of the lower cover part is between 1.4 and 8.8.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: April 2, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Man Su Byun, Young Ghyu Ahn, Ho Yoon Kim, Jae Yeol Choi, Soo Hwan Son
  • Publication number: 20190066901
    Abstract: An electronic component includes a magnetic body, and a coil pattern embedded in the magnetic body and including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body. A thickness of each of the lead parts is formed to be thinner than a thickness of each of the internal coil parts.
    Type: Application
    Filed: October 25, 2018
    Publication date: February 28, 2019
    Inventors: Dong Jin JEONG, Jae Yeol CHOI
  • Publication number: 20190066923
    Abstract: A capacitor component includes a body including first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween to be exposed to the third and fourth surfaces of the body, respectively; first and second conductive layers covering the third and fourth surfaces and connected to the first and second internal electrodes, respectively; first and second insulating layers covering the first and second conductive layers, respectively; first and second band portions spaced apart from each other on the second surface of the body; first and second external electrodes covering a portion of the first and second band portions and the first insulating layer, respectively; and third and fourth external electrodes covering a portion of the first and second insulating layers and a portion of the first surface of the body, respectively; and a method of manufacturing the same.
    Type: Application
    Filed: April 23, 2018
    Publication date: February 28, 2019
    Inventors: Jin Man JUNG, Jin Kyung JOO, Ik Hwan CHANG, Byeong Chan KWON, Ji Hyun PARK, Do Heung NA, Jae Yeol CHOI, Sung Hyun CHO
  • Patent number: 10199154
    Abstract: A coil component and a method of manufacturing the coil component are provided. The coil component includes a coil part, a body, and an electrode. The coil part includes a support member, a first coil layer disposed on one surface of the support member, and a second coil layer disposed on the first coil layer. The body includes a magnetic material covering the coil part. The electrode is disposed on the body and is connected to the coil part. The first and second coil layers may each include an insulating layer having a pattern in a planar coil shape and a conductor layer disposed in the pattern and including a seed layer and a plating layer. Additionally, seed layers of the first and second coil layers may be disposed differently in the conductor layers of the first and second coil layers.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: February 5, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seok Il Hong, Jae Yeol Choi, Jong Bong Lim, Ju Hwan Yang
  • Patent number: 10192672
    Abstract: A coil component includes a substrate and a coil pattern disposed on the substrate. The coil pattern includes a vertical region having a side surface perpendicular with respect to the substrate and a tapered region connected to the vertical region and having a side surface inclined with respect to the substrate.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: January 29, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Jong Bong Lim, Seok Il Hong, Jae Yeol Choi, Hai Joon Lee
  • Patent number: 10186380
    Abstract: A capacitor component includes a body, a plurality of internal electrodes disposed in the body, connection electrodes extended in a thickness direction of the body and electrically connected to the plurality of internal electrodes, upper electrodes disposed on an upper surface of the body and electrically connected to the connection electrodes, and lower electrodes disposed on a lower surface of the body and electrically connected to the connection electrodes A thickness of the upper electrodes is different from that of the lower electrodes, and an area of contact between the upper electrodes and the body is different from an area of contact between the lower electrodes and the body.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: January 22, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Taek Jung Lee, Hyo Youn Lee, Won Young Lee, Sung Kwon An, Jae Yeol Choi, Jin Kyung Joo
  • Patent number: 10186367
    Abstract: An electronic component includes a body having a bottom surface provided as a mounting surface, a top surface opposing the bottom surface, first and second side surfaces opposing each other in a width direction, and third and fourth end surfaces opposing each other in a length direction, a conductor part disposed therein, first and second external electrodes spaced apart from each other on the bottom surface of the body and connected to the conductor part, and a first insulating coating layer on the top surface of the body and a second insulating coating layer on the bottom surface of the body.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: January 22, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Wook Lee, Jae Yeol Choi, Sung Kwon Oh, Min Sung Choi, Ji Hea Kim
  • Patent number: 10187994
    Abstract: A capacitor includes a body, first and second external electrodes, and first and second auxiliary external electrodes. The body includes first and second internal electrodes each having first and second lead portions exposed to one surface of the body. The first and second external electrodes are disposed on the one surface of the body and electrically connected to the first and second internal electrodes, respectively. The first and second auxiliary external electrodes are electrically connected to the first and second external electrodes, respectively, and cover portions of surfaces of the body connected to the one surface of the body.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: January 22, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Su Youn You, Jae Yeol Choi, Hyun Hee Gu, Byoung Jin Chun
  • Patent number: 10181380
    Abstract: A multilayer electronic component includes a body, first and second external electrodes, and first and second side parts. The body includes a multilayer structure in which first and second internal electrode patterns are alternately stacked and contains a dielectric material. The first and second side parts are disposed on outer surfaces of the body to face each other. The first and second external electrodes are disposed on outer surfaces of the body to face each other. The first internal electrode patterns are exposed to a third surface and a fifth surface of the body on which the first external electrode and the first side part are disposed, respectively. Additionally, the second internal electrode patterns are exposed to a fourth surface and a sixth surface of the body on which the second external electrode and the second side part are disposed, respectively.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: January 15, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Min Hong, Jae Yeol Choi, Ki Pyo Hong
  • Patent number: 10170245
    Abstract: Disclosed herein is a multilayer capacitor comprising: a laminate in which a plurality of first sheets and second sheets are alternately laminated, wherein the first sheets and the second sheets are disposed in a direction perpendicular to a mounting surface; a first inner electrode formed on the first sheets, wherein the first electrode is exposed through upper, lower, and first lateral surfaces of the laminate; a second inner electrode that is formed on the second sheets and has a horizontally symmetrical shape with respect to the first inner electrode; a sealing portion encapsulating the first and second inner electrodes exposed through two lateral surfaces of the laminate; and an external electrode that is electrically connected to the first and second inner electrodes exposed through the upper and lower surfaces of the laminate.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: January 1, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hae Suk Chung, Jae Yeol Choi, Hyun Woo Kim, Dong Su Cho
  • Publication number: 20180350521
    Abstract: A multilayer ceramic capacitor includes a capacitor body including a plurality of first to third internal electrodes. The first internal electrodes have opposing ends exposed at third and fourth surfaces of the capacitor body. The second internal electrodes have a portion exposed at either of fifth or sixth surfaces of the capacitor body. The third internal electrodes have portions respectively exposed at the fifth and sixth surfaces. First and second external electrodes are on the third and fourth surfaces, respectively, and are connected to the first internal electrodes. Third and fourth external electrodes are on the fifth and sixth surfaces, respectively, and are connected to the second and third internal electrodes.
    Type: Application
    Filed: December 5, 2017
    Publication date: December 6, 2018
    Inventors: Beom Seock OH, Jin Yung Ryu, Young Ghyu Ahn, Jae Yeol Choi
  • Patent number: 10141097
    Abstract: An electronic component includes a magnetic body, and a coil pattern embedded in the magnetic body and including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body. A thickness of each of the lead parts is formed to be thinner than a thickness of each of the internal coil parts.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: November 27, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jin Jeong, Jae Yeol Choi
  • Publication number: 20180323010
    Abstract: A multilayer electronic component includes a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween. One end of each of the first and second internal electrodes extends, respectively, to a third or fourth surface of the capacitor body. First and second external electrodes respectively include first and second connected portions disposed on the third and fourth surfaces, and first and second band portions respectively extended from the first and second connected portions to portions of a first surface of the capacitor body. A first connection terminal is disposed on the first band portion to provide a first solder accommodating portion, and a second connection terminal is disposed on the second band portion to provide a second solder accommodating portion.
    Type: Application
    Filed: November 13, 2017
    Publication date: November 8, 2018
    Inventors: Heung Kil PARK, Jae Yeol CHOI, Young Ghyu AHN, Soo Hwan SON, Se Hun PARK, Gu Won JI
  • Publication number: 20180286569
    Abstract: A coil component assembly includes a support member, a plurality of processed spaces penetrating through the support member, a plurality of coils disposed in the plurality of processed spaces, respectively, and a magnetic material covering the support member and the plurality of coils. The coil component assembly can be diced to form individually coil components.
    Type: Application
    Filed: June 5, 2018
    Publication date: October 4, 2018
    Inventors: Jin Mo AHN, Yun Suk OH, Jae Yeol CHOI