Abstract: Embodiments of the invention relate generally to semiconductor device fabrication and processes, and more particularly, to an apparatus and a system for implementing arrangements of magnetic field generators configured to facilitate physical vapor deposition (“PVD”) and/or controlling impedance matching associated with a non-metal-based plasma used to modify a non-metal film, such as a chalcogenide-based film.

Abstract: Embodiments of the invention relate generally to semiconductor device fabrication and processes, and more particularly, to methods for implementing arrangements of magnetic field generators configured to facilitate physical vapor deposition (“PVD”) and/or for controlling impedance matching associated with a non-metal-based plasma used to modify a non-metal film, such as a chalcogenide-based film.

Abstract: A photoresist-coating apparatus includes a substrate on which a particle-detecting area and an invalid particle-detecting area are defined, a nozzle discharging photoresist to the substrate and moving along a direction, and a particle-detecting sensor controlling on and off of the nozzle in the particle-detecting area according to presence of particles, wherein in the invalid particle-detecting area, the nozzle operates independently from detection of the particle-detecting sensor.

Abstract: A unit block for a core using soft magnetic metal powder, a core having excellent high-current DC bias characteristics using the unit block, and a method of producing the core are disclosed. The unit block is used to produce cores applied to an active filter for PFC, a three-phase line reactor, or an inductor for automotive electronics. A method of producing the core comprises mixing sendust alloy, High Flux, MPP, or silicon steel powders, which have an average particle size of 175 gm or less, with a solid lubricant; compacting a mixture at a pressure of 10-18 tons per unit area; heat-treating the compacted mixture at 600-800° C. for 1-2 hours to form the unit blocks each having a length of 3-10 cm, a width of 1-5 cm, and a height of 1-5 cm; and attaching the unit blocks using a heat- and fire-resistant adhesive.

Abstract: A sputtering target assembly includes a backing plate of which both surfaces are evenly formed and a target having one surface that is evenly formed and attached to one surface of the backing plate and the other surface that is formed with different thicknesses according to a location thereof.

Abstract: A sputtering target assembly includes a backing plate of which both surfaces are evenly formed and a target having one surface that is evenly formed and attached to one surface of the backing plate and the other surface that is formed with different thicknesses according to a location thereof.